Hardware Security Quiz (150 Questions) PDF

Hardware Security Quiz (150 Questions) 1. What is the main goal of logic locking in hardware security? A. Reduce power consumption B. Protect circuit designs C. Enhance chip speed D. Improve manufacturing processes Correct Answer: B 2. What does IC in IC Metering stand for? A. Inte...

Hardware Security Quiz (150 Questions) 1. What is the main goal of logic locking in hardware security? A. Reduce power consumption B. Protect circuit designs C. Enhance chip speed D. Improve manufacturing processes Correct Answer: B 2. What does IC in IC Metering stand for? A. Integrated Circuit B. Internal Configuration C. Input Code D. Intelligent Circuit Correct Answer: A 3. In split manufacturing, which phase is typically handled by a high-end foundry? A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Testing Correct Answer: B 4. Which of the following is an example of passive IC metering? A. External control via cryptography B. Adding unique serial numbers C. Embedding finite state machines D. Active runtime control Correct Answer: B 5. What does a SAT attack primarily aim to do? A. Slow down the chip B. Extract the correct key C. Add faults to the circuit D. Prevent chip activation Correct Answer: B 6. What is the primary function of dummy cell insertion in split manufacturing? A. Reduce power consumption B. Confuse attackers C. Improve circuit speed D. Optimize chip layout Correct Answer: B 7. What is the role of 'clique size' in strong logic locking? A. Measure circuit complexity B. Quantify lock interdependence C. Identify key sensitivity D. Determine netlist structure Correct Answer: B 8. Which logic locking technique introduces loops to confuse attackers? A. Random Logic Locking (RLL) B. Fault Analysis Locking (FLL) C. Cyclic Logic Locking D. Hybrid Approach Correct Answer: C 9. What does FEOL stand for in split manufacturing? A. Front-End-On-Line B. Front-End-Of-Line C. First-End-Of-Layer D. Forward-Energy-On-Line Correct Answer: B 10. How does netlist obfuscation help in split manufacturing? A. By improving performance B. By hiding circuit details C. By increasing production speed D. By reducing power usage Correct Answer: B 11. What is the purpose of SARLock in logic locking? A. To create strong DIPs B. To produce weak DIPs C. To enhance circuit speed D. To reduce power consumption Correct Answer: B 12. Which phase in IC fabrication involves creating transistors and passive devices? A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Packaging Correct Answer: B 13. What is the key idea behind Anti-SAT?  A. Increase key size B. Create complementary functions C. Reduce power usage D. Simplify netlist structure Correct Answer: B 14. What is a distinguishing feature of active IC metering? A. It uses physical serial numbers B. It adds cryptographic locks C. It has no runtime control D. It relies on silicon variations Correct Answer: B 15. In split manufacturing, what does 'routing perturbation' achieve? A. Shortens wire length B. Confuses attackers by modifying paths C. Reduces production cost D. Enhances chip speed Correct Answer: B 16. What is the primary goal of split manufacturing in hardware security? A. Increase production speed B. Protect design confidentiality C. Reduce manufacturing costs D. Improve chip aesthetics Correct Answer: B 17. What does BEOL stand for in chip manufacturing? A. Back-End-Of-Line  B. Basic-End-Of-Line C. Binary-End-Of-Layer D. Backend-Layered-Operation Correct Answer: A 18. Which type of IC metering technique uses physical unclonable functions (PUFs)? A. Active metering B. Passive unclonable metering C. Passive metering D. Runtime metering Correct Answer: C 19. What is a DIP in the context of SAT attacks? A. Distinguishing Input Pattern B. Distributed Integration Protocol C. Digital Input Phase D. Device Integration Process Correct Answer: A 20. What is the purpose of output corruptibility in logic locking? A. Measure output speed B. Assess output errors with incorrect keys C. Detect unauthorized users D. Increase circuit efficiency Correct Answer: B 21. How does fault masking occur in logic locking? A. By adding random gates B. When wrong key bits cancel each other  C. Through cryptographic protection D. When outputs remain unchanged Correct Answer: B 22. What is the main purpose of dummy