30 Questions
What is a key limitation of monolithic ICs?
Limited power capabilities
How do thick-thin film ICs differ from monolithic ICs?
Smaller in size but larger in power
What type of components might be connected discretely in thick-thin film ICs?
BJT and diodes
What distinguishes hybrid ICs from monolithic and thick-thin film ICs?
Combining multiple ICs in one package
How are bipolar ICs different from unipolar ICs based on active devices used?
Bipolar ICs use BJTs, unipolar ICs use FETs
How are bipolar ICs further classified based on the isolation technique used?
p-n junction isolation ICs and dielectric isolation ICs
What is the purpose of the virtual ground concept in opamp analysis with negative feedback?
To simplify calculations and derivations
In the context of opamps, how does real ground differ from virtual ground?
Real ground is physically connected to the earth, while virtual ground is not electrically connected to ground.
When analyzing opamp circuits, under what condition is the concept of a virtual ground valid?
When negative feedback is applied
How does a differential amplifier combine the functionality of inverting and non-inverting amplifiers?
By connecting the non-inverting terminal to the ground for inverting operation
What does grounding the inverting input terminal achieve in a differential amplifier circuit?
It makes the circuit behave as a non-inverting amplifier
How is the input signal V1 amplified in a differential amplifier when the non-inverting terminal is grounded?
(R3 / R1)
What is the purpose of the photolithographic process in the context of semiconductor fabrication?
To create openings in the SiO2 layer for impurity diffusion
What is the purpose of the photoresist layer in the photolithographic process?
To create a pattern for the etching process
What happens to the photoresist layer during the exposure process?
The photoresist layer is polymerized in the exposed areas
What chemical is typically used for developing the photoresist layer after exposure?
Trichloroethylene (C2HCl3)
What happens to the SiO2 layer that is not protected by the polymerized photoresist?
It is etched away by an etching solution like HCl
How is the resist mask removed after the etching and diffusion processes?
By mechanical abrasion and chemical solvents like sulphuric acid
What is the primary function of the input resistor (Ri) in an inverting amplifier circuit?
To convert the input voltage to an input current
What is meant by the term 'virtual ground' in the context of an inverting amplifier circuit?
The inverting input terminal has a very low impedance
Why is it said that the input current (Iin) cannot enter the op-amp in an inverting amplifier circuit?
The op-amp has an infinite input impedance
What is the purpose of the feedback resistor (Rf) in an inverting amplifier circuit?
To set the gain of the amplifier
In an inverting amplifier circuit, what is the relationship between the input voltage (Vin) and the output voltage (Vout)?
Vout = -(Rf/Ri) * Vin
What is the primary advantage of using an inverting amplifier configuration compared to a non-inverting amplifier configuration?
Higher input impedance
In the simplified instrumentation amplifier design, what is the result of shorting the resistances labelled R1 and removing Rg?
It creates a full series negative feedback path, and the gain of A1 and A2 becomes unity.
What is the gain of the practical instrumentation amplifier circuit using the μA 741 op-amp?
10
How can the gain of the practical instrumentation amplifier circuit be made variable?
Replace Rg with a potentiometer.
Which op-amp IC is suggested as a good choice for a compact instrumentation amplifier circuit?
LM324
What is the maximum supply voltage that can be used for the LM324 op-amp IC in the instrumentation amplifier circuit?
$\pm 16\text{V}$ DC
What is the primary advantage of using an active filter over a passive filter?
Active filters can provide signal amplification.
Learn about the characteristics and applications of monolithic ICs and thick-thin film ICs. Understand the differences in power limitations, size, and component integration between the two types of ICs.
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