Wafer Preparation PDF

WAFER PREPARATION EEXN01E - IC TEST AND MEASUREMENT Engr. Ram Yuri C. Año Part-Time Lecturer, College of Engineering, COECSA, LPU Cavite Product Engineer, Analog Devices Inc., Philippines REVIEW OF INTEGRATED CIRCUIT Integrated Circuit – is a complex set of electronic components and their inte...

WAFER PREPARATION EEXN01E - IC TEST AND MEASUREMENT Engr. Ram Yuri C. Año Part-Time Lecturer, College of Engineering, COECSA, LPU Cavite Product Engineer, Analog Devices Inc., Philippines REVIEW OF INTEGRATED CIRCUIT Integrated Circuit – is a complex set of electronic components and their interconnections that are etched or imprinted onto a tiny slice of monocrystalline semiconducting material. REVIEW OF INTEGRATED CIRCUIT REVIEW OF INTEGRATED CIRCUIT REVIEW OF INTEGRATED CIRCUIT REVIEW OF INTEGRATED CIRCUIT REVIEW OF INTEGRATED CIRCUIT IC MANUFACTURING PROCESS 1. Wafer Preparation 2. Wafer Fabrication 3. Wafersort 4. Integrated Circuit Assembly 5. Final Test WAFER PREPARATION This process prepares the main material for Integrated Circuit → silicon wafer. Note: Silicon is the second most abundant element on earth (next to Oxygen) MONOCRYSTALLINE VS. POLYCRYSTALLINE Crystal – a solid material in which the atoms are arranged in a symmetrical pattern called lattice. TWO TYPES OF CRYSTALS 1. Monocrystalline - consists of silicon in which the crystal lattice of the entire solid is continuous, unbroken (with no grain boundaries) to its edges. 2. Polycrystalline – has characteristics that are opposite of that of monocrystalline. SUBPROCESSES OF WAFER PREPARATION 1. Zone Refining 2. Czochralski Pulling Technique 3. Ingot Surface Grinding 4. Ingot Slicing 5. Wafer Scrubbing 6. Wafer Rinsing 7. Wafer Final Polish 8. Resistivity Check and Inspection ZONE REFINING Also known as zone melting and floating zone process. A narrow region of a crystal is molten, and this molten zone is moved along the crystal. The molten region melts impure solid at its forward edge and leaves a wake of purer material solidified behind it as it moves through the ingot. ZONE REFINING Czochralski Pulling Technique A method of crystal growth used to obtain monocrystalline semiconductors. The process is named after Polish scientist Jan Czochralski, who discovered the method in 1916 while investigating the crystallization rates of metals. Czochralski Pulling Technique GRINDING AND SLICING INGOT SURFACE GRINDING INGOT SLICING In this process, the shiny but In this process, a curved rippled surface of the crystal diamond edged blade saws is being ground to form the ingot to form wafers as smooth and uniform ingots thin as possible without becoming too fragile to handle SUMMARY OF WAFER PREPARATION SUMMARY OF WAFER PREPARATION WAFER CLEANING AND POLISHING ❑ Wafer Scrubbing - wafers are ground on both sides to retain constant flatness and thickness from wafer to wafer. ❑ Wafer Rinsing - wafers are rinsed and etched with chemicals to remove surface contaminations ❑ Wafer Final Polishing – done on only one side of the wafer. Mirror-like luster is the indication that the wafer is free from contaminants ❑ Resistivity Check and Inspection ASSIGNMENT Do a research paper about Integrated Circuit (IC) ▪ History ▪ Package Types ▪ Example of an IC (any manufacturer) ▪Discuss its application ▪Advantages of using that IC END OF PRESENTATION