Microfabrication Techniques Quiz
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Questions and Answers

Why is low pressure needed for PVD (physical vapor deposition) and CVD (chemical vapor deposition) thin layer deposition techniques?

  • To control the thickness of the deposited layer
  • To increase the temperature of the substrate
  • To prevent collisions between gas molecules and deposited atoms (correct)
  • To speed up the deposition process
  • What is the main role of plasma in the CVD (Chemical Vapor Deposition) processes?

  • To enhance mechanical polishing
  • To increase the pressure inside the chamber
  • To create reactive species for thin film growth (correct)
  • To cool down the substrate
  • How is the Depth of Focus (DOF) related to the wavelength (λ) in lithography operations?

  • DOF decreases with increasing wavelength
  • DOF increases with increasing wavelength (correct)
  • DOF remains constant regardless of the wavelength
  • There is no relation between DOF and wavelength
  • What is an important challenge in various deposition techniques related to step coverage?

    <p>Achieving uniformity on all surfaces</p> Signup and view all the answers

    What is the main difference between dry etch and wet etch processes?

    <p>Dry etch uses plasma, while wet etch uses chemical solutions</p> Signup and view all the answers

    What analytical methods are commonly used in semiconductor processing for troubleshooting?

    <p>Scanning Electron Microscopy (SEM)</p> Signup and view all the answers

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