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Questions and Answers
What characteristic of gas molecules is given as 0.5 km/s?
What characteristic of gas molecules is given as 0.5 km/s?
Which vacuum pump is identified as causing oil contamination?
Which vacuum pump is identified as causing oil contamination?
What is the amplitude of the resonant oscillations of the PZT plate?
What is the amplitude of the resonant oscillations of the PZT plate?
Why might turbines in turbo-molecular pumps be used over piezoelectric oscillators?
Why might turbines in turbo-molecular pumps be used over piezoelectric oscillators?
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What is the consequence of molecules bouncing against a moving surface of an oscillator?
What is the consequence of molecules bouncing against a moving surface of an oscillator?
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What is indicated by the resonance frequency of oscillations at 20 MHz?
What is indicated by the resonance frequency of oscillations at 20 MHz?
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Which vacuum pump is not associated with oil contamination?
Which vacuum pump is not associated with oil contamination?
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What property does helium have that makes it suitable for vacuum leak-testing?
What property does helium have that makes it suitable for vacuum leak-testing?
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Which of the following statements about photolithography resolution is correct?
Which of the following statements about photolithography resolution is correct?
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What primarily limits the speed of pattern writing by an e-beam?
What primarily limits the speed of pattern writing by an e-beam?
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Which statement correctly describes the behavior of atoms during deposition methods?
Which statement correctly describes the behavior of atoms during deposition methods?
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What is the effect of using a higher vacuum in a gas-transfer pump?
What is the effect of using a higher vacuum in a gas-transfer pump?
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How can the thickness of the edge bead in photolithography be effectively reduced?
How can the thickness of the edge bead in photolithography be effectively reduced?
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Which of the following statements is true regarding pressure in the context of vacuum systems?
Which of the following statements is true regarding pressure in the context of vacuum systems?
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Which characteristic does not help improve photolithography resolution?
Which characteristic does not help improve photolithography resolution?
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In terms of deposition methods, which statement about sputtering is true?
In terms of deposition methods, which statement about sputtering is true?
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What happens to sputter yield in relation to the energy of incident ions?
What happens to sputter yield in relation to the energy of incident ions?
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In a diffusion process, how can the particle flux be described?
In a diffusion process, how can the particle flux be described?
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Which of the following parameters is NOT part of the simplified atomistic model of diffusion?
Which of the following parameters is NOT part of the simplified atomistic model of diffusion?
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What does the Debye length measure?
What does the Debye length measure?
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Which formula is correct for estimating diffusion length?
Which formula is correct for estimating diffusion length?
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What characterizes the relationship between sputtering yield and beam incidence angle?
What characterizes the relationship between sputtering yield and beam incidence angle?
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Which of these statements is accurate regarding the relationship of particle flux to concentration derivatives?
Which of these statements is accurate regarding the relationship of particle flux to concentration derivatives?
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What is required for a discharge to occur?
What is required for a discharge to occur?
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What are the numbers used to describe plane orientations in a crystal lattice called?
What are the numbers used to describe plane orientations in a crystal lattice called?
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Which of the following factors does not affect photoresist adhesion?
Which of the following factors does not affect photoresist adhesion?
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Which etching method is not reliant on postbake?
Which etching method is not reliant on postbake?
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What characterizes electron-beam lithography compared to photolithography?
What characterizes electron-beam lithography compared to photolithography?
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In terms of decreasing de Broglie wavelength, which order of particles is correct?
In terms of decreasing de Broglie wavelength, which order of particles is correct?
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Which statement about electron-beam lithography is true?
Which statement about electron-beam lithography is true?
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Which of the following methods uses phase-shifting masks to mitigate diffraction effects?
Which of the following methods uses phase-shifting masks to mitigate diffraction effects?
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Which of these factors is not relevant for the time of post bake?
Which of these factors is not relevant for the time of post bake?
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What does photolithography resolution NOT depend on?
What does photolithography resolution NOT depend on?
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In a simple evaporation-type thin-film deposition system, what is the function of the shutter?
In a simple evaporation-type thin-film deposition system, what is the function of the shutter?
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What is the ratio of the thin-film thickness at the edge of the wafer to that in the center if it is 4” below the center?
