Describe each of the following defects in soldering, stating the cause for each: air pockets, floaters, balls.

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Understand the Problem

The question requires a description of several defects related to soldering, and the causes of each. The defects to describe are air pockets, floaters, and balls.

Answer

Air pockets (voids) are caused by contamination or poor wetting. Floaters (component floating) uneven surface tension. Solder balls are caused by gassing and spitting of the flux, solder bouncing back, or poor pad design.

Here are the descriptions of the soldering defects and their causes:

  • Air Pockets (Voids): These are gaps or holes within the solder joint. They are caused by contamination or poor wetting.
  • Floaters: This term is not standard in soldering defect terminology. It may refer to component floating, where a component lifts from the PCB during soldering due to uneven surface tension, or tombstoning.
  • Solder Balls: These are small spheres of solder that appear on the board, away from the intended joint. They are caused by gassing and spitting of the flux, solder bouncing back from the solder wave, or improper pad design.
Answer for screen readers

Here are the descriptions of the soldering defects and their causes:

  • Air Pockets (Voids): These are gaps or holes within the solder joint. They are caused by contamination or poor wetting.
  • Floaters: This term is not standard in soldering defect terminology. It may refer to component floating, where a component lifts from the PCB during soldering due to uneven surface tension, or tombstoning.
  • Solder Balls: These are small spheres of solder that appear on the board, away from the intended joint. They are caused by gassing and spitting of the flux, solder bouncing back from the solder wave, or improper pad design.

More Information

Defects in soldering can compromise the integrity and reliability of electrical connections, leading to potential failures of electronic devices.

Tips

It is important to use proper soldering techniques and materials to avoid these defects.

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