IC Technology PDF

IC Technology hnologș  TheI Market The semiconductor industry is approaching $300B/yr in sales 296 Communications...

IC Technology hnologș  TheI Market The semiconductor industry is approaching $300B/yr in sales 296 Communications 24°4 Industrial Consumer Electronics B% 16% Courtesy of Dr.Bill Flounders, UC Berkeley Micralab e I Integrateö oreusUOlly called ICS ond popufcirïy known zso SÌIICOR Integrated Integrated Circuits Circuits (ICs) (ICs) Integrated Circuit are the tiny electronic circuits used to performa specific electronic function, such as amplification, mathematic operations, switching, mixing signals, computer memory, timer, counter etc. An IC An is a collection IC isa collection ofof electronic electronic components components -- -- resistors, transistors, resistors, transistors, capacitors, capacitors, etc. -- all etc. -- all stuffed into stuffed into aa tiny tiny chip, chip, and and connected together to connected together to achieve achieveaa common common goal.goal. They They come in all sorts come inall sorts of flavors: single-circuit of flavors: logic single-circuit logic gates, op gates, op amps, amps, 555 timers, voltage 555 timers, voltage regulators, regulators, motor motor controllers, microcontrollers, microprocessors, controllers, microcontrollers, microprocessors, FPGAs, FPGAs, etc. etc. Integrated Integrated Circuits Circuits (ICs) (ICs) are are also known as also known microchips or asmicrochips microelectronic circuit, or microelectronic it isa circuit, it is a semiconductor wafer that semiconductor wafer that holds holds thousands thousands and millions of and millions resistors, capacitors, of resistors, capacitors, and transistors. It and transistors. is It is basically an basically an assembly assembly of electronic components ofelectronic that’s fabricated components that's fabricated as asaa single unit. single unit. Integrated Integrated Circuits Circuits (ICs) (ICs) Several hundred identical integrated circuits (ICs) are made ata time ona thin wafer which in several centimeters wide, and the wafer is subsequently sliced into individual ICs called chips. What advantages do ICs have over discrete components? Y Size: Sub-micron vs. millimeter/centimeter. S Speed and Power:Smaller si7.e of IC comRof2ents yields higher speed and lower power consumption due to smaller parasitic resistances, capacitances and inductances. Switching between ‘0’ and 1 much faster on chip than between chips. Lower power consumption => less heat => cheaper power supplies => reduced system cost. ¥ Integrated circuit manufacturing is versatile. Simply change themask to change thedesign. However, designing the layout (changing the masks) is usually the most time consuming task in IC design. Insi e Inside Integrated rcuits (ICs) Circuits ICs) Ref: Hitachi-hightech Hitachi-hiehtech Insi e Inside Integrated Integrated Circuits (ICs) The image above then shows how The how an IC chip looks like under an X-ray through 3D 3D rendering, it features complex structures with multiple layers that forms an IC Cchip. h'p- Ref: Physics Phvsics world Integrated Integrated Circuits Circuits (ICs) (ICs) 555 TIMER ICAND ITSEQUIVALENT CIRCUIT s I  vnn on Early developments of the Integrated Circuit (IC) go back to1949. German engineer Werner Jacobi fileda patent for an IC like semiconductor amplifying device showing five transistors on a common substrate in a 2-stage amplifier arrangement. Jacobi disclosed small cheap of hearing aids.  Integrated circuit invented September 12th 1958 Jack Kilby at Tez¢as instrument had built a simple oscillator IC with five integrated components (resistors, capacitors, distributed capacitors and transistors) ’ In 2000 the importance of the IC was recognized when Kilby shared the Nobel prize in physics with two others. Kilby was sited by the Nobel committee "for his part in the invention of the integrated circuit”  1904.u‘iiiiiiit tilt, iliorlt; large expensive, power- Fleming 1906 Vacuum triode hungry, unreliable William Shockley 1945 Semiconductor replacing (Bell labs) vacuum tube Bardeen and 1947 Point Contact transfer Driving factor of growth Brattain and resistance device “BJT” oftheVLSI technology Shockley (Bell labs) \\ pi-ilc'i ,Jilclilii 1949 l*t IC containing No commercial use (Siemens AG) amplifying Device reported 2stage amplifief Shockley 1951 Junction Transistor “Practical form of transistor” Jack Kilby July 1958 Integrated Circuits FI Father of IC design (Texas Instruments) With 2-T Germanium slice and guld wires  ICTechnolu›gy Noyce Dec. 1958 Integrated “The Mayor of Circuits Silicon Valley” Silicon Kahng 1960 First MOSFET Start of new era for Bell Lab semiconductor industry 1061 First Commercial IC And Texas Frank Wanlass l9ó3 CMOS (Fairchíld Semictinductor) 1968 Silicon gate IC Later Juined Intel to technology lead first CPU Intel (Fairchild Semiconductor) 4004 in 1970 2300T on 9mm2 Zarlink Recently M2A capsule for take photographs of Semiconductors endoscopy digestive tract 2/sec.  Poly Pentium Penñum 5O0— III 1,400-  How semiconductor industry have achieved the complex integrated circuits? 1. Moore's Law. 2. Continuous technology Scaling. Figure Bigure 1. In 1962, four woccen women programmers prograccccers hold hoIB parts pads of of the first four Army computers. thefirst coccputers. From Frocc left is the the ENIAC board, EDVAC board, ORDVAC board, and anB the BRLESC-I board. boarB. Image courtesy coui4esy of the US Army. US Arccy.  1965 M‹ ure's law “Cramming more components onto integrated circuits”. Gordon E.Moore chairman Emeritus of’ Intel Corporation 7 1965 - observed trends in industry - of transistors on ICs vs. release dates: R Noticed number oftransistors doubling with release of each new IC generation R release dates (separate generations) were all 18-24 months apart S Moore's Law: R “The number oftransistors on an integrated circuit will double every 18 months” The level of integration of silicon technology as measured interms ofnumber ofdevices per IC 7 Semiconductor industry has followed this prediction with surprising accuracy.  90zm 65nm 130nm 32nm 22nm 45nm 1. Increase device packing density-reduces area 2. Improve frequency response o l/L 3. Improve drive current 4. To improve power efficiency  Full Scaling (Constant Electric Field Scaling) S Inreality constant field scaling has not been observed strictly. Since the transistor current is proportional to the gate overdrive. 7 High performance demands have dictated the use of higher supply voltage. S However, higherVDD implies increased power dissipation. S Improved performance is due to the reduced capacitance.  Then >130nm Now