18 Questions
Which type of oxidation process uses high-purity oxygen gas to oxidize silicon?
Dry oxidation
What is a characteristic of dry oxidation compared to wet oxidation?
Slow growth of oxide
In which oxidation process does the oxidizing element consist of one hydrogen atom and one oxygen molecule?
Wet oxidation
What does the wet oxidation process involve at high temperatures?
Steam
Which type of oxidation process results in oxide layers of usually higher quality?
Dry oxidation
What temperature range is used in the Rapid Thermal Process (RTP) for oxidizing silicon?
400-1300°C
What is the purpose of the oxidation stage in semiconductor device manufacturing?
To generate a protective layer of silicon dioxide on the wafer's surface
How are wafers cleaned before the oxidation process?
Via wet chemistry with a two-stage RCA clean
What is the industry standard method for cleaning wafer surfaces?
Wet Chemistry - RCA Clean
What does inspection failure for oxidized wafers refer to?
Overgrown oxide layers and uneven oxidation
Which method is utilized primarily for creating a protective layer of silicon dioxide on a wafer's surface?
Dry Oxidation
How are oxidized wafers inspected for various properties after the oxidation process?
Optical inspection for defects
What is the purpose of using a mixture of hydrochloric acid, hydrogen peroxide, and deionized (DI) water in wafer cleaning?
To remove metals from the wafer surface
During thermal oxidation of a silicon wafer, what is the temperature range typically used for growing a layer of silicon dioxide?
900°C to 1200°C
Which process involves the reaction of oxygen gas with the silicon surface to produce a protective layer of silicon dioxide on the wafer?
Dry oxidation
What method is commonly used for rinsing a silicon wafer after cleaning processes are completed?
Spray rinse
Which tool is used for scrubbing the wafer surface with a brush or high pressure arm as part of the cleaning process?
Wafer Scrubber
What mechanism is primarily used in wet oxidation for removing particles and organic materials during wafer cleaning?
Electric Repulsion
Learn about the second phase of diffusion-controlled oxidation and the parameters affecting oxidation growth rate, including temperature, oxidizing medium, pressure, silicon doping level, and crystal orientation. Explore the types of oxidation, such as dry oxidation where silicon reacts with oxygen gas to form silicon dioxide.
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