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Questions and Answers
Why is low pressure needed for PVD (physical vapor deposition) and CVD (chemical vapor deposition) thin layer deposition techniques?
Why is low pressure needed for PVD (physical vapor deposition) and CVD (chemical vapor deposition) thin layer deposition techniques?
- To control the thickness of the deposited layer
- To increase the temperature of the substrate
- To prevent collisions between gas molecules and deposited atoms (correct)
- To speed up the deposition process
What is the main role of plasma in the CVD (Chemical Vapor Deposition) processes?
What is the main role of plasma in the CVD (Chemical Vapor Deposition) processes?
- To enhance mechanical polishing
- To increase the pressure inside the chamber
- To create reactive species for thin film growth (correct)
- To cool down the substrate
How is the Depth of Focus (DOF) related to the wavelength (λ) in lithography operations?
How is the Depth of Focus (DOF) related to the wavelength (λ) in lithography operations?
- DOF decreases with increasing wavelength
- DOF increases with increasing wavelength (correct)
- DOF remains constant regardless of the wavelength
- There is no relation between DOF and wavelength
What is an important challenge in various deposition techniques related to step coverage?
What is an important challenge in various deposition techniques related to step coverage?
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What is the main difference between dry etch and wet etch processes?
What is the main difference between dry etch and wet etch processes?
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What analytical methods are commonly used in semiconductor processing for troubleshooting?
What analytical methods are commonly used in semiconductor processing for troubleshooting?
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