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Questions and Answers
What is the formula for the capacitance of a capacitor?
Which type of transducer involves a change in resistance upon the application of pressure or force?
What happens to the capacitance of a capacitor if the area is doubled?
In the context of micro electromechanical systems (MEMS), what does MEMS stand for?
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Which company extensively uses transceiver and transmitter components according to the text?
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What is the distinguishing output feature of a piezoelectric component under the application of pressure?
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Which type of technology involves micromachining processes and is mentioned in the text?
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What is one major application area mentioned for MEMS technology?
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In the context of MEMS technologies, what role does soft lithography play?
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What is a distinguishing feature between piezoelectric and piezoresistive components?
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Study Notes
Capacitance and Capacitors
- The formula for capacitance (C) is given by C = ε(A/d), where ε is the permittivity of the material between the plates, A is the area of the plates, and d is the distance between them.
- Doubling the area (A) of a capacitor's plates results in a proportional increase in capacitance, effectively doubling its value.
Transducers
- Piezoresistive transducers involve a change in resistance when pressure or force is applied.
Micro Electromechanical Systems (MEMS)
- MEMS stands for Micro Electromechanical Systems, a technology combining mechanical and electrical components on a microscale.
- Soft lithography is a technique used in MEMS technologies for creating micro-scale patterns and structures, allowing for detailed fabrication.
- A major application area for MEMS technology is in sensors and actuators, often used in automotive, medical, and consumer electronics.
Piezoelectric Components
- Piezoelectric components generate electrical output in response to applied pressure, converting mechanical energy into electrical energy.
- The key distinction between piezoelectric and piezoresistive components lies in their operational mechanism: piezoelectric components produce voltage when mechanically stressed, while piezoresistive components change their resistance based on applied stress.
Technology and Companies
- Micromachining technology refers to the fabrication processes utilized in creating MEMS devices and structures on a microscopic scale.
- A specific company known for its extensive use of transceiver and transmitter components emphasizes the advancement and implementation of communication technologies.
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Description
This quiz covers the process of bonding two wafers in a microfluidic system using soft lithography, PDMS, glass, and an oxygen plasma system. Learn how to create microfluidic platforms through bonding with external force.
