flashcards_extreme_environments.csv

Term,Explanation Electromagnetic Compatibility (EMC),The ability of devices to operate correctly in an electromagnetic environment without causing or suffering from interference. Semiconductor Bandgap,The energy needed to move a valence electron to a conduction state; decreases with increasing tempe...

Term,Explanation Electromagnetic Compatibility (EMC),The ability of devices to operate correctly in an electromagnetic environment without causing or suffering from interference. Semiconductor Bandgap,The energy needed to move a valence electron to a conduction state; decreases with increasing temperature. Total Ionizing Dose (TID),"Accumulation of ionizing radiation that can cause degradation in electronic components, especially in space applications." Single Event Effects (SEE),"Effects caused by high-energy particles interacting with electronic devices, causing errors, particularly in space environments." Thermal Expansion,"The increase in material size due to rising temperatures, potentially causing mechanical stress when materials with different expansion rates are combined." Burn-in Process,A stress-testing process where components are aged under extreme conditions to eliminate early failures before use. Intrinsic Carrier Concentration,The number of charge carriers in a semiconductor material at thermal equilibrium; increases with temperature. Packaging Failures in Electronics,"Failures caused by thermal expansion, humidity, and mechanical stress in semiconductor packaging, often leading to wire bond breakage or cracking." Thermal Shock,"The sudden change in temperature that causes extreme stress in materials, leading to cracks or failures." Electromagnetic Interference (EMI),"Unwanted disturbance caused by electromagnetic radiation, which affects the performance of electronic devices." Popcorning in Semiconductor Packaging,"A failure in surface-mount packages caused by moisture absorbed during soldering, resulting in internal damage such as cracking or wire bond failure." Differential Mode Interference,"A type of interference where two or more conductors carry currents of opposite polarity, leading to performance degradation." Vibration-Induced Mechanical Damage,"Mechanical stress caused by vibrations, often resulting in material fatigue or decreased precision in sensitive equipment." Corrosion in Extreme Environments,"Chemical deterioration of materials, particularly metals, in environments with moisture, salts, or aggressive chemicals." Galvanic Corrosion,"Corrosion occurring when two different metals are in contact with an electrolyte, causing the more reactive metal to corrode." Passive Heat Management Techniques,"Methods such as material selection, heat sinks, and insulation that rely on natural heat dissipation without external power." Active Heat Management Techniques,"Methods that use external energy to control temperature, such as fans, pumps, or Peltier elements." Corrosion in Polymers,"Degradation in polymers caused by environmental factors, leading to swelling, brittleness, or chemical breakdown." Thermal Conductivity,"The ability of a material to conduct heat, critical in selecting materials for high-temperature environments." Multilayer Insulation (MLI),"A thermal management system using multiple layers of insulation to reduce heat loss, commonly used in space environments." Moisture Absorption in Polymers,"The tendency of polymers to absorb moisture, which can lead to swelling, softening, and reduced mechanical performance." Highly Accelerated Life Test (HALT),A stress-testing method used to find potential weaknesses in a product by exposing it to extreme conditions beyond normal use. Reliability Engineering,The discipline focused on ensuring that systems perform their required functions without failure over a given period. Radiation-Induced Conductivity (RIC),An increase in the conductivity of insulating materials when exposed to high-energy radiation. Ionizing Radiation,"Radiation with enough energy to remove electrons from atoms, creating ions and potentially damaging electronic components." Capacitive Coupling,"Unwanted transfer of electrical energy between circuits due to the capacitance between conductors, which can cause interference." Common Mode Choke,A device used to block common-mode interference while allowing differential-mode signals to pass. Subsea Electronics,"Electronics designed for deep-sea environments, often enclosed in pressure-tolerant vessels to protect them from water and pressure." Inductive Coupling,"The transfer of energy between circuits through a shared magnetic field, which can induce interference in sensitive circuits." Accuracy in Measurement Systems,"The closeness of a measurement to the true value of the quantity being measured, including both systematic and random errors." Thermal Expansion Coefficient (CTE),"A material property that determines the extent of thermal expansion, critical when combining materials with different CTEs." Humidity-Induced Corrosion,"Corrosion caused by the presence of moisture in the environment, which accelerates the oxidation process, especially in metals." Heat Transfer Mechanisms,"The three primary modes of heat transfer: conduction, convection, and radiation, important in managing temperature in systems." Environmental Stress Screening (ESS),A testing process used to expose components to environmental stresses such as temperature and vibration to identify early failures. Fracture in Semiconductors,"The breaking of semiconductor material due to mechanical stress, often from thermal expansion or vibration in extreme environments." Popcorn Effect in ICs,"Failure in integrated circuits (ICs) caused by moisture expansion during soldering, which can cause delamination or cracking." Vibration Damping,"Techniques used to reduce the amplitude of vibrations in sensitive electronic equipment, often through isolation or damping systems." Electronic Noise,"Unwanted electrical signals that interfere with the desired operation of a circuit, often caused by electromagnetic interference or environmental factors." Resistive Coupling,"Interference caused by shared impedance between circuits, which can lead to performance issues in sensitive systems." Grounding Systems,The method of connecting electronic components to a common ground to prevent interference and provide a stable reference voltage. Ionizing Radiation Shielding,"Materials or designs used to protect electronic components from ionizing radiation, commonly used in space applications." Thermal Degradation of Polymers,"The breakdown of polymer materials when exposed to high temperatures, often leading to loss of mechanical properties." Electrical Discharges in Vacuum,"Phenomena in vacuum environments where electrical discharges can occur due to high voltage differences, affecting electronics." Thermoelectric Cooling,"A cooling technology using Peltier elements to transfer heat through the use of electricity, providing precise temperature control." Conductive Heat Transfer,"The transfer of heat through direct contact between materials, important in high-temperature applications." Corrosion-Resistant Alloys,"Alloys designed to resist corrosion, often used in harsh environments such as marine or chemical processing industries." Electromagnetic Coupling,"The transfer of electromagnetic energy between circuits, which can cause interference and reduce signal integrity." Corrosion-Induced Cracking,"Cracking in materials caused by the combined effects of corrosion and mechanical stress, leading to structural failure." Pitting Corrosion,"A localized form of corrosion that creates small pits or holes in a material, often leading to structural weaknesses." Seismic Vibrations,"Vibrations caused by seismic activity, which can affect sensitive electronic systems, especially in laboratory or industrial settings."