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VLSI Design EE4121: Microchip Basics

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Questions and Answers

What is the minimum diameter of ingots that can be sliced using wire saw technology?

6" (correct)
8"
4"
10"

What is the benefit of edge rounding in wafer processing?

Reduced chipping of the edges (correct)
Improved planarization
Increased mechanical strength of the wafer
Reduced kerf loss

What is the purpose of polishing the wafers in VLSI technology?

To prepare the wafer for edge rounding
To achieve planarization (correct)
To improve the mechanical strength of the wafer
To reduce the kerf loss during slicing

What is the combination of chemical and mechanical polish called?

Chemical Mechanical Polishing (CMP) (D) Signup and view all the answers

What is used to hold the wafers in place during polishing?

Hard ceramic chuck (C) Signup and view all the answers

What is the purpose of CMP in VLSI technology?

To achieve planarization (A) Signup and view all the answers

What is the reason for preventing the epi-crown in wafer processing?

To prevent irregular outgrowth of silicon (C) Signup and view all the answers

What is used to buff the wafers during polishing?

Slurry of silica powder, DI water, and sodium hydroxide (D) Signup and view all the answers

What determines the edge length and arc of the wafer?

Customer's specification (C) Signup and view all the answers

What is the benefit of using wire saw technology for slicing ingots?

Lower kerf loss (C) Signup and view all the answers