branches in split manufacturing? A. Reduce power consumption B. Slow proximity attacks C. Optimize chip layout D. Increase production speed Correct Answer: B 23. What is a major challenge of passive IC metering? A. High manufacturing costs B. Ease of cloning serial numbers C. Dependency on cryptography D. Limited scalability Correct Answer: B 24. Which of these is a feature of Anti-SAT logic locking? A. Weak DIPs B. Large circuit delay C. Simplified design D. Direct fault injection Correct Answer: A 25. In split manufacturing, what is the main advantage of netlist obfuscation? A. Reduces production cost B. Hides design structure C. Speeds up testing  D. Improves circuit efficiency Correct Answer: B 26. What is the effect of increasing clique size in strong logic locking? A. Increases power usage B. Reduces key interdependence C. Makes the circuit harder to break D. Speeds up brute-force attacks Correct Answer: C 27. What does the term 'functional obfuscation' mean in split manufacturing? A. Changing circuit functionality B. Confusing attackers about the circuit's purpose C. Adding dummy cells to the design D. Removing redundant logic Correct Answer: B 28. What is the primary goal of state-space obfuscation in active IC metering? A. Hide internal states from unauthorized users B. Simplify state transitions C. Increase output speed D. Add cryptographic control Correct Answer: A 29. Which of the following is a drawback of brute-force attacks compared to SAT attacks? A. Require less computation B. Slower to find keys C. Can identify DIPs easily D. Are less effective on simple circuits Correct Answer: B 30. What is the significance of wire elevation in split manufacturing? A. Increases manufacturing complexity B. Reduces wire length C. Makes routing harder to interpret D. Enhances circuit speed Correct Answer: C 31. Which of the following is an example of active metering in ICs? A. Indented serial numbers B. Adding cryptographic locks C. Storing identifiers in memory D. Using silicon variations Correct Answer: B 32. What is a primary advantage of split manufacturing? A. Reduces chip size B. Prevents reverse engineering C. Increases chip speed D. Simplifies fabrication Correct Answer: B 33. What does 'routing perturbation' achieve in split manufacturing? A. Shortens wire length B. Creates misleading paths C. Reduces power usage D. Enhances logic locking Correct Answer: B 34. In logic locking, what is the purpose of XOR gates? A. Perform cryptographic operations B. Create locked outputs C. Add delays to the circuit D. Improve performance Correct Answer: B 35. What does FEOL stand for in chip design? A. Front-End-Of-Line B. First-Electrical-On-Line C. Fault-End-Of-Layer D. Front-End-Open-Line Correct Answer: A 36. What is a PUF in hardware security? A. Programmable Unique Function B. Physical Unclonable Function C. Passive Usage Feature D. Protective Unit Framework Correct Answer: B 37. Which technique ensures circuit confidentiality in split manufacturing? A. Layout obfuscation B. Power optimization C. High-speed routing D. Circuit minimization Correct Answer: A 38. What does state-space obfuscation aim to achieve in active metering?  A. Simplify circuit design B. Increase testability C. Hide state transitions D. Add redundant components Correct Answer: C 39. How does Anti-SAT logic locking improve security? A. By introducing cycles B. By creating weak DIPs C. By optimizing routing D. By reducing circuit size Correct Answer: B 40. What is the purpose of pin swapping in split manufacturing? A. Reduce power consumption B. Increase attack complexity C. Simplify routing D. Enhance performance Correct Answer: B 41. What is the main goal of logic locking in hardware security? (Extended) A. Reduce power consumption B. Protect circuit designs C. Enhance chip speed D. Improve manufacturing processes Correct Answer: B 42. What does IC in IC Metering stand for? (Extended) A. Integrated Circuit  B. Internal Configuration C. Input Code D. Intelligent Circuit Correct Answer: A 43. In split manufacturing, which phase is typically handled by a high-end foundry? