V02_Microfluidic Chips Process Technologies Quiz

SU-8 resist layer thickness above 10 µm were not possible in the past.

Soft lithography with PDMS involves the transfer of stamp structures to surfaces by etching.

One of the drawbacks of SU-8 is its resistance to chemicals.

PDMS is known for its toxic properties.

In soft lithography with PDMS, the general principle involves the manufacturing of rigid PDMS stamps.

Cross-linking of epoxy groups during PEB in SU-8 photoresist occurs below the glass temperature.

SU-8 is commonly used in molding technology with soft silicone PDMS.

The softbake step involves heating the substrate at high temperatures to ensure uniformity of the SU-8 layer.

The alignment process is not crucial when transferring the desired pattern onto SU-8 coated substrate.

SU-8 is resistant to most solvents, making it ideal for applications where chemical stability is crucial.

PDMS stands for Poly-Dimethylsilicone and is a bonding technology used in microfluidic chips.

SU-8 has no drawbacks and is considered a perfect photoresist material for microfluidic chip fabrication.

During the post-exposure bake (PEB) step, the exposed SU-8 is further cured at a lower temperature.

The developer solution used to dissolve unexposed SU-8 is typically an aqueous solution.

In positive photoresist like AZ-Novolack, the exposed areas are cross-linked during the PEB.

SU-8 is advantageous in microfabrication due to its low resolution capabilities.

One of the drawbacks of SU-8 as a photoresist is its poor adhesion to substrates.

Soft lithography with PDMS can be used for bonding technologies in microfabrication processes.