Advanced Semiconductor Manufacturing Techniques

To improve the uniformity of the deposited layers (correct)

To increase the adhesion of the deposited layers

To enhance the temperature control during deposition

To prevent unwanted chemical reactions

Triggering a chemical reaction to deposit a thin film on the substrate (correct)

Acting as a cleaning agent before deposition

Enhancing adhesion between the film and the substrate

Increasing the temperature to facilitate deposition

DOF increases with increasing wavelength (correct)

DOF varies inversely with wavelength

DOF is independent of wavelength

DOF decreases with increasing wavelength

<p>Dry etch uses gases to remove material while wet etch uses liquid chemicals</p> Signup and view all the answers

<p>Step coverage refers to the even coating of a raised feature with a thin film; challenges include void formation and non-uniform thickness</p> Signup and view all the answers