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Testing Correct Answer: B 44. Which of the following is an example of passive IC metering? (Extended) A. External control via cryptography B. Adding unique serial numbers C. Embedding finite state machines D. Active runtime control Correct Answer: B 45. What does a SAT attack primarily aim to do? (Extended) A. Slow down the chip B. Extract the correct key C. Add faults to the circuit D. Prevent chip activation Correct Answer: B 46. What is the primary function of dummy cell insertion in split manufacturing? (Extended) A. Reduce power consumption B. Confuse attackers  C. Improve circuit speed D. Optimize chip layout Correct Answer: B 47. What is the role of 'clique size' in strong logic locking? (Extended) A. Measure circuit complexity B. Quantify lock interdependence C. Identify key sensitivity D. Determine netlist structure Correct Answer: B 48. Which logic locking technique introduces loops to confuse attackers? (Extended) A. Random Logic Locking (RLL) B. Fault Analysis Locking (FLL) C. Cyclic Logic Locking D. Hybrid Approach Correct Answer: C 49. What does FEOL stand for in split manufacturing? (Extended) A. Front-End-On-Line B. Front-End-Of-Line C. First-End-Of-Layer D. Forward-Energy-On-Line Correct Answer: B 50. How does netlist obfuscation help in split manufacturing? (Extended) A. By improving performance B. By hiding circuit details C. By increasing production speed  D. By reducing power usage Correct Answer: B 51. What is the purpose of SARLock in logic locking? (Extended) A. To create strong DIPs B. To produce weak DIPs C. To enhance circuit speed D. To reduce power consumption Correct Answer: B 52. Which phase in IC fabrication involves creating transistors and passive devices? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Packaging Correct Answer: B 53. What is the key idea behind Anti-SAT? (Extended) A. Increase key size B. Create complementary functions C. Reduce power usage D. Simplify netlist structure Correct Answer: B 54. What is a distinguishing feature of active IC metering? (Extended) A. It uses physical serial numbers B. It adds cryptographic locks C. It has no runtime control D. It relies on silicon variations Correct Answer: B 55. In split manufacturing, what does 'routing perturbation' achieve? (Extended) A. Shortens wire length B. Confuses attackers by modifying paths C. Reduces production cost D. Enhances chip speed Correct Answer: B 56. What is the primary goal of split manufacturing in hardware security? (Extended) A. Increase production speed B. Protect design confidentiality C. Reduce manufacturing costs D. Improve chip aesthetics Correct Answer: B 57. What does BEOL stand for in chip manufacturing? (Extended) A. Back-End-Of-Line B. Basic-End-Of-Line C. Binary-End-Of-Layer D. Backend-Layered-Operation Correct Answer: A 58. Which type of IC metering technique uses physical unclonable functions (PUFs)? (Extended) A. Active metering B. Passive unclonable metering C. Passive metering D. Runtime metering Correct Answer: C 59. What is a DIP in the context of SAT attacks? (Extended) A. Distinguishing Input Pattern B. Distributed Integration Protocol C. Digital Input Phase D. Device Integration Process Correct Answer: A 60. What is the purpose of output corruptibility in logic locking? (Extended) A. Measure output speed B. Assess output errors with incorrect keys C. Detect unauthorized users D. Increase circuit efficiency Correct Answer: B 61. How does fault masking occur in logic locking? (Extended) A. By adding random gates B. When wrong key bits cancel each other C. Through cryptographic protection D. When outputs remain unchanged Correct Answer: B 62. What is the main purpose of dummy branches in split manufacturing? (Extended) A. Reduce power consumption B. Slow proximity attacks C. Optimize chip layout D. Increase production speed Correct Answer: B 63. What is a major challenge of passive IC metering? (Extended)  A. High manufacturing costs B. Ease of cloning serial numbers C. Dependency on cryptography D. Limited scalability Correct Answer: B 64. Which of these is a feature of Anti-SAT logic locking? (Extended) A. Weak DIPs B. Large circuit delay C. Simplified design D. Direct fault injection Correct Answer: A 65. In split manufacturing, what is the main advantage of netlist obfuscation? (Extended) A. Reduces production cost B. Hides design structure C. Speeds up testing D. Improves circuit efficiency Correct Answer: B 66. What is the effect of increasing clique size in strong logic locking? (Extended) A. Increases