CPE182 Lecture 9: Wafer and Functional Testing

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Which testing method is known for temperature cycling and vibration to identify latent defects?

Built-In Self-Test (BIST)

Radio Frequency (RF) Testing

Environmental Stress Screening (ESS) (correct)

Boundary Scan Testing

Which testing method does not require physical access to all internal nodes of an IC?

Environmental Stress Screening (ESS)

Boundary Scan Testing (correct)

Built-In Self-Test (BIST)

Radio Frequency (RF) Testing

Which testing method reduces testing time and cost by incorporating test circuitry within the IC?

Built-In Self-Test (BIST) (correct)

Environmental Stress Screening (ESS)

Boundary Scan Testing

Radio Frequency (RF) Testing

Which testing method focuses on verifying the performance of analog and mixed-signal ICs?

Radio Frequency (RF) Testing Signup and view all the answers

Which testing method specifically verifies parameters such as frequency, power, modulation, and noise characteristics of ICs designed for wireless communication applications?

Radio Frequency (RF) Testing Signup and view all the answers

What is the primary goal of wafer sort testing?

To sort defective chips into different bins based on performance characteristics Signup and view all the answers

What type of testing verifies that the IC performs its intended function correctly according to the specifications provided by the manufacturer?

Functional testing Signup and view all the answers

What type of testing measures various electrical parameters of the IC such as voltage, current, frequency, and timing?

Parametric testing Signup and view all the answers

What type of testing evaluates the long-term performance and durability of the IC under different environmental conditions?

Reliability testing Signup and view all the answers

What is the purpose of subjecting the IC to prolonged operation under elevated temperature and voltage conditions?

To detect early failures caused by manufacturing defects or weak components Signup and view all the answers

What is the primary purpose of Environmental Stress Screening (ESS)?

To identify and eliminate latent defects in ICs Signup and view all the answers

What does Boundary Scan enable?

Testing of ICs without requiring physical access to internal nodes Signup and view all the answers

What is BIST an abbreviation for?

Built-In Self-Testing Signup and view all the answers

What type of ICs is RF testing specifically designed for?

ICs designed for wireless communication applications Signup and view all the answers

What standard defines the architecture for JTAG testing?

IEEE 1149.1 Signup and view all the answers

At which level is wafer sort testing conducted?

At the wafer level before individual ICs are cut and packaged Signup and view all the answers

What is the primary goal of final testing?

To ensure that only good ICs are shipped to customers Signup and view all the answers

What does parametric testing measure?

Various electrical parameters of the IC such as voltage, current, frequency, and timing Signup and view all the answers

What is the purpose of burn-in testing?

To detect early failures caused by manufacturing defects or weak components Signup and view all the answers

What type of testing involves applying input signals and observing output responses?

Functional testing Signup and view all the answers

CPE182 Lecture 9: Wafer and Functional Testing

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Questions and Answers

Which testing method is known for temperature cycling and vibration to identify latent defects?

Which testing method does not require physical access to all internal nodes of an IC?

Which testing method reduces testing time and cost by incorporating test circuitry within the IC?

Which testing method focuses on verifying the performance of analog and mixed-signal ICs?

Which testing method specifically verifies parameters such as frequency, power, modulation, and noise characteristics of ICs designed for wireless communication applications?

What is the primary goal of wafer sort testing?

What type of testing verifies that the IC performs its intended function correctly according to the specifications provided by the manufacturer?

What type of testing measures various electrical parameters of the IC such as voltage, current, frequency, and timing?

What type of testing evaluates the long-term performance and durability of the IC under different environmental conditions?

What is the purpose of subjecting the IC to prolonged operation under elevated temperature and voltage conditions?

What is the primary purpose of Environmental Stress Screening (ESS)?

What does Boundary Scan enable?

What is BIST an abbreviation for?

What type of ICs is RF testing specifically designed for?

What standard defines the architecture for JTAG testing?

At which level is wafer sort testing conducted?

What is the primary goal of final testing?

What does parametric testing measure?

What is the purpose of burn-in testing?

What type of testing involves applying input signals and observing output responses?

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