Mechanical Properties and Tensile Testing

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Questions and Answers

Which phase is represented at the composition of 0.76% carbon in the Fe-C phase diagram?

  • Liquid steel
  • Cementite
  • Pearlite (correct)
  • Austenite

What is a characteristic of congelation in Cu-Ni alloys associated with micro-segregation?

  • Differences in the chemical composition within a grain (correct)
  • Solidification occurs only at a fixed temperature
  • Uniform distribution of elements within a grain
  • High nickel concentration at the grain boundaries

What happens to alloys during solidification compared to pure metals?

  • All materials solidify at the same temperature
  • Alloys solidify at a fixed temperature
  • Alloys have a variable solidification range (correct)
  • Alloys do not undergo phase changes during solidification

Which method is NOT effective in avoiding micro-segregation during solidification?

<p>Rapid cooling of the molten alloy (B)</p> Signup and view all the answers

Which of the following is NOT considered a phase in the Fe-C phase diagram?

<p>Martensite (B)</p> Signup and view all the answers

What is the primary purpose of a tensile test on materials?

<p>To evaluate the force required to stretch a material before it fails (C)</p> Signup and view all the answers

Which quantity describes the ratio of elongation to the original length in a tensile test?

<p>Engineering strain (C)</p> Signup and view all the answers

When performing a tensile test, what is the significance of necking in the specimen?

<p>It is where the specimen begins to fail due to localized deformation (C)</p> Signup and view all the answers

What is the relationship between tensile stress and tensile strain characterized by?

<p>An initial linear relationship that may vary depending on material properties (C)</p> Signup and view all the answers

In the context of stress analysis, what does 'engineering stress' (σ) represent?

<p>The total load divided by the original cross-sectional area (C)</p> Signup and view all the answers

What best describes 'creep' in the context of material degradation?

<p>Gradual deformation of a material over time under constant stress (C)</p> Signup and view all the answers

Which of the following statements is true regarding shear stress and shear strain?

<p>Shear strain is defined by the angle of shear and the cube's edge length (A)</p> Signup and view all the answers

What type of stress is described as applying a pulling force at right angles to the sample face?

<p>Tensile stress (B)</p> Signup and view all the answers

What is the main characteristic of steel that has undergone slow furnace cooling?

<p>Thicker pearlite layers with large grains (A)</p> Signup and view all the answers

Which cooling method results in the formation of a martensitic microstructure in steel?

<p>Quenching in water (D)</p> Signup and view all the answers

What happens to the atomic lattice structure of iron when steel is quenched in water?

<p>It distorts from FCC to BCC (C)</p> Signup and view all the answers

What is the primary purpose of tempering martensite?

<p>To enhance toughness and ductility at the expense of strength (B)</p> Signup and view all the answers

During which cooling process does steel exhibit a higher yield strength and hardness?

<p>Water quenching (A)</p> Signup and view all the answers

Which of the following statements about martensitic steel is correct?

<p>It consists of needle-shaped grains that are smaller than pearlite (B)</p> Signup and view all the answers

What effect does the chemical composition of steel have on its microstructure?

<p>It influences the type of steel class and microstructure formed (C)</p> Signup and view all the answers

What occurs to microstructural features during the tempering of martensite?

<p>They grow larger and rounder with time (A)</p> Signup and view all the answers

Which cooling method is also referred to as normalising?

<p>Air cooling (A)</p> Signup and view all the answers

What is the correct equation for shear stress?

<p>$\tau = F / A$ (C)</p> Signup and view all the answers

Which condition describes the behavior of a material in the plastic region of a stress/strain graph?

<p>The material undergoes permanent deformation. (C)</p> Signup and view all the answers

What happens to strain when the applied stress is removed, according to Hooke's Law?

<p>Strain decreases to zero. (C)</p> Signup and view all the answers

At what point on the stress/strain graph does the elastic region end?

<p>At the yield point. (B)</p> Signup and view all the answers

Young's Modulus is defined as which of the following?

<p>The ratio of stress to strain. (B)</p> Signup and view all the answers

What does the term 'dilation' refer to in the context of pressure-induced strain?

<p>Change in volume of a solid. (B)</p> Signup and view all the answers

When conducting tensile testing, what is measured against time to determine strain rate?

