Electronics Soldering Quiz

Hand Soldering Training

• The presentation is about hand soldering training.
• The presenter's name is Anant Patil.
• The presentation is from CORE RESEARCH.

Contents

• What is soldering?
  • Soldering joins metal parts using solder.
  • Solder creates an alloy with base metal.
  • Key elements include: iron, solder, flux, and components.
  • Flux-cored solder wire is used for hand soldering.
• Electronic Component
  • Electronic components are basic electronic elements.
  • Often packaged in a discrete form with connecting leads or metallic pads.
  • Types of components: Active, Passive, Electromechanical.
• Classification of Parts
  • Active Components:
    • Require an external energy source to operate.
    • Examples: Diode, Transistor, SCR.
    • Diodes require a minimum voltage (0.3V for germanium, 0.7V for silicon) before conducting electricity.
  • Passive Components:
    • Do not need an external energy source to operate.
    • Examples: Resistor, Capacitor, Inductor.
• Difference between Active and Passive Components
  • Active components produce energy (voltage or current).
  • Passive components store or maintain energy (voltage or current).
• Types of Packages
  • Surface Mount Packages (SMPs)
  • Names are often abbreviated by initials (e.g., QFP for Quad Flat Pack)
  • The word "Package" refers to the physical shape or outline of the component.
• Component Identification & Size
  • Provides size codes (e.g., 1206) and approximate sizes (LxW) in inches and millimeters (mm) for various components.
• Parts Dimension
  • Detailed dimensions (L, W, T) in millimeters for various components (CC0402, CC0603, etc.) for proper fitting and assembly.
• Flux Function
  • Flux helps remove oxides from the surface of metal components.
  • This improves solderability and wettability.
  • Flux prevents re-oxidation during soldering.
  • Flux reduces surface tension of solder, aiding in spreading.
  • During soldering, flux removes surface tarnish.
• Solder Wire
  • Solder is a fusible metal alloy.
  • Used to create permanent bonds between metal and workpieces.
  • Important factors when choosing solder wire: Lead (Pb) content, flux content, and wire size.
• Construction of Cored Solder
  • Cored solder wire contains a flux core, which aids soldering. Two Types of Flux: Sn-Pb and Pb-Free.
• Variables in Cored Solder Wire
  • Important aspects include: solder alloy constituents, flux type (like No-Clean RMA), flux percentage, wire diameter, reel size.
• Type of Solder wire
  • Lead-based solder (commonly uses Sn60/Pb40) and lead-free solder. Using lead-free due to health concerns.
• Flux Content
  • Types of flux cores: Acid core (for plumbing) and rosin core (for electronics).
  • Four types of rosin flux: Rosin, Rosin Mildly Activated (RMA), Rosin Activated (RA), Non-Rosin Activated (AC).
• Wire Size
  • Wire diameter is determined by gauge number.
  • Common gauges for different applications (e.g., gauge 16,18 for large solder tags, gauge 18, 20, 21 for general applications).
• Soldering Iron
  • The soldering station temperature is important.
  • Sponge is used for cleaning solder tip.
• Variety in Soldering Iron
  • Different power, size, and ability depending on the work.
  • Importance of correct iron tip for application (e.g., 80W is best for Pb Free or large joints).
  • Internal part of the iron tip, its ceramic heater, and its vulnerability to impact/shock.
• Construction of Tip
  • Soldering iron tips are typically made of a Copper core for good heat transfer.
  • Iron plating promotes thermal insulation for proper heat transfer to components.
  • Nickel is added to avoid wetting and prevent the solder from wicking.
• Types of Solder Iron Tip
  • Bevel tip: Used for large jobs and holding lots of solder, used for surface mount components and multiple pins at once.
  • Chisel tip: Delivers heat evenly to leads and pads for soldering wires, through holes and large surface mount components, often useful for desoldering.
  • Conical tip: Useful for precision work, such as tiny surface mount components, due to its focused pointed tip.
• Types of Soldering
  • Soft soldering, Hard soldering (silver soldering, brazing).
• Types of Soldering Processes
  • Wave soldering, Reflow soldering, Vapor phase soldering, Infrared soldering, differentiated by protective glass and convection methods.
• Solder Wetting
  • Good solder wetting is characterized by smooth, shiny surfaces with no holes or spikes.
• Melting and Diffusion
  • Alloy formation occurs by melting and diffusion of metals, such as tin and copper to make an alloy.
• Hand Soldering Process
  • Soldering process; important steps such as preparation, heating the soldering part, insertion of solder, melting the solder, removing the solder and the iron tip.
• Surface Mount Soldering
  • No differences from through-hole soldering, as per the presentation.
• Precautions: Soldering Station
  • Equipment and tools; ensuring clean workstation and note of solder waste, ESD Mates, check the Sn%, type, and diameter of solder.
• Correct Posture
  • Maintaining proper posture (above 20cm distance) for good ergonomics and safer work practices.
• Handling Method for Cored Solder Wire
  • Efficient feeding of solder wire (50-100mm, 2"-4") is critical for continuous soldering.
• How to hold Soldering Iron
  • Pen-holder style is for normal use. Grip style is for large components.
• Solder tip Caring
  • Scraping on the tip, cleaning using a sponge, adding fresh solder, resetting the tip in the holder for tip upkeep.
• How to clean the soldering iron
  • Cutting the sponge into a V shape. Use water or specialist cleaning fluids. Prevent using excessively or too little cleaner.
• Temperature when cleaning
  • Checking the iron temperature and ensuring it cools down to normal for a successful soldering process.
• Solder tip condition-1 & 2
  • Visual inspection for tip's condition (shiny vs. dull, flux adhering ).
  • Proper tinned area is necessary and essential for the efficiency of soldering heat transfer.
• Heating Large Joints
  • Handling soldering iron while moving and heating large terminal/areas.
• Solder Wetting
  • Visual inspection for proper solder wetting, and its characteristics (smooth vs. rough).
• Solder Quantity
  • Applying correct amount of solder is critical for good connections. Excess or insufficient solder can cause defects.
• Solder Quantity and Surface Condition-1 & 2
  • Visual inspection for adequate solder amount and surface condition (smooth vs. uneven).
• Key points for heating
  • Essential temperature for solder material, and setting up the soldering iron appropriately for optimum heating.
• Incorrect Heating
  • Important steps to avoid incorrect heating, such as placing the iron tip in the correct location during soldering.
• Movement before solder solidifies
  • Moving parts too early can cause negative effects during solidification. Prevents cracks.
• Considerations for good soldering
  • ESD bench, lighting, fume extraction, iron/wire position, work jig's setup (cleanliness and proper arrangement).
• Soldering Summary
  • Summarizes efficient soldering procedures (heating all parts at once, proper solder application, avoiding premature movement, and visual checks).
• Inspection and Handling
  • Important inspection points: correct position, shape, wetting, solder amount, solder surface quality.
• Different Types of Defects
  • Various defects during hand soldering (non-wetting, solder ball, bridge, projection, crack, poor wetting, tunnel, forget to solder, land peeled off, over heating ).
• Defects due iron tip
  • Defects caused during iron tip release (projection/solder spike, solderball, wrist twisting).
• Solder balls
  • Causes (rapid withdrawal of soldering iron, insufficient heating of base metal). How to avoid these defects.
• Handling of PWBs
  • Proper handling of printed circuit boards (PCBs) (don't touch solder side before soldering to prevent damage).
• Thank You!
  • Closing statement.