URM112 Introduction to Computers Quiz

URM112 Introduction to Computers - Lecture 3, Lecture 28, Week 5

• Course: URM112 Introduction to Computers
• Department: Computer Science
• Week: 5
• Lecture: 3, Lecture 28
• Fall 2024

Motherboard

• Definition: The main electronic board that connects all parts of a computer and allows communication among them.
• Components: CPU, power, disk interfaces, external ports, memory slots, expansion slots, CMOS battery.

Form Factor

• Definition: A specification of physical dimensions and layouts that helps ensure hardware works with products that support that form factor.
• Purpose: Prevents incompatibilities between hardware manufacturers.
• Examples: Standard-ATX (12" x 9.6"), Micro-ATX (9.6" x 9.6"), Mini-ITX (6.7" x 6.7"), Pico-ITX (3.8" x 2.8"), Nano-ITX (4.7" x 4.7").

Bus

• Definition: A collection of wires through which data is transmitted from one part of a computer to another.
• Types: Internal bus (local bus) and External bus (expansion bus).
• Internal bus: Allows communication between internal components (e.g., video card, memory).
• External bus: Enables communication with external components (e.g., USB, SCSI).

BIOS (Basic Input/Output System)

• Location: Chip located on all motherboards.
• Function: Contains instructions and setup for how the system boots and operates.
• POST (Power On Self Test): A test that helps the computer boot up properly.
• Malfunction Indication: Combination of beeps indicates what is malfunctioning within the computer.

CMOS (Complementary Metal-Oxide-Semiconductor)

• Location: On the motherboard.
• Function: Stores any configuration changes made to the default BIOS settings.
• Power Source: Small battery.
• Resetting BIOS: Removing the motherboard battery for a few minutes restores default BIOS settings.

CPU Socket

• Definition: A mechanical component that provides mechanical and electrical connections between a microprocessor and the motherboard.
• Construction: Made of plastic, a lever/latch, and metal contacts for CPU pins/lands.
• Examples: AMD "AM3" Socket, Intel® LGA "1366" Socket.

Memory Banks

• Location: Area of the motherboard containing slots for memory modules.
• Organization: Double sided (single or double sided memory modules), numbered banks.
• Units: Organized into units representing the minimum number of memory chips working in tandem.

North Chipset

• Also called the North Bridge.
• Function: Connects the CPU to memory and the AGP or PCI-e bus.
• Communication: Communicates with the CPU through the Front Side Bus (FSB).

South Chipset

• Also called the South Bridge.
• Function: Controls all I/O (input/output) functions (e.g., USB, audio, serial, system BIOS, ISA bus, interrupt controller, IDE/SATA channels).
• Connection: Connects with the North chipset via Direct Media Interface (DMI).

Front Side Bus (FSB)

• Function: Used in Core 2 Quad/Duo processors and earlier to communicate the processor with other components (e.g., memory, PCIe, video, I/O devices like USB, hard disk, network) using the north chipset

Direct Media Interface (DMI)

• Used in Intel Core i Series processors.
• Function: Provides communication channels between the processor (with RAM and PCIe), and other computer components.
• Impact: Increases performance.

PCI Express Connectors

• Replaces PCI and AGP.
• Data Transmission: Sends data over lanes in full duplex mode (both directions simultaneously).
• Bandwidth: Capability of around 250 MBps per lane, scalable from 1 to 32 lanes.
• Example connectors: x1, x2, x4, x8, x12, x16, and x32.

PCIe

• Peripheral Component Interconnect Express
• Purpose: Connects devices like sound, network, video, satellite, modem cards, and customized cards with special devices.

Parallel ATA (PATA)

• Physical storage interface.
• Devices: Hard drives and optical drives.
• Transfer Rate: Up to 100 MBps.

Serial ATA (SATA)

• Storage interface (hard drives and optical drives),
• Replacement for PATA.
• Transfer Rate: Up to 6 Gbps (600 MBps) per drive.

Audio Modem Riser (AMR)

• Functionality: Provides analog functionality like sound cards and modems on an expansion card.

Communication and Networking Riser (CNR)

• Function: Developed for ATX family motherboards to implement LAN, home networking, audio, and modem systems in modern PCs

Throughput

• Definition: The total amount of data transferred through a computer or device per second (bps) or bytes per second (Bps).
• Key figures for various buses or components are given at the relevant sections.

Connectors (Rear I/O)

• Components: Keyboard/mouse, USB2, USB3, Firewire, eSATA, display, network (RJ-45), and audio.

Processor (CPU)

• Definition: The brains of the computer, where most calculations occur.
• Core Element: Most important element of a computer system.

CPU Components

• I/O Unit: Allows data and instruction flow in and out of the CPU.
• Control Unit: Manages operations inside the CPU.
• ALU (Arithmetic Logic Unit): Manages calculations in the CPU.
• Cache Memory: High-speed storage area that holds data ready for processing.
• Registers: High-speed storage units to hold memory addresses.

Cache Memory

• Types: L1 (on-chip, fastest), L2, L3 (off-chip, slower).
• Function: Speeds up processing power by storing data frequently accessed by the CPU.