<p>Displacement. (B)</p> Signup and view all the answers

What characterizes hydrostatic pressure?

<p>Acts evenly in all directions on a submerged object. (A)</p> Signup and view all the answers

What is the correct unit of measurement for Young's Modulus?

<p>Pascal (Pa) (D)</p> Signup and view all the answers

What does shear strain approximately equal when the strain is very small?

<p>W/Lo (B)</p> Signup and view all the answers

What is the relationship between axial stiffness and elastic modulus?

<p>Axial stiffness is directly proportional to elastic modulus. (D)</p> Signup and view all the answers

Under shear forces, the relationship between shear stress and shear strain is defined by which modulus?

<p>Shear modulus (B)</p> Signup and view all the answers

What does the bulk modulus (K) indicate about a material under 3D pressure?

<p>It represents the volume deformation in relation to pressure. (A)</p> Signup and view all the answers

What is Poisson's ratio (ν) defined as?

<p>The ratio of lateral strain to axial strain. (C)</p> Signup and view all the answers

At what carbon content does steel exhibit a 100% pearlite microstructure?

<p>0.76% (B)</p> Signup and view all the answers

What characterizes the microstructure of mild steel at room temperature?

<p>100% ferrite (D)</p> Signup and view all the answers

What happens to the yield stress of steel when the layers of pearlite become thinner?

<p>Yield stress increases. (C)</p> Signup and view all the answers

What is the primary phase present in mild steel with a carbon content around 0.0%?

<p>Ferrite (A)</p> Signup and view all the answers

Which of the following is true regarding the yield stress of austenite compared to ferrite?

<p>Ferrite has a higher yield stress than austenite. (C)</p> Signup and view all the answers

How does carbon solubility change within the phases of iron as the temperature decreases?

<p>Carbon can dissolve only to 2.1% in ferrite. (D)</p> Signup and view all the answers

What is the yield strength of a material?

<p>The stress at which a material begins to deform plastically.</p> Signup and view all the answers

What happens when two like charges are brought close to each other?

<p>They repel each other. (C)</p> Signup and view all the answers

The SI unit of charge is Tesla.

<p>False (B)</p> Signup and view all the answers

What is the formula for current?

<p>I = Q/t</p> Signup and view all the answers

The charge of a single electron is ___ C.

<p>1.6 x 10^-19</p> Signup and view all the answers

Which materials retain a magnetization field after removal of an applied magnetic field?

<p>Ferromagnetic materials (A)</p> Signup and view all the answers

Match the following terms with their definitions:

<p>Coulomb = SI unit of charge Ampere = SI unit of current Capacitor = Device for storing charge Magnetization = Response of a material to a magnetic field</p> Signup and view all the answers

The force of attraction between opposite charges is ___ proportional to the distance between them.

<p>inversely</p> Signup and view all the answers

When two conductive plates in a capacitor are charged, what happens to the charges?

<p>Charges flow from one plate to the other if connected. (B)</p> Signup and view all the answers

What does the electrical loss tangent (tan δe) represent in a dielectric material?

<p>The ratio of the imaginary part to the real part of complex permittivity (D)</p> Signup and view all the answers

Permeability measures the ability of a material to store energy.

<p>False (B)</p> Signup and view all the answers

What is characterized as paramagnetic if magnetic susceptibility (χ) is greater than 0?

<p>Material</p> Signup and view all the answers

The __________ motion of charge carriers is random and influenced by collisions within the material.

<p>Brownian</p> Signup and view all the answers

Match the following terms with their correct definitions:

<p>Permittivity = Ability to store electrical energy Permeability = Ability to form a magnetic field Relative permittivity (εr) = Measure of permittivity relative to free space Magnetic susceptibility (χ) = Indicates whether a material is paramagnetic or diamagnetic</p> Signup and view all the answers

What does the imaginary part (ε'') of complex permittivity represent?

<p>Energy dispersion or loss (D)</p> Signup and view all the answers

In the absence of an electric field, electrons and holes move due to thermal energy being converted into potential energy.

<p>False (B)</p> Signup and view all the answers

What is the symbol for magnetic susceptibility?

<p>χ</p> Signup and view all the answers

What is the approximate thermal velocity of electrons in pure silicon at 300K?

