Solder Defect Identification
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Solder Defect Identification

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@ResoluteRhodochrosite9915

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Questions and Answers

What is the criteria for solder on the component mounting surface of a through-hole board?

  • Solder should not have insufficient flow-up on double-sided boards
  • Solder and component electrodes should have a contact angle θ≧ ９０ °NG
  • Solder shall be formed all the way around to the land shoulder (correct)
  • Solder should not be raised at the stress relief section

    • What is the main issue with the solder on the surface of a through hole-mounted device on a through hole board according to the text?

  • It is insufficient on double-sided boards
  • It has stress relief at the lead bending section
  • It does not flow up the shoulder of the land (correct)
  • It has a contact angle θ≧ ９０ °NG

    • What is the requirement for stress relief at the lead bending section?

  • Solder should be formed all the way around to the land shoulder
  • Solder and component electrodes should have a contact angle θ≧ ９０ °NG
  • Solder should not be raised (correct)
  • Solder should not have insufficient flow-up on double-sided boards

    • What is the criteria for solder and component electrodes, leads, and land according to the text?

    <p>Solder and component electrodes, leads, and land should not have wetting failure</p> Signup and view all the answers

    What is the angle of solder in contact with component electrode, lead, and land according to the text?

    <p>Angle of solder in contact with component electrode, lead, and land should be θ&lt; ９０ °NG</p> Signup and view all the answers

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