Thermal Oxidation of Silicon Process
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Questions and Answers

In thermal oxidation of silicon, what does NI represent?

  • The number of silicon atoms in the substrate.
  • The thickness of the silicon oxide layer.
  • The rate of silicon consumption during oxidation.
  • The number of oxidant molecules incorporated per unit volume of oxide grown. (correct)
  • What is the approximate value of NI for $O_2$?

  • 4.4 x $10^{22} cm^{-3}$
  • 2.2 x $10^{22} cm^{-3}$ (correct)
  • 1.1 x $10^{22} cm^{-3}$
  • 0.5 x $10^{23} cm^{-3}$
  • What are the primary factors influencing the oxidation rate besides temperature and pressure, as indicated in the text?

  • The presence of impurities in the silicon wafer and the humidity levels.
  • The type of ambient gas and flow rate.
  • The crystal orientation and doping concentration of silicon.
  • The shape, thickness and stress of the oxide layer. (correct)
  • In the context of silicon oxidation, what do γ and β represent respectively?

    <p>γ is the number of silicon interstitials, and β is the number of vacancies. (A)</p> Signup and view all the answers

    What can be inferred from the text about the complexity of oxidation models?

    <p>There are alternative oxidation models that take into consideration additional factors. (D)</p> Signup and view all the answers

    Study Notes

    Thermal Oxidation of Silicon

    • Thermal oxidation is a crucial process in integrated circuit (IC) fabrication
    • Silicon dioxide (SiO2) and the Si/SiO2 interface are essential for silicon's dominance in ICs
    • SiO2 is easily etched with lithography, masking common impurities (B, P, As, Sb)
    • It's an excellent insulator (high breakdown field, stable electrical properties) and passivates junctions
    • Thermal oxidation involves volume expansion (~ 2.2X), affecting 2D and 3D structures
    • LOCOS (Local Oxidation of Silicon) process is used to grow field oxides (typically 90 minutes at 1000°C in water vapor results in ~ 0.5 cm growth)
    • Thin oxides (~ 3-5 nm) are grown over active regions as gate oxides

    Oxidation Mechanisms and Models

    • Oxidation of silicon typically involves silicon reacting with either oxygen (O2) or water vapor (H2O). The reactions produce SiO2
    • Deal-Grove Model: A basic model for oxidation that considers the rate of volume expansion and volume diffusion/chemical reactions, typically used for modeling field oxide oxidation (parabolic model)
    • Point Defect Models: More advanced, atomistic approach to modelling oxidation that looks at how chemical reactions, and diffusion occur at an atomic level (involves interstitials and vacancies)

    Oxidation Rate and Other Factors

    • Oxidation rate depends on temperature, ambient (O2 or H2O), and other process parameters
    • Calculated oxidation rates are often presented with graphs of oxide thickness against time
    • This process is sensitive to structure; different shapes and thicknesses lead to different rates

    Measurement Techniques

    • CV (Capacitance-Voltage) measurements are a critical tool to characterize SiO2 and the Si/SiO2 interface
    • This method monitors how charges are distributed in the oxide and in the Si/SiO2 interface, which leads to determining several important quantities like oxide thickness and doping concentration

    Other Important Considerations

    • Stress effects during oxidation are significant, especially in 2D and 3D structures, and must be considered
    • Different oxidation environments and conditions will have different rates and outcomes of the process
    • Advanced process models and simulations are essential for accurate results and understanding these complex processes

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    Description

    Explore the critical thermal oxidation process in integrated circuit fabrication. Understand the significance of silicon dioxide and its impact on silicon-based technologies. Learn about oxidation mechanisms, models, and the LOCOS process for growing field oxides.

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