<p>1 × 10^7 cm/sec (C)</p> Signup and view all the answers

Electrons lose velocity when they drift in the direction of the electric field.

<p>True (A)</p> Signup and view all the answers

What does the term 'drift current' refer to?

<p>The net movement of charge carriers (electrons and holes) under the influence of an electric field.</p> Signup and view all the answers

The mean time between collisions in pure silicon at 300K is _____ ps.

<p>0.1</p> Signup and view all the answers

Which equation models the drift current of electrons?

<p>Idrift = -An(-q)µnE (B)</p> Signup and view all the answers

Holes drift in the opposite direction to the electric field.

<p>False (B)</p> Signup and view all the answers

In the context of quantifying currents, what does 'n' represent?

<p>The concentration of charge carriers (electrons) in the material.</p> Signup and view all the answers

What is the formula for the conductivity of a semiconductor?

<p>σ = q(nµn + pµp) (C)</p> Signup and view all the answers

Thermistors have a constant resistance regardless of temperature changes.

<p>False (B)</p> Signup and view all the answers

What is Boltzmann's constant (k) approximately equal to?

<p>1.38 J K−1</p> Signup and view all the answers

The resistance of thermistors decreases with temperature for ___ thermistors.

<p>NTC</p> Signup and view all the answers

Match the following terms related to semiconductor properties with their descriptions:

<p>n = Electron concentration p = Hole concentration µn = Mobility of electrons µp = Mobility of holes</p> Signup and view all the answers

Which of the following describes the total drift current in a semiconductor?

<p>I = AEq(nµn + pµp) (D)</p> Signup and view all the answers

Recombination occurs between free electrons and holes in the barrier of a semiconductor.

<p>True (A)</p> Signup and view all the answers

What does the symbol σ represent in the context of semiconductors?

<p>Conductivity</p> Signup and view all the answers

What is the primary characteristic of a p-type semiconductor?

<p>More holes than free electrons (C)</p> Signup and view all the answers

The depletion region in a p-n junction consists of positive ions on the p-type side.

<p>False (B)</p> Signup and view all the answers

What is the equation to calculate the change in resistance due to temperature?

<p>R(T) = R(T0) x (1 + α∆T)</p> Signup and view all the answers

The breakdown voltage for capacitors is given by the formula Vbd = Edsd, where E is the electric field strength at breakdown and D is the ______.

<p>separation distance</p> Signup and view all the answers

Match the following materials to their resistivity values:

<p>Copper = 1.72 x 10-8 ohm-meter Gold = 2.44 x 10-8 ohm-meter</p> Signup and view all the answers

Which of the following applications utilizes mutual capacitance?

<p>Touch screens (C)</p> Signup and view all the answers

Most metals have a negative temperature coefficient.

<p>False (B)</p> Signup and view all the answers

What is the primary property that defines dielectric strength?

<p>The voltage at which an insulating material's insulating properties begin to break down.</p> Signup and view all the answers

What does the Seebeck coefficient represent?

<p>Measure of voltage per unit temperature difference (D)</p> Signup and view all the answers

The Peltier effect occurs when a temperature difference is created by applying a voltage across two dissimilar metals.

<p>True (A)</p> Signup and view all the answers

What is the unit of measurement for the Seebeck coefficient?

<p>µV K−1</p> Signup and view all the answers

In the Thomson effect, heating travels from the ______ to the ______ side of a conductor.

<p>cold, hot</p> Signup and view all the answers

Match the following effects with their descriptions:

<p>Seebeck Effect = Voltage generation by temperature difference Peltier Effect = Temperature difference created by current Thomson Effect = Heating or cooling in a temperature gradient Hall Effect = Voltage across material in magnetic field</p> Signup and view all the answers

Which of the following equations relates the Seebeck, Peltier, and Thomson effects?

<p>K = dΠ/dt - S (D)</p> Signup and view all the answers

A negative Thomson coefficient indicates that a conductor will heat up when current flows from the hot side to the cold side.

<p>True (A)</p> Signup and view all the answers

What causes the Hall effect in a conductor?

<p>A magnetic field applied perpendicular to the current</p> Signup and view all the answers

Flashcards

Stiffness

The ability of a material to resist deformation under applied load. Higher stiffness means less deformation for a given load.

