CPE182 Lecture 9: Wafer and Functional Testing

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Questions and Answers

Which testing method is known for temperature cycling and vibration to identify latent defects?

  • Built-In Self-Test (BIST)
  • Radio Frequency (RF) Testing
  • Environmental Stress Screening (ESS) (correct)
  • Boundary Scan Testing

Which testing method does not require physical access to all internal nodes of an IC?

  • Environmental Stress Screening (ESS)
  • Boundary Scan Testing (correct)
  • Built-In Self-Test (BIST)
  • Radio Frequency (RF) Testing

Which testing method reduces testing time and cost by incorporating test circuitry within the IC?

  • Built-In Self-Test (BIST) (correct)
  • Environmental Stress Screening (ESS)
  • Boundary Scan Testing
  • Radio Frequency (RF) Testing

Which testing method focuses on verifying the performance of analog and mixed-signal ICs?

<p>Radio Frequency (RF) Testing (A)</p> Signup and view all the answers

Which testing method specifically verifies parameters such as frequency, power, modulation, and noise characteristics of ICs designed for wireless communication applications?

<p>Radio Frequency (RF) Testing (D)</p> Signup and view all the answers

What is the primary goal of wafer sort testing?

<p>To sort defective chips into different bins based on performance characteristics (D)</p> Signup and view all the answers

What type of testing verifies that the IC performs its intended function correctly according to the specifications provided by the manufacturer?

<p>Functional testing (B)</p> Signup and view all the answers

What type of testing measures various electrical parameters of the IC such as voltage, current, frequency, and timing?

<p>Parametric testing (A)</p> Signup and view all the answers

What type of testing evaluates the long-term performance and durability of the IC under different environmental conditions?

<p>Reliability testing (B)</p> Signup and view all the answers

What is the purpose of subjecting the IC to prolonged operation under elevated temperature and voltage conditions?

<p>To detect early failures caused by manufacturing defects or weak components (C)</p> Signup and view all the answers

What is the primary purpose of Environmental Stress Screening (ESS)?

<p>To identify and eliminate latent defects in ICs (A)</p> Signup and view all the answers

What does Boundary Scan enable?

<p>Testing of ICs without requiring physical access to internal nodes (B)</p> Signup and view all the answers

What is BIST an abbreviation for?

<p>Built-In Self-Testing (C)</p> Signup and view all the answers

What type of ICs is RF testing specifically designed for?

<p>ICs designed for wireless communication applications (C)</p> Signup and view all the answers

What standard defines the architecture for JTAG testing?

<p>IEEE 1149.1 (A)</p> Signup and view all the answers

At which level is wafer sort testing conducted?

<p>At the wafer level before individual ICs are cut and packaged (A)</p> Signup and view all the answers

What is the primary goal of final testing?

<p>To ensure that only good ICs are shipped to customers (A)</p> Signup and view all the answers

What does parametric testing measure?

<p>Various electrical parameters of the IC such as voltage, current, frequency, and timing (B)</p> Signup and view all the answers

What is the purpose of burn-in testing?

<p>To detect early failures caused by manufacturing defects or weak components (C)</p> Signup and view all the answers

What type of testing involves applying input signals and observing output responses?

<p>Functional testing (A)</p> Signup and view all the answers

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