5 Questions
What is the criteria for solder on the component mounting surface of a through-hole board?
Solder shall be formed all the way around to the land shoulder
What is the main issue with the solder on the surface of a through hole-mounted device on a through hole board according to the text?
It does not flow up the shoulder of the land
What is the requirement for stress relief at the lead bending section?
Solder should not be raised
What is the criteria for solder and component electrodes, leads, and land according to the text?
Solder and component electrodes, leads, and land should not have wetting failure
What is the angle of solder in contact with component electrode, lead, and land according to the text?
Angle of solder in contact with component electrode, lead, and land should be θ< ９０ °NG
Test your understanding of solder defect images with this quiz focused on "Insufficient flow-up" on double-sided boards. Identify the criteria for poor appearance conditions and learn to recognize the lack of solder flow on through hole-mounted devices from both side and top views.
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