CPE182 Lecture 9: Wafer and Functional Testing
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Questions and Answers

Which testing method is known for temperature cycling and vibration to identify latent defects?

  • Built-In Self-Test (BIST)
  • Radio Frequency (RF) Testing
  • Environmental Stress Screening (ESS) (correct)
  • Boundary Scan Testing

    • Which testing method does not require physical access to all internal nodes of an IC?

  • Environmental Stress Screening (ESS)
  • Boundary Scan Testing (correct)
  • Built-In Self-Test (BIST)
  • Radio Frequency (RF) Testing

    • Which testing method reduces testing time and cost by incorporating test circuitry within the IC?

  • Built-In Self-Test (BIST) (correct)
  • Environmental Stress Screening (ESS)
  • Boundary Scan Testing
  • Radio Frequency (RF) Testing

    • Which testing method focuses on verifying the performance of analog and mixed-signal ICs?

    <p>Radio Frequency (RF) Testing</p> Signup and view all the answers

    Which testing method specifically verifies parameters such as frequency, power, modulation, and noise characteristics of ICs designed for wireless communication applications?

    <p>Radio Frequency (RF) Testing</p> Signup and view all the answers

    What is the primary goal of wafer sort testing?

    <p>To sort defective chips into different bins based on performance characteristics</p> Signup and view all the answers

    What type of testing verifies that the IC performs its intended function correctly according to the specifications provided by the manufacturer?

    <p>Functional testing</p> Signup and view all the answers

    What type of testing measures various electrical parameters of the IC such as voltage, current, frequency, and timing?

    <p>Parametric testing</p> Signup and view all the answers

    What type of testing evaluates the long-term performance and durability of the IC under different environmental conditions?

    <p>Reliability testing</p> Signup and view all the answers

    What is the purpose of subjecting the IC to prolonged operation under elevated temperature and voltage conditions?

    <p>To detect early failures caused by manufacturing defects or weak components</p> Signup and view all the answers

    What is the primary purpose of Environmental Stress Screening (ESS)?

    <p>To identify and eliminate latent defects in ICs</p> Signup and view all the answers

    What does Boundary Scan enable?

    <p>Testing of ICs without requiring physical access to internal nodes</p> Signup and view all the answers

    What is BIST an abbreviation for?

    <p>Built-In Self-Testing</p> Signup and view all the answers

    What type of ICs is RF testing specifically designed for?

    <p>ICs designed for wireless communication applications</p> Signup and view all the answers

    What standard defines the architecture for JTAG testing?

    <p>IEEE 1149.1</p> Signup and view all the answers

    At which level is wafer sort testing conducted?

    <p>At the wafer level before individual ICs are cut and packaged</p> Signup and view all the answers

    What is the primary goal of final testing?

    <p>To ensure that only good ICs are shipped to customers</p> Signup and view all the answers

    What does parametric testing measure?

    <p>Various electrical parameters of the IC such as voltage, current, frequency, and timing</p> Signup and view all the answers

    What is the purpose of burn-in testing?

    <p>To detect early failures caused by manufacturing defects or weak components</p> Signup and view all the answers

    What type of testing involves applying input signals and observing output responses?

    <p>Functional testing</p> Signup and view all the answers

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