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Questions and Answers
What is the minimum diameter of ingots that can be sliced using wire saw technology?
What is the benefit of edge rounding in wafer processing?
What is the purpose of polishing the wafers in VLSI technology?
What is the combination of chemical and mechanical polish called?
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What is used to hold the wafers in place during polishing?
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What is the purpose of CMP in VLSI technology?
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What is the reason for preventing the epi-crown in wafer processing?
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What is used to buff the wafers during polishing?
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What determines the edge length and arc of the wafer?
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What is the benefit of using wire saw technology for slicing ingots?
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