power usage B. Reduces key interdependence C. Makes the circuit harder to break D. Speeds up brute-force attacks Correct Answer: C 67. What does the term 'functional obfuscation' mean in split manufacturing? (Extended) A. Changing circuit functionality  B. Confusing attackers about the circuit's purpose C. Adding dummy cells to the design D. Removing redundant logic Correct Answer: B 68. What is the primary goal of state-space obfuscation in active IC metering? (Extended) A. Hide internal states from unauthorized users B. Simplify state transitions C. Increase output speed D. Add cryptographic control Correct Answer: A 69. Which of the following is a drawback of brute-force attacks compared to SAT attacks? (Extended) A. Require less computation B. Slower to find keys C. Can identify DIPs easily D. Are less effective on simple circuits Correct Answer: B 70. What is the significance of wire elevation in split manufacturing? (Extended) A. Increases manufacturing complexity B. Reduces wire length C. Makes routing harder to interpret D. Enhances circuit speed Correct Answer: C 71. What is the main goal of logic locking in hardware security? (Extended) A. Reduce power consumption  B. Protect circuit designs C. Enhance chip speed D. Improve manufacturing processes Correct Answer: B 72. What does IC in IC Metering stand for? (Extended) A. Integrated Circuit B. Internal Configuration C. Input Code D. Intelligent Circuit Correct Answer: A 73. In split manufacturing, which phase is typically handled by a high-end foundry? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Testing Correct Answer: B 74. Which of the following is an example of passive IC metering? (Extended) A. External control via cryptography B. Adding unique serial numbers C. Embedding finite state machines D. Active runtime control Correct Answer: B 75. What does a SAT attack primarily aim to do? (Extended) A. Slow down the chip B. Extract the correct key  C. Add faults to the circuit D. Prevent chip activation Correct Answer: B 76. What is the primary function of dummy cell insertion in split manufacturing? (Extended) A. Reduce power consumption B. Confuse attackers C. Improve circuit speed D. Optimize chip layout Correct Answer: B 77. What is the role of 'clique size' in strong logic locking? (Extended) A. Measure circuit complexity B. Quantify lock interdependence C. Identify key sensitivity D. Determine netlist structure Correct Answer: B 78. Which logic locking technique introduces loops to confuse attackers? (Extended) A. Random Logic Locking (RLL) B. Fault Analysis Locking (FLL) C. Cyclic Logic Locking D. Hybrid Approach Correct Answer: C 79. What does FEOL stand for in split manufacturing? (Extended) A. Front-End-On-Line B. Front-End-Of-Line C. First-End-Of-Layer  D. Forward-Energy-On-Line Correct Answer: B 80. How does netlist obfuscation help in split manufacturing? (Extended) A. By improving performance B. By hiding circuit details C. By increasing production speed D. By reducing power usage Correct Answer: B 81. What is the purpose of SARLock in logic locking? (Extended) A. To create strong DIPs B. To produce weak DIPs C. To enhance circuit speed D. To reduce power consumption Correct Answer: B 82. Which phase in IC fabrication involves creating transistors and passive devices? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Packaging Correct Answer: B 83. What is the key idea behind Anti-SAT? (Extended) A. Increase key size B. Create complementary functions C. Reduce power usage D. Simplify netlist structure Correct Answer: B 84. What is a distinguishing feature of active IC metering? (Extended) A. It uses physical serial numbers B. It adds cryptographic locks C. It has no runtime control D. It relies on silicon variations Correct Answer: B 85. In split manufacturing, what does 'routing perturbation' achieve? (Extended) A. Shortens wire length B. Confuses attackers by modifying paths C. Reduces production cost D. Enhances chip speed Correct Answer: B 86. What is the primary goal of split manufacturing in hardware security? (Extended) A. Increase production speed B. Protect design confidentiality C. Reduce manufacturing costs D. Improve chip aesthetics Correct Answer: B 87. What does BEOL stand for in chip manufacturing? (Extended) A. Back-End-Of-Line B. Basic-End-Of-Line