IPC and Electronics Quiz

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Questions and Answers

What does IPC stand for?

The Institute for Interconnecting and Packaging Electronic Circuits

What is the value range for Class 1 Electronics?

$1-$100

What defines Class 2 Electronics?

Dedicated Service Electronic Products valued at ~$100-$20,000

What defines Class 3 Electronics?

High Performance/Harsh Environment Products valued at ~$20,000 and up Signup and view all the answers

What does NAPD stand for?

No Standard Exists, Acceptable Process Departure, needs corrected Defect Signup and view all the answers

What does A1P2D3 signify?

Class 1 Acceptable, Class 2 Process Departure, Class 3 Defect Signup and view all the answers

What does N1D2D3 signify?

Class 1 No Standard Exists, Class 2 Defect, Class 3 Defect Signup and view all the answers

What does D1D2D3 signify?

Class 1 Defect, Class 2 Defect, Class 3 Defect Signup and view all the answers

In a conflict between J-STD Text and applicable documents, which takes precedent?

J-STD text Signup and view all the answers

If there is a conflict between J-STD Text and unapproved assembly documents, which prevails?

J-STD Signup and view all the answers

In the event of a conflict between approved assembly documents and J-STD Text, which prevails?

Assembly Drawing or Documentation Signup and view all the answers

What does FOD stand for?

Foreign Object Debris Signup and view all the answers

Who is defined as the 'User'?

The Individual, Organization, company, or designated authority responsible for procurement or design. Signup and view all the answers

What does Wire Overwrap refer to?

Wire wraps around terminal more than 360 degrees and remains in contact. Signup and view all the answers

If a condition is considered a Defect for Class 3, what does it mean for Class 1 and 2?

May still be usable. Signup and view all the answers

If a condition is considered a Defect for Class 1, what does it mean for Class 2 and 3?

Will also be a defect. Signup and view all the answers

What should be done if J-STD is contractually required?

The requirements shall be imposed on subassembly drawings, PO's, and subcontracts. Signup and view all the answers

What should be done to ensure end items meet contract performance standards?

Design and workmanship of COTS items should be evaluated and modified as required. Signup and view all the answers

What does COTS stand for?

Commercial Off The Shelf Signup and view all the answers

What is the maximum potential for wires used?

6kV or greater Signup and view all the answers

What does Lead Free solder contain?

Less than 0.1% Pb (Lead) Signup and view all the answers

What is Sn60Pb40 composed of?

60% tin, 40% Lead Signup and view all the answers

What is the composition of Sn62Pb36Ag2?

62% tin, 36% lead, 2% silver Signup and view all the answers

What is Sn63Pb37 composed of?

63% tin, 37% lead Signup and view all the answers

Solder used for preconditioning or machine soldering shall be...

Analyzed, replaced, or replenished at a frequency that ensures compliance. Signup and view all the answers

What action should be taken if contamination exceeds limits?

Intervals between analysis, replacement or replenishment shall be shortened. Signup and view all the answers

Records containing the results of all analyses shall be maintained for...

A minimum of 1 year for each process/system Signup and view all the answers

What are the flux activity levels that flux shall conform to?

L0 and L1 of flux materials RO, RE, OR, except ORL1 shall not be used for no-clean soldering. Signup and view all the answers

What does RO Flux refer to?

Rosin Flux Signup and view all the answers

What is RE Flux?

Resin Flux Signup and view all the answers

What does OR Flux stand for?

Organic Flux Signup and view all the answers

When external flux is used with flux cored solder, what must be ensured?

The fluxes shall be compatible both from cleaning process standpoint and chemical standpoint. Signup and view all the answers

What are the expectations for minor surface flaws in components?

Acceptable, however, they shall not expose the component substrate or active element nor affect structural integrity. Signup and view all the answers

Components shall not be...

Charred or have damage in excess of that to be determined to be a minor surface flaw. Signup and view all the answers

What are the restrictions on loss of metallization as a result of processing?

Not expose ceramic on the terminal end face, no greater than 25% of width or thickness of any termination side, no more than 50% on top of a 5 or 3 sided termination component. Signup and view all the answers

What should not be done with a tool used to cut leads?