Strength

The maximum stress a material can withstand before it breaks or permanently deforms.

Toughness

The ability of a material to absorb energy before fracture. A tough material can withstand impact and bending.

Hardness

The resistance of a material to indentation. A hard material is difficult to scratch.

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Tensile Test

A tensile test measures the material's response to a pulling force, which is the tensile stress.

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Engineering Stress

The ratio of force (F) applied to the original cross-sectional area (A0) of the material. Units: N/m2 (Pascals).

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Engineering Strain

The ratio of the change in length (ΔL) to the original length (L0). No units.

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Stress-Strain Curve

A graphical plot of stress versus strain, showing the material's behavior under tensile loading.

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Shear Stress

A type of stress that causes a material to deform by sliding or shearing along parallel planes.

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Shear Strain

The deformation resulting from shear stress, measured as the ratio of the displacement of parallel planes to their initial separation.

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Pressure

Stress acting equally in all directions on a solid object.

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Dilation

The change in volume of a material subjected to pressure, expressed as a fraction of the original volume.

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Hooke's Law

The relationship between stress and strain in the elastic region of a material's response to applied force.

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Yield Point

The point on the stress-strain curve where the material transitions from elastic to plastic deformation.

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Young's Modulus

A material property representing its resistance to deformation under tensile stress.

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Strain Rate

The rate at which strain changes with respect to time.

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Plastic Region

The region on the stress-strain curve where a material undergoes permanent deformation.

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Shear Modulus (G)

The material's ability to resist deformation under shear stress. It's the ratio of shear stress to shear strain.

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Bulk Modulus (K)

The material's resistance to volume change under pressure. It's the ratio of pressure change to volumetric strain.

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Poisson's Ratio (ν)

The ratio of lateral strain to axial strain in a material under tensile stress. It's a measure of how much a material will shrink in width when it's stretched in length.

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Austenite (γ-Fe)

A phase of iron with a face-centered cubic (FCC) crystal structure, stable at high temperatures. Carbon can dissolve in it up to 2.1% by weight.

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Ferrite (α-Fe)

A phase of iron with a body-centered cubic (BCC) crystal structure, stable at room temperature. Carbon can dissolve in it only up to 0.2% by weight.

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Pearlite

A microstructural constituent of steel, consisting of alternating layers of ferrite and cementite. It has a striped appearance.

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Cementite

A compound of iron and carbon (Fe3C), often found in steel microstructure. It's harder and more brittle than ferrite.

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Effect of Carbon Content on Steel

The carbon content in steel significantly affects its microstructure and properties. Low carbon content results in a softer, ductile material, while higher carbon content leads to a harder, stronger material.

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Phase Diagram

A graphical representation showing phases that exist in a material at equilibrium under different temperatures, pressures, and compositions.

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Eutectoid Point

A specific point on a phase diagram where one phase transforms into two or more phases upon cooling. It has one phase above and two phases below.

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Mush Zone

A mixture of both liquid and solid phases of a material during solidification.

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Micro-segregation

Non-uniform distribution of elements within a single grain, causing differences in chemical composition.

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Cooling Rate

The rate at which a material cools down from a higher temperature to a lower temperature.

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Furnace Cooling

A slow cooling process where the material is kept inside a furnace for a long time.

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Air Cooling (Normalizing)

A type of cooling where steel is allowed to cool down naturally in the air.

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Quenching

A very rapid cooling process used to harden steel, often using oil or water.

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Martensite

A metastable microstructure that is very strong and forms when steel is rapidly cooled (quenched).

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Tempering Martensite

A heat treatment process applied to martensite to improve toughness and ductility while sacrificing some strength and hardness.

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Low-Carbon Steel (Mild Steel)

A type of steel with relatively low carbon content, typically used for general construction applications.

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Medium-Carbon Steel

A type of steel with medium carbon content, offering good strength and ductility.

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High-Carbon Steel

A type of steel with high carbon content, known for its extreme hardness but limited ductility.

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Low-Alloy Steel

A type of steel with small amounts of added alloying elements to improve specific properties like strength, corrosion resistance, etc.

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Electrostatic Interaction

Like charges repel each other, while opposite charges attract.

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Coulomb (C)

The SI unit for charge, representing a fixed amount of electrical charge.