C. Binary-End-Of-Layer D. Backend-Layered-Operation Correct Answer: A 88. Which type of IC metering technique uses physical unclonable functions (PUFs)? (Extended) A. Active metering B. Passive unclonable metering C. Passive metering D. Runtime metering Correct Answer: C 89. What is a DIP in the context of SAT attacks? (Extended) A. Distinguishing Input Pattern B. Distributed Integration Protocol C. Digital Input Phase D. Device Integration Process Correct Answer: A 90. What is the purpose of output corruptibility in logic locking? (Extended) A. Measure output speed B. Assess output errors with incorrect keys C. Detect unauthorized users D. Increase circuit efficiency Correct Answer: B 91. How does fault masking occur in logic locking? (Extended) A. By adding random gates B. When wrong key bits cancel each other C. Through cryptographic protection D. When outputs remain unchanged Correct Answer: B 92. What is the main purpose of dummy branches in split manufacturing? (Extended)  A. Reduce power consumption B. Slow proximity attacks C. Optimize chip layout D. Increase production speed Correct Answer: B 93. What is a major challenge of passive IC metering? (Extended) A. High manufacturing costs B. Ease of cloning serial numbers C. Dependency on cryptography D. Limited scalability Correct Answer: B 94. Which of these is a feature of Anti-SAT logic locking? (Extended) A. Weak DIPs B. Large circuit delay C. Simplified design D. Direct fault injection Correct Answer: A 95. In split manufacturing, what is the main advantage of netlist obfuscation? (Extended) A. Reduces production cost B. Hides design structure C. Speeds up testing D. Improves circuit efficiency Correct Answer: B 96. What is the effect of increasing clique size in strong logic locking? (Extended) A. Increases power usage  B. Reduces key interdependence C. Makes the circuit harder to break D. Speeds up brute-force attacks Correct Answer: C 97. What does the term 'functional obfuscation' mean in split manufacturing? (Extended) A. Changing circuit functionality B. Confusing attackers about the circuit's purpose C. Adding dummy cells to the design D. Removing redundant logic Correct Answer: B 98. What is the primary goal of state-space obfuscation in active IC metering? (Extended) A. Hide internal states from unauthorized users B. Simplify state transitions C. Increase output speed D. Add cryptographic control Correct Answer: A 99. Which of the following is a drawback of brute-force attacks compared to SAT attacks? (Extended) A. Require less computation B. Slower to find keys C. Can identify DIPs easily D. Are less effective on simple circuits Correct Answer: B 100. What is the significance of wire elevation in split manufacturing? (Extended) A. Increases manufacturing complexity  B. Reduces wire length C. Makes routing harder to interpret D. Enhances circuit speed Correct Answer: C 101. What is the main goal of logic locking in hardware security? (Extended) A. Reduce power consumption B. Protect circuit designs C. Enhance chip speed D. Improve manufacturing processes Correct Answer: B 102. What does IC in IC Metering stand for? (Extended) A. Integrated Circuit B. Internal Configuration C. Input Code D. Intelligent Circuit Correct Answer: A 103. In split manufacturing, which phase is typically handled by a high-end foundry? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Testing Correct Answer: B 104. Which of the following is an example of passive IC metering? (Extended) A. External control via cryptography B. Adding unique serial numbers  C. Embedding finite state machines D. Active runtime control Correct Answer: B 105. What does a SAT attack primarily aim to do? (Extended) A. Slow down the chip B. Extract the correct key C. Add faults to the circuit D. Prevent chip activation Correct Answer: B 106. What is the primary function of dummy cell insertion in split manufacturing? (Extended) A. Reduce power consumption B. Confuse attackers C. Improve circuit speed D. Optimize chip layout Correct Answer: B 107. What is the role of 'clique size' in strong logic locking? (Extended) A. Measure circuit complexity B. Quantify lock interdependence C. Identify key sensitivity D. Determine netlist structure Correct Answer: B 108. Which logic locking technique introduces loops to confuse attackers? (Extended) A. Random Logic