What is the ratio of the thin-film thickness at the edge of the wafer to that in the center if it is 4” below the center?
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According to Le Chatelier's principle, what happens when the conditions of a system in equilibrium are changed?
According to Le Chatelier's principle, what happens when the conditions of a system in equilibrium are changed?
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In thin-film deposition without a shutter, which of the following is true?
In thin-film deposition without a shutter, which of the following is true?
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What can be concluded about the relationship between thin-film thickness and distance from the center of the wafer?
What can be concluded about the relationship between thin-film thickness and distance from the center of the wafer?
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Which factor primarily affects the uniformity of thin film thickness during deposition?
Which factor primarily affects the uniformity of thin film thickness during deposition?
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What effect does heating have on an unstable equilibrium system according to Le Chatelier's principle?
What effect does heating have on an unstable equilibrium system according to Le Chatelier's principle?
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Study Notes
Vacuum Pumps
- Cryo pumps, Diffusion pumps, Turbo-molecular pumps, and Rotary vane pumps all can be used to create a vacuum environment.
- Diffusion pumps can cause oil contamination, while turbo-molecular pumps and rotary vane pumps can also cause oil contamination.
- Moving turbine blades in a turbo-molecular pump add velocity to gas molecules pushing them towards the pump exhaust, this helps reduce pressure in the vacuum chamber.
Pumping Speed and Pressure
- Pumping speed measures the ability of a pump to remove gas from a vacuum chamber.
- Pumping speed is determined by the momentum transfer of gas molecules colliding with the chamber walls during pumping.
- The higher the vacuum, the lower the pressure and the longer the mean free path in the chamber.
Photolithography Resolution
- Higher resolution in photolithography can be achieved by using shorter wavelengths, larger numerical aperture lenses, and phase-shifting masks.
- Resolution is limited by the diffraction of light used for exposure.
- Thick photoresist does not improve photolithography resolution.
E-Beam Lithography
- E-beam lithography has a smaller beam spot size and a higher flexibility compared to photolithography.
- E-beam lithography can have raster and vector modes for exposing the desired pattern.
- E-beam lithography has a limited fabrication throughput, but this can be overcome by using newer technologies.
Thin Film Deposition
- Sputtering and evaporation are common methods for thin film deposition.
- Atoms deposited by evaporation typically have lower kinetic energy than sputtered atoms.
- Sputtered atoms undergo more collisions before landing on the substrate compared to evaporated atoms.
- Sputtering has better step coverage than evaporation, but fewer grain orientations compared to evaporation.
- Sputter yield depends on the energy of incident ions and the crystallographic orientation of the target.
- In evaporation deposition, a shutter is often used to control the deposition process and ensure homogeneity of the film.
Diffusion
- Diffusion is a process where particles move from areas of high concentration to areas of low concentration.
- The particle flux is directly proportional to the concentration gradient.
- The main parameters for a simplified atomistic model of diffusion are jump frequency, jump distance, and activation energy.
Debye Length
- The Debye length is a measure of the size of the mobile electron cloud that forms around a positive ion when it is pushed into charge-neutral plasma.
- It can also be seen as the average distance between charged particles in the plasma.
Crystallography
- Miller indices are used to describe plane orientations in a crystal lattice.
Photoresist Adhesion
- Photoresist adhesion is affected by the wetting characteristics of the resist, surface smoothness, and the alignment of the resist during processing.
- Postbake is not needed for wet etching, lift-off, and Ar-ion etching processes.
Le Chatelier's Principle
- When a system in equilibrium is subjected to a change in conditions, the system will shift in a direction to minimize the change.
- The new state of the system will be the new equilibrium.
Thin Film Thickness
- Thin-film thickness can be affected by many factors, which may leads to a gradient in film thickness across the wafer.
- In cases where a wafer is not perfectly level the film thickness will be greater in the center of the wafer and lesser at its edges.
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Description
Explore the principles behind various types of vacuum pumps and their applications in creating optimal vacuum conditions. This quiz also covers the essentials of pumping speed, pressure, and resolution techniques in photolithography, crucial for manufacturing processes. Test your knowledge on these integral topics in vacuum technology and imaging systems.