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Questions and Answers
What are the main techniques discussed in the paper for circuit debugging?
The main techniques discussed are Laser Voltage Imaging (LVI) and Laser Voltage Probing (LVP).
What innovative idea was introduced for TEM lamella preparation in this study?
The innovative idea introduced was the re-thinning of the lamella using the EasyLift system.
How does the EasyLift system enhance the lamella preparation process?
The EasyLift system allows operators to extract the lamella and attach it to a TEM grid within the dual beam FIB chamber.
What was the purpose of the re-thinning procedure in the context of dislocation inspection?
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What challenge is presented by the remaining shallow dislocations after the deep ones are excluded?
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What type of microscopy was used in the physical failure analysis (PFA) conducted in this study?
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Why is it important to distinguish dislocations that induce channel leakage from those that do not?
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What role does the 3D-TEM play in the analysis of dislocations?
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What is the duty cycle of the binary signal '11001100'?
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How does the duty cycle of '11101110' differ from '11001100'?
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What type of signal is generated when the duty cycle is not perfectly symmetric?
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What frequency does the LVI signal primarily detect according to the findings?
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What frequency should be analyzed to find the start point of a waveform change?
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What issue was detected at cell 487 during the nano-probing?
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What tool was used to check the devices' behaviors in cell 487?
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What kind of curve was analyzed to investigate the leakage device?
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What was the problem when the 3D-TEM was initially executed regarding dislocations?
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What was suspected as the cause of the output data change in the signal transmission failure?
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Explain the significance of the hold time window in signal transmission.
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During the testing, what repeating input shift pattern was used and at what clock frequency?
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How did the waveform change during the testing process?
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What did the circuit designer conclude about the failure mechanism based on the waveform changes?
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What was the frequency of the signal when LVI detected the second harmonic?
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What remained unchanged despite the waveform alteration from '11001100' to '11101110'?
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What role does the lamella play in the context of electrical fault analysis?
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How does Laser Voltage Imaging (LVI) aid in identifying timing failures?
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Describe the function of the EasyLift NanoManipulator System in sample preparation.
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What is the significance of the 2nd harmonic signal in the context of LVI?
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What does LVP stand for, and how is it related to LVI?
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Explain the relevance of deep dislocations in bulk silicon during failure analysis.
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What are some characteristics of timing failures as mentioned in the text?
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What is the role of a solid immersion lens (SIL) in this fault analysis system?
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Study Notes
Laser Voltage Imaging (LVI) and Probing (LVP)
- LVI and LVP are laser stimulation techniques used for debugging circuits and identifying various failure modes.
- Timing failures occur when execution times or clock drifts exceed predetermined limits, critical in synchronous distributed systems.
Innovative Re-Thinning Technique
- A new re-thinning process in transmission electron microscopy (TEM) lamella preparation was developed using EasyLift technology.
- This technique enables operators to extract lamella and attach it to a TEM grid, allowing repetitive imaging and dislocation analysis.
Dislocation Identification
- Deep dislocations in bulk silicon could be identified and partially removed using the re-thinning method, helping to isolate failures related to channel leakage.
- A critical observation revealed that only shallow dislocations passing through the channel could lead to leakage, as confirmed by 3D-TEM analysis.
EasyLift Nanomanipulator System
- EasyLift is integrated into a dual beam focused ion beam (FIB) system and facilitates in situ sample lift-out and lamella preparation, enhancing electron microscopy capabilities.
- The system was employed to perform lamella re-thinning and acquire detailed TEM images of dislocations.
Fault Detection and Analysis
- Meridian WS-DP system connects to an Advantest tester, allowing live operation for electrical fault analysis through emission, LVI, and LVP.
- LVI, or “frequency mapping,” aids in pinpointing activated transistors for efficient fault isolation with high spatial resolution.
Case Study of Chain Timing Failure
- A specific case involving signal transmission failure was identified through LVI by analyzing waveform changes between input and output.
- Duty cycle variations indicated potential hold time window issues, influencing signal integrity.
LVI Settings and Signal Analysis
- Key LVI settings included utilizing a 1.25MHz clock frequency and analyzing variations in the duty cycle, which affected the harmonic signals observed.
- A binary search method was employed to trace LVI signals and detect anomalies across different cells within the circuit.
Emphasis on 2nd Harmonic LVI Signal
- The emergence of a 2nd harmonic (5MHz) signal was critical in detecting waveform changes reflective of deeper issues, while the main frequency (2.5MHz) focused on alterations in frequency rather than duty cycle.
Results of Fault Isolation
- The analysis revealed a channel leakage in a specific device location, confirmed by nano-probing and detailed Id-Vg curve observations.
- 3D-TEM imaging primarily indicated deep dislocations, reinforcing the hypothesis that shallow dislocations contributed to channel leakage phenomena.
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Description
Explore the advanced applications of 2nd harmonic laser voltage imaging in identifying timing failures and effective re-thinning techniques for dislocation identification. This quiz delves into the intricate processes and technologies used in modern semiconductor manufacturing.