Locking (RLL) B. Fault Analysis Locking (FLL) C. Cyclic Logic Locking  D. Hybrid Approach Correct Answer: C 109. What does FEOL stand for in split manufacturing? (Extended) A. Front-End-On-Line B. Front-End-Of-Line C. First-End-Of-Layer D. Forward-Energy-On-Line Correct Answer: B 110. How does netlist obfuscation help in split manufacturing? (Extended) A. By improving performance B. By hiding circuit details C. By increasing production speed D. By reducing power usage Correct Answer: B 111. What is the purpose of SARLock in logic locking? (Extended) A. To create strong DIPs B. To produce weak DIPs C. To enhance circuit speed D. To reduce power consumption Correct Answer: B 112. Which phase in IC fabrication involves creating transistors and passive devices? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Packaging Correct Answer: B 113. What is the key idea behind Anti-SAT? (Extended) A. Increase key size B. Create complementary functions C. Reduce power usage D. Simplify netlist structure Correct Answer: B 114. What is a distinguishing feature of active IC metering? (Extended) A. It uses physical serial numbers B. It adds cryptographic locks C. It has no runtime control D. It relies on silicon variations Correct Answer: B 115. In split manufacturing, what does 'routing perturbation' achieve? (Extended) A. Shortens wire length B. Confuses attackers by modifying paths C. Reduces production cost D. Enhances chip speed Correct Answer: B 116. What is the primary goal of split manufacturing in hardware security? (Extended) A. Increase production speed B. Protect design confidentiality C. Reduce manufacturing costs D. Improve chip aesthetics Correct Answer: B 117. What does BEOL stand for in chip manufacturing? (Extended) A. Back-End-Of-Line B. Basic-End-Of-Line C. Binary-End-Of-Layer D. Backend-Layered-Operation Correct Answer: A 118. Which type of IC metering technique uses physical unclonable functions (PUFs)? (Extended) A. Active metering B. Passive unclonable metering C. Passive metering D. Runtime metering Correct Answer: C 119. What is a DIP in the context of SAT attacks? (Extended) A. Distinguishing Input Pattern B. Distributed Integration Protocol C. Digital Input Phase D. Device Integration Process Correct Answer: A 120. What is the purpose of output corruptibility in logic locking? (Extended) A. Measure output speed B. Assess output errors with incorrect keys C. Detect unauthorized users D. Increase circuit efficiency Correct Answer: B 121. How does fault masking occur in logic locking? (Extended)  A. By adding random gates B. When wrong key bits cancel each other C. Through cryptographic protection D. When outputs remain unchanged Correct Answer: B 122. What is the main purpose of dummy branches in split manufacturing? (Extended) A. Reduce power consumption B. Slow proximity attacks C. Optimize chip layout D. Increase production speed Correct Answer: B 123. What is a major challenge of passive IC metering? (Extended) A. High manufacturing costs B. Ease of cloning serial numbers C. Dependency on cryptography D. Limited scalability Correct Answer: B 124. Which of these is a feature of Anti-SAT logic locking? (Extended) A. Weak DIPs B. Large circuit delay C. Simplified design D. Direct fault injection Correct Answer: A 125. In split manufacturing, what is the main advantage of netlist obfuscation? (Extended) A. Reduces production cost  B. Hides design structure C. Speeds up testing D. Improves circuit efficiency Correct Answer: B 126. What is the effect of increasing clique size in strong logic locking? (Extended) A. Increases power usage B. Reduces key interdependence C. Makes the circuit harder to break D. Speeds up brute-force attacks Correct Answer: C 127. What does the term 'functional obfuscation' mean in split manufacturing? (Extended) A. Changing circuit functionality B. Confusing attackers about the circuit's purpose C. Adding dummy cells to the design D. Removing redundant logic Correct Answer: B 128. What is the primary goal of state-space obfuscation in active IC metering? (Extended) A. Hide internal states from unauthorized users B. Simplify state transitions C. Increase output speed D. Add cryptographic control Correct Answer: A 129. Which of the following is a drawback of brute-force attacks compared to SAT attacks? (Extended) A. Require less