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Elementary Charge (q)

The smallest unit of charge that can exist, a fundamental quantity. It's the charge carried by a single electron or proton.

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Capacitor

The ability of a material to store electrical energy by accumulating charges on conductive plates separated by an insulator.

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Electric Current

The flow of electric charge through a conductor, typically measured in amperes.

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Coulomb's Law for Magnetism

A mathematical relationship describing the force between two magnetic poles, similar to Coulomb's Law for electric charges.

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Ferromagnetic Materials

Materials that retain their magnetic properties even after an external magnetic field is removed. Their magnetic fields are generated by the alignment of their internal domains.

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Permanent Magnetism

The ability of a ferromagnetic material to maintain its magnetic field after the external field is removed. It's the strength of a permanent magnet to retain its magnetization.

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Electrical Loss Tangent (tan δe)

A measure of how much electrical energy is lost as heat in a dielectric material. It's calculated as the ratio of the imaginary part (ε'') to the real part (ε') of the complex permittivity (ε).

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Real Part of Complex Permittivity (ε')

The actual energy storage capability of a material due to polarization.

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Imaginary Part of Complex Permittivity (ε'')

Represents the energy dispersion or loss within the material in the form of heat.

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Permeability (µ)

A measure of a material's ability to support the formation of a magnetic field within it.

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Permittivity (ε)

The ability of a material to store energy within itself.

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Magnetic Loss Tangent (tan δm)

The ratio of the imaginary part (µ'') to the real part (µ') of the complex permeability (µ).

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Relative Permittivity (εr) and Permeability (µr)

The relative permittivity (εr) and permeability (µr) are both unitless and used to compare the permittivity and permeability of a material to the permittivity and permeability of free space.

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Magnetic Susceptibility (χ)

A measure of a material's tendency to become magnetized in an external magnetic field. It's calculated as µr-1.

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Mean Time Between Collisions

The average time an electron travels before colliding with an imperfection in the crystal lattice, resulting in a change of direction or energy loss.

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Drift Current

The movement of electrons due to an electric field, creating a current flow. Electrons drift in the opposite direction of the electric field.

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Electron Mobility

The ease with which an electron can move through a material under the influence of an electric field. Higher mobility means electrons move faster.

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Hole Drift Current

The movement of holes, which are the absence of electrons, under the influence of an electric field. Holes drift in the same direction as the electric field.

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Hole Mobility

The measure of how easily a hole can move through a material under the influence of an electric field. Higher mobility means holes move faster.

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Combined Drift Current

The total current in a material is the sum of the electron drift current and the hole drift current.

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Hole Drift Current Formula

The formula that describes the drift current of holes, where A is cross-sectional area, p is hole density, q is charge of a hole, µp is hole mobility, and E is the electric field.

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Electron Drift Current Formula

The formula that describes the drift current of electrons, where A is the cross-sectional area, n is electron density, q is charge of an electron, µn is electron mobility, and E is the electric field.

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Total Drift Current

The total drift current in a semiconductor is determined by the contributions of both electrons and holes, taking into account their charge, concentration, and mobility.

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Conductivity of a Semiconductor

The conductivity of a semiconductor is directly proportional to the sum of the products of the charge, concentration, and mobility of electrons and holes.

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Temperature Dependence of Conductivity

Temperature can influence the conductivity of a semiconductor by affecting the concentration and mobility of charge carriers.

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Thermistor

A thermistor is a resistor whose resistance changes significantly with temperature. They can either have a negative temperature coefficient (NCT) or a positive temperature coefficient (PTC).

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Diffusion Current

Diffusion current arises due to the non-uniform distribution of electrons and holes in a semiconductor. Carriers tend to move from areas of high concentration to low concentration.

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Einstein Relations

The Einstein Relations connect the diffusion coefficient and mobility of charge carriers. These relations apply to both electrons and holes.

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Barrier Potential

The barrier potential forms at the junction between an intrinsic semiconductor and an n-type semiconductor due to differences in charge carrier concentration.

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Mobility and Diffusivity

The mobility (µ) of a charge carrier represents its ease of movement under an electric field, while diffusivity (D) describes its tendency to spread out due to concentration differences.

