Occupational Health and Safety (OHS) Standards Reviewer PDF

▪ Leather gloves 2 N D SEMESTER - HARDWARE (protection from REVIEWER: mechanical hazards) o Applications: Handling sharp Occupational Hea...

▪ Leather gloves 2 N D SEMESTER - HARDWARE (protection from REVIEWER: mechanical hazards) o Applications: Handling sharp Occupational Health and Safety (OHS) tools, exposure to chemicals, Standards Reviewer or electrical work. 2. Eye Protection Occupational Health and Safety (OHS) is a o Purpose: Safeguard eyes from vital framework aimed at ensuring the well- flying debris, chemical being, safety, and protection of workers in splashes, or harmful radiation. various environments. Below is a detailed o Types: summary of the key components related to ▪ Safety goggles (full OHS standards. eye coverage) ▪ Face shields (extended face and eye protection) Overview of OHS Standards in CSS o Applications: Cutting, grinding, soldering, or The implementation of OHS standards in handling hazardous Computer System Servicing (CSS) or similar substances. fields ensures that individuals working in 3. Hearing Protection environments with potential hazards are o Purpose: Prevent hearing adequately protected. These standards damage caused by prolonged encompass the proper use of personal exposure to loud noise. protective equipment (PPE), adherence to o Types: safety protocols, and maintenance of hazard- ▪ Earplugs (insertion free workplaces. into the ear canal) ▪ Earmuffs (covering the entire ear) o Applications: Operating Essential Protective Equipment and Their machinery, working in Functions construction zones, or exposure to high-decibel 1. Gloves environments. o Purpose: Protect hands from 4. Anti-static Equipment injuries such as cuts, o Purpose: Prevent electrostatic abrasions, or chemical burns. discharge (ESD) that can o Types: damage sensitive electronic ▪ Nitrile gloves components. (chemical resistance) o Types: ▪ Latex gloves (flexibility ▪ Anti-static wrist straps and sensitivity) ▪ Anti-static mats ▪ Grounding devices  o Applications: Servicing o Identifying and evaluating computer hardware, potential workplace hazards. assembling electronics, or o Implementing measures to working with flammable mitigate risks. materials. 2. Safety Training: 5. Foot Protection o Educating workers on proper o Purpose: Shield feet from use of PPE and safety injuries such as punctures, protocols. impacts, or slips. o Conducting regular drills and o Types: refreshers to ensure ▪ Steel-toe boots preparedness. (protection from heavy 3. Workplace Maintenance: objects) o Keeping the environment ▪ Anti-slip footwear clean, organized, and free of (traction on wet unnecessary hazards. surfaces) o Ensuring equipment is well- ▪ Electrical hazard boots maintained and inspected (insulation from regularly. electricity) 4. Emergency Preparedness: o Applications: Warehousing, o Establishing clear procedures construction, or electrical for fire, medical emergencies, maintenance. and other crises. 6. Face Masks or Respirators o Ensuring access to first aid o Purpose: Protect respiratory kits, fire extinguishers, and health by filtering harmful evacuation plans. particles, fumes, or infectious 5. Legal Compliance: agents. o Adhering to government- o Types: mandated OHS regulations ▪ Disposable masks and standards. (basic protection) o Documenting compliance ▪ N95 respirators (high activities for audits and filtration efficiency) inspections. ▪ Powered Air-Purifying Respirators (PAPRs) o Applications: Working in dusty environments, dealing with Applications in Computer System Servicing hazardous fumes, or during (CSS) pandemics. The CSS field often involves tasks that expose workers to potential electrical, physical, and chemical hazards. Key practices include: Core Principles of OHS Standards Ensuring proper grounding when 1. Risk Assessment: handling hardware.  Wearing anti-static gear during o Coordinates the data flow electronic assembly or repair. between CPU components. Using gloves and masks when dealing 2. Arithmetic Logic Unit (ALU): with chemicals like cleaning agents. o Performs arithmetic Following ergonomic practices to operations (e.g., addition, prevent musculoskeletal disorders. subtraction). o Executes logical operations What is the CPU? (e.g., AND, OR, NOT). 