Electronics Manufacturing Technologies Quiz

The traditional PCB assembly process, where components with leads are inserted into holes drilled through the PCB and soldered on the other side.

A type of through-hole IC package where pins are arranged on opposite sides of the device in two parallel rows.

The spacing between the pins on a DIL package.

The width of the DIL package, measured perpendicular to the pin rows.

A manufacturing technique used to produce electronic components or assemblies, where components are mounted directly onto the surface of a printed circuit board (PCB), eliminating the need for through-hole components and assembly.

A type of integrated circuit (IC) package that has its pins arranged in a square grid around the chip.

A type of surface mount technology (SMT) package that uses a grid of solder balls located on the bottom of the chip to connect it to the printed circuit board (PCB).

A formula used to estimate the number of pins needed for an IC package based on the number of transistors in the chip.

Components that provide a path for current to flow, including resistors, capacitors, and inductors.

Components that actively control current flow, including diodes, transistors, and integrated circuits.

The use of a machine to pick and place components onto a printed circuit board (PCB).

A type of surface-mount IC package with pins arranged in two parallel rows on opposite sides.

The technology used to manufacture the IC package, determining its shape and pin arrangement.

A small, rectangular IC package with pins on all four sides.

An SMT package with solder balls on the bottom for connecting to the PCB.

A machine that automatically picks and places electronic components onto a circuit board, improving speed and accuracy in PCB assembly.

Components with leads on opposite sides, positioned along the same axis, commonly used for resistors and diodes.

Components with leads extending outward from the body, typically used for capacitors and transistors.

Small electronic components with a rectangular shape, typically used for resistors and capacitors.

The material that supports the conductive tracks and components on a printed circuit board (PCB). It provides mechanical support for the circuit and contributes to its electrical performance.

A type of PCB substrate commonly used, made of glass-reinforced epoxy resin. Offers a good balance of cost, electrical, and mechanical properties.

A measure of a material's ability to resist electrical breakdown under high voltage. For PCBs, it should be high to avoid electrical failures.

A measure of how well a material can store electrical energy. For PCBs, a low dielectric constant is desirable for high-frequency signals.

A property that describes how much energy is lost as heat when an electrical field changes in a material. A low loss is desirable for PCB materials.

A mechanical process used to create holes in a PCB for inserting components or for plated through holes.

A key process in PCB manufacturing that uses light to transfer a circuit pattern onto a photosensitive layer on the PCB.

A type of photolithographic process that uses an ultraviolet light source to expose a photosensitive layer on the PCB.

A chemical process used to remove unwanted copper from the PCB, leaving behind the desired circuit pattern.

A process that deposits a thin layer of metal onto the PCB, making it conductive. Used for creating plated through holes (PTHs) or surface finish.

A copper layer attached to the substrate, providing electrical conductivity for the circuits on the PCB.

The thickness of the copper layer, measured in ounces per square foot (oz/ft²). Higher ounces indicate thicker copper, which can handle more current.

A high-speed drilling process that uses multiple spindles to create holes in PCBs.

A process used in PCB manufacturing to create patterns on the copper layers, defining the circuit design. It involves using a photoresist to selectively expose areas of the copper to be etched.

The ability of a photoresist to differentiate between exposed and unexposed areas, creating sharp edges for the circuit patterns.

A chemical process used to remove the exposed parts of the copper layer, leaving the desired circuitry.

The process of depositing an additional layer of metal using a chemical bath to improve the conductivity of the PCB and create connections between layers.

The process of precisely aligning the different layers of a PCB before lamination, ensuring accurate connections between them.