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Questions and Answers
What is the primary purpose of the Reliability Operation Procedure?
What is the primary purpose of the Reliability Operation Procedure?
- To manage the company's finances and budget.
- To ensure product reliability compliance with quality standards. (correct)
- To define marketing strategies for new products.
- To outline the steps for product design and development.
The Reliability Operation Procedure only applies to final product testing, not to ongoing monitoring or evaluations.
The Reliability Operation Procedure only applies to final product testing, not to ongoing monitoring or evaluations.
False (B)
According to the document, which department has the responsibility and authority to manage the reliability process?
According to the document, which department has the responsibility and authority to manage the reliability process?
Reliability Engineering
According to the document, personnel that perform or manage reliability testing are to be ______ in the requirements of its references.
According to the document, personnel that perform or manage reliability testing are to be ______ in the requirements of its references.
Which document outlines the requirements for qualification to qualify a product, package and/or process?
Which document outlines the requirements for qualification to qualify a product, package and/or process?
Preventive maintenance includes routine cleaning of workstations, mats, and floor tiles with standard cleaning supplies.
Preventive maintenance includes routine cleaning of workstations, mats, and floor tiles with standard cleaning supplies.
What type of cleaner should be used to clean workstations, mats, and floor tiles to maintain ESD protective properties?
What type of cleaner should be used to clean workstations, mats, and floor tiles to maintain ESD protective properties?
According to the document, environmental stress testing should be performed according to the specification identified in the Process, Package and Product Qualification Requirements, document ______.
According to the document, environmental stress testing should be performed according to the specification identified in the Process, Package and Product Qualification Requirements, document ______.
Match the following reliability activities with their definitions according to the document:
Match the following reliability activities with their definitions according to the document:
Which of the following best describes 'Rel ORT'?
Which of the following best describes 'Rel ORT'?
According to the document, if there is a delay in the qualification/evaluation process, it is not necessary to communicate the changes to the Cross Functional Team (CFT) or Program Manager (PM).
According to the document, if there is a delay in the qualification/evaluation process, it is not necessary to communicate the changes to the Cross Functional Team (CFT) or Program Manager (PM).
What is the purpose of 'Rel Eval' as defined in the document?
What is the purpose of 'Rel Eval' as defined in the document?
To perform electrical testing, a load board or ______ must be fabricated depending on whether a socketed or soldered-down solution has been used.
To perform electrical testing, a load board or ______ must be fabricated depending on whether a socketed or soldered-down solution has been used.
What must be done with the 'traveler' upon completion of a qualification/evaluation?
What must be done with the 'traveler' upon completion of a qualification/evaluation?
Based on the document, test equipment calibrations can be performed by internal technicians as long as they follow documented procedures.
Based on the document, test equipment calibrations can be performed by internal technicians as long as they follow documented procedures.
What is the definition of ATE as stated in this document?
What is the definition of ATE as stated in this document?
According to the document, what should be done with qualification samples after completing each reliability testing?
According to the document, what should be done with qualification samples after completing each reliability testing?
All Integrated Circuit devices shall be handled according to ______ Procedure (DOC-50023).
All Integrated Circuit devices shall be handled according to ______ Procedure (DOC-50023).
According to the document, 'Customer Qualification Reports' need to be generated for Rel Eval reports to summarize the reliability testing results.
According to the document, 'Customer Qualification Reports' need to be generated for Rel Eval reports to summarize the reliability testing results.
Match each item with its required action according to Preventive Maintenance (Section 8):
Match each item with its required action according to Preventive Maintenance (Section 8):
Flashcards
Purpose of procedure
Purpose of procedure
Framework to ensure product reliability compliance to quality standards.
Scope of procedure
Scope of procedure
Applies to all reliability tests, monitors, qualifications, and evaluations.
Responsibility
Responsibility
Reliability Engineering manages the reliability process following the procedure.
Rel Qual
Rel Qual
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Rel ORT
Rel ORT
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Rel Eval
Rel Eval
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ESD
ESD
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Test House
Test House
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Assembly House assembled
Assembly House assembled
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ATE
ATE
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Equipment Types
Equipment Types
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Workstation Cleaning
Workstation Cleaning
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Training Requirements
Training Requirements
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Integrated Circuits Handling
Integrated Circuits Handling
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Rel Qual Planning Includes?
Rel Qual Planning Includes?
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Ongoing Reliability Testing (ORT) Planning
Ongoing Reliability Testing (ORT) Planning
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Evaluation Plan Reflection
Evaluation Plan Reflection
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Stress Testing Solutions
Stress Testing Solutions
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Environmental Stress Testing
Environmental Stress Testing
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Test Program Consistency
Test Program Consistency
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Study Notes
Reliability Operation Procedure Overview
- This procedure ensures product reliability compliance with quality standards.
- It applies to all reliability tests, monitors, qualifications, and evaluations.
- Reliability Engineering manages the reliability process according to this procedure.
