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Questions and Answers
What is the criteria for solder on the component mounting surface of a through-hole board?
What is the criteria for solder on the component mounting surface of a through-hole board?
- Solder should not have insufficient flow-up on double-sided boards
- Solder and component electrodes should have a contact angle θ≧ ９０ °NG
- Solder shall be formed all the way around to the land shoulder (correct)
- Solder should not be raised at the stress relief section
What is the main issue with the solder on the surface of a through hole-mounted device on a through hole board according to the text?
What is the main issue with the solder on the surface of a through hole-mounted device on a through hole board according to the text?
- It is insufficient on double-sided boards
- It has stress relief at the lead bending section
- It does not flow up the shoulder of the land (correct)
- It has a contact angle θ≧ ９０ °NG
What is the requirement for stress relief at the lead bending section?
What is the requirement for stress relief at the lead bending section?
- Solder should be formed all the way around to the land shoulder
- Solder and component electrodes should have a contact angle θ≧ ９０ °NG
- Solder should not be raised (correct)
- Solder should not have insufficient flow-up on double-sided boards
What is the criteria for solder and component electrodes, leads, and land according to the text?
What is the criteria for solder and component electrodes, leads, and land according to the text?
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What is the angle of solder in contact with component electrode, lead, and land according to the text?
What is the angle of solder in contact with component electrode, lead, and land according to the text?
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