Impart shock that damages a component lead seal or internal connection. Signup and view all the answers

What are the exemptions for Finish Removal Requirements in certain processes?

Nickel-palladium-gold (NiPdAu) or Electro Nickeless Palladium Immersion Gold (ENEPIG) are exempt. Signup and view all the answers

Gold must be removed from at least what percentage of surfaces for components to be hand soldered?

95% of all the surfaces to be soldered of all through-hole components. Signup and view all the answers

What must gold be removed from for surface mounted components?

95% of all the surface mounted components regardless of gold thickness. Signup and view all the answers

What is required for through-hole components with >2.54 um gold thickness?

Gold must be removed from at least 95% of all the surfaces to be soldered. Signup and view all the answers

What processes may be used for gold removal prior to mounting components?

Double tinning process or dynamic solderwave. Signup and view all the answers

What can cause gold embrittlement regardless of gold thickness?

Low solder volume or insufficient dwell time. Signup and view all the answers

Study Notes

IPC and Electronics Classes

IPC stands for the Institute for Interconnecting and Packaging Electronic Circuits.
Class 1 electronics are general electronics products valued around $1 to $100.
Class 2 electronics are dedicated service electronic products with a value range of approximately $100 to $20,000.
Class 3 electronics include high-performance products designed for harsh environments, valued at $20,000 and above.

Defect Classifications

NAPD stands for No Standard Exists, Acceptable, Process Departure, and Defect.
A1P2D3 indicates a Class 1 acceptable rating, Class 2 process departure, and Class 3 defect.
N1D2D3 represents Class 1 with no standard, Class 2 defect, and Class 3 defect.
D1D2D3 signifies defects across Class 1, Class 2, and Class 3.

Conflict Resolution in Standards

J-STD text takes precedence over any applicable documents cited within if a conflict arises.
J-STD text also prevails over assembly drawings/documentation not approved by the user.
Approved assembly drawings or documentation take precedence over J-STD text in case of conflicts.

Key Terms and Conditions

FOD stands for Foreign Object Debris.
"User" refers to the individual, organization, or authority responsible for procurement or design.
Wire overwrap occurs when wire wraps around a terminal more than 360 degrees and remains in contact.

Defect Implications and Requirements Flow

A condition considered a defect in Class 3 may still be usable in Classes 1 and 2.
A defect identified in Class 1 will also be a defect in Classes 2 and 3.
If J-STD is contractually required, all derived requirements must apply to subassembly drawings, purchase orders, and subcontracts.

Evaluation of COTS Items

The design and workmanship of COTS (Commercial Off The Shelf) items must be evaluated and modified as needed to meet contract performance standards.

Solder Specifications

Lead-free solder contains less than 0.1% lead (Pb).
Various solder compositions include Sn60Pb40 (60% tin, 40% lead) and Sn62Pb36Ag2 (62% tin, 36% lead, 2% silver).
Solder used for preconditioning, gold removal, tinning of parts, or machine soldering must be assessed for compliance regularly.

Flux and Surface Requirements

Flux must conform to specified activity levels (L0 and L1) and ORL1 is prohibited for no-clean soldering.
Minor surface flaws, discoloration, or small chips in components are acceptable if they do not expose the substrate or affect structural integrity.
Components must not exhibit damage that surpasses minor surface flaws which could degrade function.

Lead Cutting Standards

Tools used for cutting leads must not impart shock that could damage connections or seals at component leads.

Gold Removal and Soldering Guidelines

ENIG, NiPdAu, and ENEPIG finishes are exempt from certain gold removal requirements.
A minimum of 95% of surfaces to be soldered must have gold removed from through-hole and surface-mounted components, regardless of gold thickness.
Gold removal processes may include methods like double tinning or dynamic solder wave before mounting components to prevent embrittlement.

General Maintenance and Records

Records concerning solder bath usage and analysis should be maintained for a minimum of one year per process or system.

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Description

Test your knowledge on IPC standards and electronics classifications. This quiz covers different classes of electronics and defect classifications, including their meanings and implications. Additionally, you'll explore conflict resolution in standards relevant to electronic circuits.