References
- DOC-35300: Training Procedure
- DOC-50023: ESD Control Procedure
- DOC-35310: Control of Nonconforming Product Procedure
- DOC-00352: Quality Audit Procedure
- DOC-35298: Failure Analysis Procedure
- DOC-35034: pSemi Qualification Requirements
- DOC-01309: Process, Package, and Product Qualification Requirements
- DOC-01310: Reliability Monitor Instructions
- DOC-95164: Reliability Sample Preparation Procedure
- DOC-00383: Equipment Calibration Procedure
Safety Guidelines
- General safety must be adhered to when using high-temperature ovens and electrical equipment, including power supplies.
Key Definitions
- Rel Qual: Reliability Engineering activity to "qualify" a product, package, and process based on DOC-01309.
- Rel ORT: Reliability Engineering activity to periodically "monitor" reliability of a product, package, and process based on DOC-01310.
- Rel Eval: Reliability Engineering activity for an early reliability assessment, often requested by other Engineering departments.
- ESD: Electrostatic Discharge.
- Test House: Location where the test was performed.
- Assembly House assembled: Location where packaging and die mounting occur.
- ATE: Automatic Test Equipment.
Equipment and Materials
- pSemi Corporation uses supplier and internally owned environmental test equipment including Automatic Test Equipment (ATE) and bench test equipment (refer to DOC-50655).
Preventive Maintenance
- Workstations, mats, floor tiles, and smocks require routine cleaning with static dissipative cleaner to maintain ESD protection.
- Standards-traceable test equipment calibrations are performed by outside contractors, in accordance with DOC-00383
- Equipment is maintained per OEM requirements.
Training Requirements
- All personnel performing or managing reliability testing must be trained per specification requirements, referencing DOC-35300 Training.
Procedure - General
- All Integrated Circuit devices are handled according to ESD Control Procedure (DOC-50023).
Rel Qual Planning
- Qualification of a product, package, or process includes sample size, stress condition, duration, and requirements as defined in DOC-01309.
Rel Ongoing Reliability Testing (ORT) Planning
- The Ongoing Reliability Test Procedure (DOC-01310) defines the reliability process for routine product monitoring to quality requirements.
Rel Eval Planning
- Evaluation plans reflect reliability requirements defined in DOC-01309
- Sample size, number of lots, conditions, and durations depend on sample availability and intended outcome and may not follow DOC-01309 exactly.
Hardware Preparation
- Depending on reliability test type, a socketed or soldered down solution is used for reliability stress testing
- A determination is made to use an existing Burn in Board (BiB) or design a new one.
- Interposer design must be initiated with selecting an assembly house with capability to fabricate the package in timely manner for dice requiring packaging.
- To perform electrical testing, a load board or Daughter Cards (Eks) are fabricated based on whether a socketed or soldered down solution has been used
- Preparation of passives, connectors, terminators, cables, etc. is required before reliability stress testing.
Test Program Readiness
- A repeatable, reproducible, stable qual test program will be created by the assigned test engineer.
- All qualification read points must be tested with the test program from DOC-01309.
Device ESD Handling
- Daughter cards, WLCSP, or any die/assembled devices must be shipped/handled with minimal ESD/mechanical damage.
- Refer to REL Sample Preparation Procedure DOC-95164 and Inspection Procedure DOC-92912.
Sample Preparation
- Preparation of reliability samples for qualifying/evaluating a product, package, or process is defined in REL Sample Preparation Procedure DOC-95164.
Reliability Stress Testing
- Environmental stress testing follows specifications in the Process, Package and Product Qualification Requirements (DOC-01309).
Electrical Testing and Data Analysis
- Parts must be screened and tested at each qualification read point using the same released qualification test program revision and tester
- Refer to DOC-01309.
- A thorough shift report analysis is generated which includes the Low and Upper Limits (LL & UL) pass/fail results including all shifts between readpoints for all the qual and control parts.
- Refer to Reliability Qualification Data Analysis Procedure DOC-02750 for guidance.
Failure Analysis
- For failures during qualification, steps, responsible parties, and gridlines are defined in DOC-01309.
Reliability/Evaluation Report
- A Rel Qual, Rel ORT, or Rel Eval plan must be completed/revised into a report that indicates attributes, specification, and reliability testing results.
- Rel Qual and Rel ORT reports must be summarized as "Customer Qualification Report", with reliability testing type, reference, conditions, duration, sample size and the results.
- Rel Eval customer qualification report isn't needed.
- ESD and/or Latch up (LU) characterization report from Characterization/Product Engineering must be embedded in the Reliability Customer Qualification Report.
- Refer to ESD Characterization Qualification Procedure DOC-00377 and Latch up Procedure DOC-93554.
OCAP
- If there is delay in the qualification/evaluation process, Rel Engineer recalculates the timeline and update the Cross Functional Team (CFT) or Program Manager (PM) of the changes.
- In case of any unplanned interruption for each reliability stress testing please refer to the corresponding test type internal procedure or JEDEC standards for further instruction such as the electrical test window and storage conditions.
Records
- Upon qualification/evaluation completion, the traveler is scanned and saved in the project folder on the department network.
- After each reliability testing, qualification samples are placed in archive boxes, stored, and retained in the designated location.
- Refer to Quality Records DOC-35296 for retention period.
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