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Depletion Region in a P-N Junction

The depletion region is formed by diffusion of majority charge carriers across the p-n junction, resulting in layers of immobile ions on both sides.

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Forward Bias in a P-N Junction

Forward bias occurs when an external voltage is applied to reduce the junction's barrier potential, allowing current to flow easily.

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Capacitance

The ability of a material to store electrical energy when a voltage is applied across its conductive plates separated by an insulator.

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Resistance of a Wire

The electrical resistance of a wire is directly proportional to its length and inversely proportional to its cross-sectional area.

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Temperature Dependence of Resistance

The change in resistance of a material due to temperature variations. For most metals, resistance increases with temperature, while for devices like diodes, it decreases.

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Dielectric Strength

The maximum voltage an insulating material can withstand before its insulating properties break down and current starts flowing.

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Mutual Capacitance

The capacitance between two conductors insulated from each other. It's a measure of how much charge is stored for a given voltage difference between the conductors.

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Parallel Plate Capacitor

A type of capacitor where the plates are parallel and the capacitance is dependent on the overlapping area and the separation distance between the plates.

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What is the Seebeck effect?

The Seebeck effect describes the generation of a voltage across a junction of two different metals when there is a temperature difference between the two junctions.

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What is the Seebeck coefficient?

The Seebeck coefficient is a measure of the voltage generated per unit temperature difference across a junction of two different metals.

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What is the Peltier effect?

The Peltier effect is the phenomenon where heat is absorbed or released at a junction of two different conductors when an electric current flows through it.

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What is the Thomson effect?

The Thomson effect describes the heat generation or absorption in a conductor with a temperature gradient when an electric current flows through it.

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What is the Thomson coefficient?

The Thomson coefficient is a measure of the heat generated or absorbed per unit current and temperature gradient in a conductor.

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What is the Hall effect?

The Hall effect describes the development of a voltage across a conductor carrying a current when it is placed in a magnetic field perpendicular to the current flow.

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What is Lorentz's Law?

Lorentz's Law describes the total force experienced by a charged particle moving in an electric and magnetic field. The force is the sum of the electric force and the magnetic force.

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What is a Hall effect device?

A Hall effect device utilizes the Hall effect to measure magnetic fields or current. When a current flows through a conductor in a magnetic field, a voltage develops perpendicular to both the current and the field. This voltage can be measured and then related to the magnetic field strength or the current.

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Study Notes

Mechanical Properties

  • Mechanical properties studied: stiffness, strength, toughness, hardness
  • Materials can degrade through wear, creep, fatigue, and corrosion
  • Mechanical forces can cause materials to deform and/or fail

Tensile Forces

  • Tensile test involves applying tensile stress to a material sample
  • The sample is stretched, and force and elongation are measured
  • Tensile specimens have parallel sides and equal cross-sectional area throughout the sample
  • A tensile testing machine pulls the specimen ends at a constant rate
  • Necking occurs in the specimen, which gradually decreases in cross-sectional area, until fracture
  • Tensile force vs elongation data can be plotted

Normalizing Quantities

  • Engineering stress (σ or S) = F/Aâ‚€ (N/m² = Pa)
  • Engineering strain (ε or e) = ΔL/Lâ‚€ (no units)

Stress-Strain Curve

  • Different shapes on the curve represent different materials
  • Stress may increase or decrease as strain increases
  • The breaking point of a material sample is denoted by X
  • Tensile stress: pulling force at 90° to sample face
  • Shown by positive value
  • Compressive stress: pushing force at 90° to sample face
  • Shown by a negative value
  • If force acts at an angle to the face, resolve into normal and shear components.
  • Strain rate (é) = change in strain over time (de/dt) - important for tensile testing results as results vary with speed

Shear Stress/Strain

  • Shear stress causes sliding (shear strain)
  • Shear stress = F/A
  • Shear strain = w/Lâ‚€ = tan θ (approximately θ if θ is small)

Pressure

  • Pressure = F/A
  • Positive when compressive
  • Strain due to pressure is a change in volume (dilation)
  • D = ΔV/Vâ‚€

Elastic Deformation in Tensile, Compressive, and Bending Tests

  • Tensile testing standardisation uses ASTM E8 guidelines for metals and alloys.
  • Strain rate is important as tensile testing results vary with speed.

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