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Questions and Answers
Which type of oxidation process uses high-purity oxygen gas to oxidize silicon?
Which type of oxidation process uses high-purity oxygen gas to oxidize silicon?
What is a characteristic of dry oxidation compared to wet oxidation?
What is a characteristic of dry oxidation compared to wet oxidation?
In which oxidation process does the oxidizing element consist of one hydrogen atom and one oxygen molecule?
In which oxidation process does the oxidizing element consist of one hydrogen atom and one oxygen molecule?
What does the wet oxidation process involve at high temperatures?
What does the wet oxidation process involve at high temperatures?
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Which type of oxidation process results in oxide layers of usually higher quality?
Which type of oxidation process results in oxide layers of usually higher quality?
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What temperature range is used in the Rapid Thermal Process (RTP) for oxidizing silicon?
What temperature range is used in the Rapid Thermal Process (RTP) for oxidizing silicon?
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What is the purpose of the oxidation stage in semiconductor device manufacturing?
What is the purpose of the oxidation stage in semiconductor device manufacturing?
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How are wafers cleaned before the oxidation process?
How are wafers cleaned before the oxidation process?
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What is the industry standard method for cleaning wafer surfaces?
What is the industry standard method for cleaning wafer surfaces?
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What does inspection failure for oxidized wafers refer to?
What does inspection failure for oxidized wafers refer to?
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Which method is utilized primarily for creating a protective layer of silicon dioxide on a wafer's surface?
Which method is utilized primarily for creating a protective layer of silicon dioxide on a wafer's surface?
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How are oxidized wafers inspected for various properties after the oxidation process?
How are oxidized wafers inspected for various properties after the oxidation process?
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What is the purpose of using a mixture of hydrochloric acid, hydrogen peroxide, and deionized (DI) water in wafer cleaning?
What is the purpose of using a mixture of hydrochloric acid, hydrogen peroxide, and deionized (DI) water in wafer cleaning?
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During thermal oxidation of a silicon wafer, what is the temperature range typically used for growing a layer of silicon dioxide?
During thermal oxidation of a silicon wafer, what is the temperature range typically used for growing a layer of silicon dioxide?
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Which process involves the reaction of oxygen gas with the silicon surface to produce a protective layer of silicon dioxide on the wafer?
Which process involves the reaction of oxygen gas with the silicon surface to produce a protective layer of silicon dioxide on the wafer?
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What method is commonly used for rinsing a silicon wafer after cleaning processes are completed?
What method is commonly used for rinsing a silicon wafer after cleaning processes are completed?
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Which tool is used for scrubbing the wafer surface with a brush or high pressure arm as part of the cleaning process?
Which tool is used for scrubbing the wafer surface with a brush or high pressure arm as part of the cleaning process?
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What mechanism is primarily used in wet oxidation for removing particles and organic materials during wafer cleaning?
What mechanism is primarily used in wet oxidation for removing particles and organic materials during wafer cleaning?
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