Wafer Bonding in Microfluidic Systems

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10 Questions

In the context of micro electromechanical systems (MEMS), what are the three types of transducers mentioned?

Capacitor transducers, piezoelectric transducers, thermal transducers

How does the capacitance of a capacitor change if the diameter is altered?

The capacitance increases

What happens to the output in piezoelectric components when pressure is applied?

The output changes in terms of volts

Which method is used for micromachining technology under MEMS?

Micromachining

What is the constant 'K' in the formula for capacitance?

Permittivity

Which type of transducer shows a change in resistance when pressure is applied?

Piezoresistive transducer

What is affected if the permittivity of a material in a capacitor changes?

The capacitance

How does changing the area of a capacitor affect its capacitance?

The capacitance increases

What distinguishes piezoelectric transducers from piezoresistive transducers?

Piezoelectric transducers generate voltage, piezoresistive transducers don't

Which type of transducer relies on the formula C=KAε₀/D for its functionality?

Capacitor transducer

This quiz explores the process of bonding two wafers in a microfluidic system using soft lithography and PDMS. Learn about creating molds, using oxygen plasma, and applying external force for bonding in microfluidic platforms.

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