Southampton Solent University BEng (Hons) Mechanical Engineering – Level 6 PDF

SOUTHAMPTON SOLENT UNIVERSITY BENG (HONS) MECHANICAL ENGINEERING – LEVEL 6 ANALYSIS OF MATERIALS AND STRUCTURES PHASE TEST- SAMPLE PAPER Date: ****** Time: 75 Minutes INSTRUCTIONS TO CANDIDATES...

SOUTHAMPTON SOLENT UNIVERSITY BENG (HONS) MECHANICAL ENGINEERING – LEVEL 6 ANALYSIS OF MATERIALS AND STRUCTURES PHASE TEST- SAMPLE PAPER Date: ****** Time: 75 Minutes INSTRUCTIONS TO CANDIDATES Time allowed for this examination is 75 minutes. This paper contains SIX questions. Candidates are required to answer ALL questions. The allocation of marks is indicated on the paper. SPECIAL INSTRUCTIONS Non-programmable calculators are permitted Question 3 What parameters would you seek to control in semiconductor manufacturing in order to maintain high yields? What failures are likely if this parameter is not adequately controlled? (5 Marks) Question 4 What are the main challenges in setting up to manufacture electronic devices in silicon? Consider technological and economic issues. (5 Marks) 1 Question 5 Determine the internal normal force, shear force, and moment at point D in the simply supported beam. Point D is located just to the left of the 5 kN force. (5 marks) Question 6 A load of P = 400 N acts on a curved steel rod as shown below. The rod is solid with a diameter of d = 15 mm. Assume b = 35 mm and a = 175 mm. Determine the normal stresses produced at points H and K. (10 marks) End of the Assessment 2  Marking Scheme Question 3 Uniformity of processing is the most important, as all the processes need to be as designed from edge to edge on the wafer. The failure is reduced yields if the processes are not uniform. The temperature must be controlled over the entire wafer. Dopant levels and diffusion can fail, or etching can fail is the temperature is not controlled. This leads to reduced yields Control over temperature of the doping stages, or the dopant levels will not be at the right level or in the right place. This leads to reduced yields. Control over etching Control over patterns and registration of patterns. (2.5 marks each area, maximum 5 Marks) Question 4 Technological limitations include the need to have very controlled processes over whole wafers to get high yields. Factors which contribute to controlled processes include control over temperature control over etching, control over creating patterns Well controlled processes at large scale usually requires very expensive equipment for every process. (2.5 marks for an example of technological and economic challenges, maximum 5 Marks) 3 Question 5 a) (1 mark) Internal Forces (4 marks) 4 Question 6 Section properties (2 marks) Internal forces and moments (2 marks) Stresses (2 marks) Normal stress at H By inspection, the bending stress at H will be compression; therefore, the normal stress at H is: σ H = 2.264 MPa − 42.253 MPa = −39.989 MPa = 40.0 MPa (C) (2 marks) Normal stress at K By inspection, the bending stress at K will be tension; therefore, the normal stress at K is: σ K = 2.264 MPa + 42.253 MPa = 44.516 MPa = 44.5 MPa (T) (2 marks) 5