CPU Speed

• Measurement: Hertz (Hz).
• Represents: The number of cycles the CPU can process per second.
• Overclocking: Running the CPU faster than recommended speed.
• Dynamic Frequency Scaling (throttling): Automatically adjusts CPU speed to reduce heat and conserve energy.
• Processor Width: Number of data bits transferred by the internal bus simultaneously.

Threading

• Single threading: A single core processes one instruction at a time.
• Hyperthreading/Multithreading: A single core processes two or more instructions simultaneously.

Pipelining

• Technique: Microprocessor starts executing a second instruction before the first is complete.
• Processing: Multiple instructions are processed simultaneously (each in a different processing stage) in the pipeline.

Multi-Core Processors

• Design: Building two or more CPU cores onto a single chip.
• Benefit: Each core has its own dedicated resources (e.g., processing power) improving overall performance.

Intel® Socket Types

• List of various Intel processor socket types.

AMD® Socket Types

• List of various AMD processor socket types.

Cooling

• Techniques: Using heat sinks, fans, and thermal paste (heat sink compound).
• Purpose: Removes heat generated by the CPU.

Memory

• Hierarchy: RAM (Random Access Memory) at the top, branching into DRAM types (DRAM, SDRAM, DDR, RDRAM, DDR2, DDR3, DDR4) , and SRAM.
• ROM (Read-Only Memory) at the other branch: EPROM,EEPROM, PROM.

Random Access Memory (RAM)

• Definition: Computer storage that allows fast access to information from random locations on a memory module; system memory
• Function: Stores information needed during operation.

Memory Types

• SRAM (Static Random Access Memory)
• DRAM (Dynamic Random Access Memory)

SRAM Types

• Async SRAM: An older type, not dependent on the system clock.
• Sync SRAM: Synchronized with the system clock for faster operation.
• Pipeline Burst SRAM: Common type operating above 66 MHz.

DRAM Types

• Fast Page Mode (FPM DRAM), Extended Data Out (EDO DRAM), Burst EDO (BEDO DRAM)
• RDRAM (Rambus DRAM): Transfers data at up to 800 MHz.
• SDRAM (Synchronous DRAM): Synchronized with CPU bus, operating at 133 MHz; 3x faster than FPM; 2x faster than EDO/BEDO.
• DDR SDRAM (Double Data Rate SDRAM): Transfers data on both edges of clock cycle, which effectively doubles memory chip's throughput.

DDR SDRAM Types

• Various types depending on clock speed, data rate, and voltage.

DDR

• Voltage: 2.5V
• Transfer Rate: Transfers bits between memory array and I/O buffer; DDR module has 184 pins.

DDR2

• Voltage: 1.8V
• Transfer Rate: Transfers four bits between memory array and I/O buffer; DDR2 module has 240 pins.

DDR3

• Voltage: 1.5V
• Transfer Rate: Transfers eight bits between memory array and I/O buffer; DDR3 module has 240 pins.

DDR4

• Voltage: 1.2V
• Transfer Rate: Transfers 16 bits between memory array and I/O buffer; DDR4 module has 288 pins.

Power Supply

• Function: Converts Alternating Current (AC) to Direct Current (DC) and regulates voltage.
• Components: Power Supply Connectors,Wattage, Size, Connectors.
• Connector Types: 20-pin P1, 24-pin P1, PCIe (6 or 8-pin), Molex, Mini/Floppy (12V or 5V), and SATA

PC Performance

• Factors: Processor, memory (RAM and controller), hard drive, video card.
• Performance depends on components' specifications and use cases.
• Additional factors affecting performance from recent lecture: Swapping, multitasking, Upgrade and maintenance factors

Storage Devices

• Devices are used for storing data.
• Examples: Hard drive, optical devices, removable devices, external devices
• Types: Magnetic, Optical, Flash Memory, and Hybrid

Magnetic Storage

• Storage type/devices: Floppy Disks, Zip Disks, Hard Disk Drive (HDD), Storage Controllers, Host Bus Adapters (HBAs).
• Types of storage: Cluster size is a factor in performance in all these types. Hard Disk Drive Performance is defined by several factors

Optical Storage

• Types: Compact Disk (CD), Digital Versatile Disk (DVD), Blu-Ray (BL).
• Function: Use lasers to read and write to optical disks.

Flash Memory

• Type of storage device: Solid State Drives (SSDs), USB Flash Memory Drives, Memory Card.
• Use Case: Portable storage; fast accessing, no moving parts.

Hybrid Drives

• Composition: Use non-volatile flash memory to cache data during normal use, HDD.
• Function: Speeds up booting and data access.

File System

• Definition: An index or database that stores the physical location of every data piece on a hard drive or storage device; controls how data are store and retrieved, logical storage unit.
• FAT (File Allocation Table)
• FAT32: Most common version of FAT, read/write compatible with recent operating systems.
• NTFS (New Technology File System): More advanced file storage format than FAT, offers improved function over FAT.
• exFAT: Optimized for flash drives; lightweight.

Cluster Size

• Definition of cluster is in relation to hard disk structure and file system organization.
• The size is set automatically during partitioning.
• A smaller cluster size saves space.

Test your knowledge of the URM112 Introduction to Computers course. This quiz covers key concepts, intended audience, and expected student outcomes for this introductory course on computer fundamentals. Prepare yourself for course-related activities and topics that are likely to be discussed.