computation  B. Slower to find keys C. Can identify DIPs easily D. Are less effective on simple circuits Correct Answer: B 130. What is the significance of wire elevation in split manufacturing? (Extended) A. Increases manufacturing complexity B. Reduces wire length C. Makes routing harder to interpret D. Enhances circuit speed Correct Answer: C 131. What is the main goal of logic locking in hardware security? (Extended) A. Reduce power consumption B. Protect circuit designs C. Enhance chip speed D. Improve manufacturing processes Correct Answer: B 132. What does IC in IC Metering stand for? (Extended) A. Integrated Circuit B. Internal Configuration C. Input Code D. Intelligent Circuit Correct Answer: A 133. In split manufacturing, which phase is typically handled by a high-end foundry? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL)  C. Masking D. Testing Correct Answer: B 134. Which of the following is an example of passive IC metering? (Extended) A. External control via cryptography B. Adding unique serial numbers C. Embedding finite state machines D. Active runtime control Correct Answer: B 135. What does a SAT attack primarily aim to do? (Extended) A. Slow down the chip B. Extract the correct key C. Add faults to the circuit D. Prevent chip activation Correct Answer: B 136. What is the primary function of dummy cell insertion in split manufacturing? (Extended) A. Reduce power consumption B. Confuse attackers C. Improve circuit speed D. Optimize chip layout Correct Answer: B 137. What is the role of 'clique size' in strong logic locking? (Extended) A. Measure circuit complexity B. Quantify lock interdependence C. Identify key sensitivity  D. Determine netlist structure Correct Answer: B 138. Which logic locking technique introduces loops to confuse attackers? (Extended) A. Random Logic Locking (RLL) B. Fault Analysis Locking (FLL) C. Cyclic Logic Locking D. Hybrid Approach Correct Answer: C 139. What does FEOL stand for in split manufacturing? (Extended) A. Front-End-On-Line B. Front-End-Of-Line C. First-End-Of-Layer D. Forward-Energy-On-Line Correct Answer: B 140. How does netlist obfuscation help in split manufacturing? (Extended) A. By improving performance B. By hiding circuit details C. By increasing production speed D. By reducing power usage Correct Answer: B 141. What is the purpose of SARLock in logic locking? (Extended) A. To create strong DIPs B. To produce weak DIPs C. To enhance circuit speed D. To reduce power consumption Correct Answer: B 142. Which phase in IC fabrication involves creating transistors and passive devices? (Extended) A. Back-End-Of-Line (BEOL) B. Front-End-Of-Line (FEOL) C. Masking D. Packaging Correct Answer: B 143. What is the key idea behind Anti-SAT? (Extended) A. Increase key size B. Create complementary functions C. Reduce power usage D. Simplify netlist structure Correct Answer: B 144. What is a distinguishing feature of active IC metering? (Extended) A. It uses physical serial numbers B. It adds cryptographic locks C. It has no runtime control D. It relies on silicon variations Correct Answer: B 145. In split manufacturing, what does 'routing perturbation' achieve? (Extended) A. Shortens wire length B. Confuses attackers by modifying paths C. Reduces production cost D. Enhances chip speed Correct Answer: B 146. What is the primary goal of split manufacturing in hardware security? (Extended) A. Increase production speed B. Protect design confidentiality C. Reduce manufacturing costs D. Improve chip aesthetics Correct Answer: B 147. What does BEOL stand for in chip manufacturing? (Extended) A. Back-End-Of-Line B. Basic-End-Of-Line C. Binary-End-Of-Layer D. Backend-Layered-Operation Correct Answer: A 148. Which type of IC metering technique uses physical unclonable functions (PUFs)? (Extended) A. Active metering B. Passive unclonable metering C. Passive metering D. Runtime metering Correct Answer: C 149. What is a DIP in the context of SAT attacks? (Extended) A. Distinguishing Input Pattern B. Distributed Integration Protocol C. Digital Input Phase D. Device Integration Process Correct Answer: A 150. What is the purpose of output corruptibility in logic locking? (Extended)  A. Measure output speed B. Assess output errors with incorrect keys C. Detect unauthorized users D. Increase circuit efficiency Correct Answer: B