Soldering and PCB Manufacturing Quiz

The use of vision systems to accurately locate the position of components on a Printed Circuit Board (PCB) during assembly.

A widely used, interconnected network of physical objects that can collect and exchange data through the internet.

The process of removing excess metallic material from a Printed Circuit Board (PCB), leaving behind the desired circuitry.

This method uses a specialized light-sensitive material to create circuit patterns on a Printed Circuit Board (PCB).

Specialized manufacturing that involves assembling complex electronic components onto PCBs. These processes include tasks such as component placement, soldering, and testing.

The process of creating a Printed Circuit Board (PCB) involves multiple steps, including layering, etching, drilling, and plating, which create the required circuitry for electronic components.

The control and minimization of unwanted substances (dust, contaminants) during electronic assembly to enhance product reliability and minimize defects.

A measure of the quality and success rate of a manufacturing process, expressed as the percentage of units that pass all tests and meet quality standards.

A type of PCB substrate material known for its high temperature resistance and high reliability. It is commonly used in applications requiring high performance and durability.

A material used for PCB substrates that can handle very high frequencies. It is ideal for applications where signal integrity is critical.

A type of PCB substrate material used for flexible PCBs. It allows for bending and shaping, making it suitable for devices like smartphones and wearables.

A tightly woven fabric that provides controlled mechanical properties for PCB substrates. The strength and stability of the fabric are key to the structural integrity of the PCB.

The most common material used for conductors in PCBs. It is adhered to the substrate and comes in various thicknesses depending on the application.

A measure of the thickness of copper foil used in PCBs. It is typically expressed in ounces per square foot, with 1oz being a common thickness.

The process of creating holes in PCBs to provide electrical connectivity between layers and for mounting components. This is a crucial step in PCB manufacturing.

Special bits used in PCB drilling machines to create holes in the substrate. They are made of solid tungsten carbide and are available in various diameters to cater to different hole sizes.

CNC machines with multiple spindles that allow for drilling multiple holes simultaneously in PCBs. These machines are essential for efficient PCB fabrication.

The process of removing unwanted copper from the PCB using chemicals to create the desired circuit pattern. This is a critical step in PCB fabrication.

The process of joining two materials using a molten filler metal with a lower melting point than the materials being joined.

A filler metal that melts below 400°C, used in soldering.

A similar process to soldering, but using a filler metal with a melting point above 400°C.

The process of fusing materials by melting them, without adding a filler metal.

The primary application of soldering, involving attaching electronic components to printed circuit boards.

A printed circuit board (PCB) is a base material used for mounting electronic components. These components are typically soldered to the PCB using a specific soldering process.

The joining of two materials by heating them to the melting point of the filler metal and allowing the filler metal to flow between the two materials.

A paste containing solder particles, flux, and a solvent, used in surface-mount technology (SMT) to create electrical connections between components and a printed circuit board (PCB).

A process that uses a stencil to apply solder paste to a PCB, defining the areas where solder will be deposited.

A metal sheet with precisely cut openings that define the areas where solder paste is deposited on a PCB during stencil printing.

A process where a heated profile melts solder paste, creating electrical connections between components on a PCB. This is a common method in SMT assembly.

A machine that uses a precisely controlled heating profile to melt solder paste and create electrical connections between components on a PCB. This is a common practice in SMT, particularly for smaller components.

A graph showing the temperature changes applied to a PCB during the reflow process. It includes preheating, soaking, the reflow peak (where solder melts), and cooling.

A technique for soldering through-hole components where the components are inserted into holes on a PCB and then submerged in a bath of molten solder.

A material added to solder to reduce oxides and improve the flow of molten solder during the soldering process.

Moore's Law states that the number of transistors that can be placed on an integrated circuit doubles about every two years.

The number of input/output (I/O) pins required for a chip increases with the circuit's complexity. The more complex the circuit, the more connections are needed.

Microprocessor pin count refers to the number of pins used to connect the chip to an external system. The trend shows an increase in pin count over time driven by increased complexity and transistor count.

Interconnection hierarchies refer to the levels of interconnection within a system, from the smallest components to the overall system. These hierarchies are vital for communication and functionality.

The first microprocessor, the Intel i4004, was introduced in 1971. This marked a significant milestone in the development of modern computing.

The minimum feature size of a microprocessor is the smallest dimension of a transistor or other feature on the chip. This size has been steadily decreasing over time, enabling more transistors to fit on a chip.

Bond pads are small areas on a chip that are used to connect the chip to external wires and components. They are a crucial part of the chip's packaging and interconnections.

The Intel i4004 had a minimum feature size of 10 micrometers (10,000 nanometers). This was a large size compared to modern microprocessors, which have feature sizes in the nanometer range.

Wire bonding is a technique used to connect electrical signals from a semiconductor die to a leadframe or a package. It is a key process in semiconductor packaging to ensure the proper functioning of electronic devices.

The process of removing the encapsulant material from an Integrated Circuit (IC) package using acid, allowing for inspection of the internal components like wirebonds and the die.

A printed circuit board (PCB) is a critical component of electronics. It acts as a platform for connecting different electronic components.

Level one interconnection refers to the connections made between the die and the leadframe or package. It's the first step in creating the electrical connections needed for an integrated circuit (IC).

A wirebond is the connection made between two points by welding a thin gold or aluminum wire. This process is critical in semiconductor packaging.

Flip Chip is a technique where the die is flipped over and soldered directly to the PCB, allowing for smaller packages and improved electrical performance.

Underfill is a material applied in flip chip packaging to minimize the stress caused by thermal expansion mismatches between the die and the PCB.