3. Registers: The CPU (Central Processing Unit) is o Temporary, high-speed the "brain" of the computer. storage within the CPU. Primary Functions: o Holds data and instructions o Interpreting and executing during processing. instructions. 4. Cache: o Acting as the main control o High-speed memory within unit for the system. the CPU. Importance: o Stores frequently accessed o Determines the computer’s data to reduce latency. speed and efficiency. 5. Clock: o Serves as the hub for o Synchronizes CPU operations hardware and software by generating regular pulses. operations. o Defines the number of cycles the CPU performs per second. Computer Architecture 6. Buses: Refers to the design of a computer o Electrical pathways for data system. transmission. o Types: Von Neumann Architecture: ▪ Data bus: Transfers o A foundational design used by modern computers. actual data. ▪ Address bus: Transfers o Consists of components like the CPU, main memory, input, information about and output devices. where data should go. Components of the CPU The Fetch-Execute Cycle 1. Control Unit (CU): The process by which the CPU executes o Directs operations within the instructions: CPU. o Manages the fetch-decode- 1. Fetch: execute cycle. o Retrieves the instruction from main memory.  2. Decode: Structure: Stored on modules o Interprets the fetched called DIMMs (Dual Inline Memory instruction to understand the Modules). operation. 3. Execute: o Performs the specified operation. Types of RAM Modules 1. DIMM (Dual Inline Memory Detailed Functionality of CPU Module): o Common in desktops. Components o Available in multiple pin Component Function configurations: 168, 184, 240, and 288. Temporary, high-speed data Registers 2. SODIMM (Small Outline DIMM): storage. o Compact design for laptops Decodes instructions and Control Unit coordinates CPU and small devices. components. o Fewer pins and smaller size Executes arithmetic and compared to DIMM. ALU 3. LODIMM (Long Outline DIMM): logical operations. o Larger modules for Regulates the timing and Clock synchronization of desktops and high- operations. performance systems. Facilitates data transfer o Ideal for devices with more Buses space and greater between CPU components. performance needs. What is RAM? Definition: Random Access Key RAM Features Memory (RAM) is hardware that provides temporary storage for 1. Clockspeed: the operating system (OS), o Base speed of memory software programs, and data in chips. use. o Measured as "MT/s" Purpose: Ensures quick (Million Transfers per accessibility for the processor, Second), typically double enhancing system performance. the clock speed due to DDR technology. 2. Frequency:  o Operational speed of Generations of DDR RAM memory, tied to the system clock. 1. DDR1 (2000): 3. Capacity: o Data rates: 200–400 MT/s. o Maximum size per module. o Voltage: 2.5V. o DDR5 supports up to 128GB o Early adoption in desktops per module, offering the and servers. highest capacity. 2. DDR2 (2003): o Data rates: 400–800 MT/s. o Voltage: 1.8V. o Faster and more power- Types of SDRAM (Synchronous efficient than DDR1. DRAM) 3. DDR3 (2007): o Data rates: 800–2133 MT/s. 1. FPM DRAM (Fast Page Mode o Voltage: 1.5V. DRAM): o Higher bandwidth and o Improved consecutive lower power usage. memory location access. o Standard for PCs in the o Clock speeds: 50 MHz to 2010s. 100 MHz. 4. DDR4 (2017): o Key limitation: o Data rates: 1600–3200 Asynchronous operation. MT/s. 2. EDO DRAM (Extended Data Out o Voltage: 1.2V. DRAM): o Enhanced memory density o Enhanced FPM with and error correction. concurrent read/write o Prefetch width: 16-bit. capabilities. 5. DDR5 (2020): o Operates at 50 MHz to 133 o Data rates: 4800–8400 MHz. MT/s. o Remains asynchronous but o Voltage: 1.1V. faster than FPM. o Prefetch width: 32-bit. 3. SDRAM (Synchronous DRAM): o Increased capacity (up to o Fully synchronized with the 128GB per DIMM). system clock. o On-die Power Management o Speeds: 66 MHz to 133 IC (PMIC) for efficiency. MHz. o Pipelined architecture for parallel operations. Comparison of SDRAM Technologies  Clock Key 1. Central Processing Unit (CPU) Type Speed Socket: Synchronization Advantage o The CPU is installed into the Sequential 50– FPM motherboard via this Asynchronous memory 100 DRAM socket. access MHz o Examples: AMD’s 50– EDO Concurrent AM4/AM5 or Intel’s Asynchronous 133 DRAM read/write LGA1200/LGA1700. MHz 2. Chipsets: Parallel o Manages communication 66– operations between the CPU and other SDRAM Synchronous 133 via motherboard components. MHz pipelining o Split into Northbridge and Motherboard Platforms: AMD and Southbridge (explained Intel below). 