IPC A 610 Flashcards

IPC A 610 Classifications

• Class 1 Product: General electronics focusing on basic functionality.
• Class 2 Product: Dedicated service products requiring consistent performance; uninterrupted service desired but not mandatory.
• Class 3 Product: High-performance products critical for operations; used in life-support systems where downtime is unacceptable.

Responsibilities and Compliance

• Ultimate Responsibility: Customer determines the product class for assembly.
• Mandatory Requirements: "Shall" indicates strict adherence to standards; noncompliance is significant.

Order of Precedence

• Conflict Resolution: Follows procurement agreements documented between customer and supplier.
• Master Drawings: Supersede any conflicting documents reflecting explicit customer requirements.
• IPC-1-610: Activated by customer or contract in conflicts.
• Non-IPC Cited Documents: Prioritized through procurement documents.

Quality Conditions

• Target Condition: Ideal but unrealistic state for assemblies.
• Acceptable Condition: Maintains integrity without being perfect.
• Defect Condition: Assembly fails to meet end-use standards; impacts all classes based on severity.

Defect Handling

• Defect Hierarchy: Class 1 defects imply Class 2 and 3 issues; Class 2 defects imply Class 3 issues.
• Disposition: Manufacturer decides on the treatment of defects (e.g., rework, repair).
• Process Indicators: Non-defect conditions that require monitoring but not individual disposition.

PCB Sides and Connections

• Primary Side: Main component side of PCB; contains most components.
• Solder Source Side: Usually the secondary side where solder is applied.
• Solder Destination Side: Where solder flows during assembly.

Soldering Problems

• Cold Solder Connection: Poorly made joints characterized by grayish appearance; caused by various soldering failures.
• Electrical Clearance Violations: Considered defects for all classes.

Component Configuration

• Meniscus: Sealant excess on leads; includes various materials.
• Nonfunctional Land: Electrically disconnected area on a PCB.

Wire Configurations

• Wire Overwrap: More than 360 degrees wrap that maintains contact.
• Wire Overlap: More than 360 degrees but crosses over itself losing terminal contact.

Inspection and Regulation

• Inspection Methodology: Inspector does not assign class during inspections; relies on predefined criteria.
• Verification Requirements: Measurements are generally not mandatory except for reference.
• Magnification Tolerance: +/- 15% of selected power for aids.
• Illumination Standards: Workstation lighting must meet at least 1000lm/m².

ESD and EOS Management

• ESD (Electrostatic Discharge): Quick charge transfer that can damage components.
• EOS (Electrical Overstress): Damage caused by excessive electrical energy from unintended sources.
• Static Shielding Packaging: Protects assemblies from electrostatic damage.

Work Area Standards

• Food and Tobacco: Prohibited in work areas to prevent contamination.
• Cleanliness: Essential for maintaining quality and avoiding soldering issues.
• Contaminants: Includes body oils, salts, and unauthorized hand creams; can affect soldering.

Preventative Measures

• ESD and EOS Protection: Handle all sensitive components at static-controlled workstations to mitigate damage risks.