3. Northbridge: The motherboard is the backbone of a o Located near the CPU and computer system, connecting all its directly connected to it. components. AMD and Intel are the two o Responsible for high-speed primary platforms in this space. components like: ▪ RAM (memory). ▪ GPU (graphics card). 4. Southbridge: Chipset o Also known as the I/O Controller Hub (ICH). Definition: A collection of electronic o Handles low-speed components that manage data flow components, including: between critical parts of the computer ▪ Storage (SATA, such as the CPU, GPU, RAM, storage, and peripherals. NVMe). Key Functions: Enables the ▪ USB and I/O functioning of the computer system peripherals. by coordinating communication. ▪ Audio and networking interfaces. 5. Memory Slots (DIMM Slots): Motherboard Components o Hold the system’s RAM modules. The motherboard contains several o Support different types of essential components, which can be RAM, such as DDR4 or divided into the following categories: DDR5. 6. PCIe Slots: o Powers the BIOS/UEFI o Used to install expansion settings when the computer cards like: is turned off. ▪ GPUs (Graphics o Keeps the system clock Processing Units). running. ▪ Sound cards. 13. Integrated Graphics Output: ▪ Network cards. o Ports for connecting o PCIe versions include PCIe monitors if the CPU 3.0, 4.0, and the latest 5.0. includes integrated 7. Storage Connectors: graphics (e.g., HDMI, VGA, o SATA Ports: For traditional or DisplayPort). hard drives and SSDs. o M.2 Slots: For high-speed NVMe SSDs. 8. BIOS/UEFI Chip: Modern Motherboards o Stores the firmware that In modern systems: initializes hardware during o Northbridge functionality is startup and provides integrated into the CPU. system settings. o Southbridge is still present but 9. Power Connectors: is now connected to the CPU. o 24-pin ATX Power These advancements lead to better Connector: Supplies power performance and reduced latency. to the motherboard. o 8-pin/4-pin CPU Power Connector: Supplies power AMD Processors specifically to the CPU. 10. I/O Ports: Advanced Micro Devices (AMD) is known o External connectors for for: peripherals, such as: ▪ USB ports. Designing processors (CPUs) and ▪ HDMI/DisplayPort graphics technologies. Key product families include Ryzen for integrated and Athlon processors. graphics. ▪ Ethernet port. AMD Chipsets ▪ Audio jacks. 11. Cooling and Fan Headers: 1. AM4 Chipsets: o Connectors for cooling o Models: A320, B350, B450, solutions, such as CPU X370, X470, X570. coolers and case fans. o Supports Ryzen and Athlon 12. CMOS Battery: processors.  2. AM5 Chipsets: Key Differences Between AMD and o Models: B650, B650E, X670, Intel Chipsets X670E. o Supports Ryzen 7000 and 1. Overclocking Support : 9000 series processors. o AMD: Overclocking is 3. Threadripper Chipsets: supported on most chipsets. o Designed for high-end o Intel: Limited to Z-series desktop (HEDT) systems. chipsets only. o Models: X399, TRX40, WRX80. 2. Memory Support: o AMD: Generally supports higher memory speeds and Intel Processors better scalability, especially with DDR5 in recent models. Intel Corporation provides chipsets for: o Intel: Focuses on compatibility and stability, with DDR5 Consumer desktops, workstations, becoming mainstream in and servers. newer series. Chipsets support specific CPU 3. PCIe Lanes: generations and unlock features like o AMD: Leads in PCIe lane overclocking, faster storage, and availability, particularly in more PCIe lanes. high-end and HEDT platforms (PCIe 4.0/5.0). Intel Chipsets o Intel: Emphasizes integrating PCIe 5.0 in its latest chipsets. 1. Intel 300 Series: o Models: Z390, Z370, B360, H310. o Oldest generation of chipsets. 2. Intel 400 Series: o Models: Z490, H470, B460, H410. 3. Intel 500 Series: o Models: Z590, H570, B560, H510. 4. Intel 600 Series: o Models: Z690, H670, B660, H610. 5. Intel 700 Series: o Models: Z790, H770, B760. o Latest generation supporting modern processors.