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Questions and Answers

What is the diameter range of silicon crystal ingots used in integrated circuit manufacturing?

Silicon crystal ingots are between 8 and 12 inches in diameter.

How thick are the wafers sliced from silicon ingots?

The wafers are no more than 0.1 inches thick.

What is the primary purpose of the silicon wafers in integrated circuit manufacturing?

The silicon wafers are used to create chips by having patterns of chemicals placed on them to form transistors and conductors.

How many processing steps can wafers undergo during the integrated circuit manufacturing process?

Wafers can go through 20 to 40 processing steps. Signup and view all the answers

Why is yield management important in semiconductor fabrication?

Yield management is crucial because it directly affects the cost and profitability of the chips produced. Signup and view all the answers

What role do insulators play in modern integrated circuits?

Insulators separate layers of transistors and conductors to reduce electrical interference. Signup and view all the answers

What is the significance of having multiple levels of metal conductors in integrated circuits?

Having multiple levels of metal conductors allows for complex interconnections and enhances the performance of the circuits. Signup and view all the answers

What happens after the wafers are processed and tested in integrated circuit manufacturing?

Processed wafers are sliced into dies, which are then packaged and shipped to customers. Signup and view all the answers

What is yield in semiconductor fabrication, and why is it important?

Yield is the percentage of good dies from the total number of dies on a wafer, and it is important because it directly affects the cost and efficiency of the manufacturing process. Signup and view all the answers

How does the die size affect the cost of integrated circuits?

Larger die sizes lead to lower yields and fewer dies fitting on a wafer, which increases production costs. Signup and view all the answers

What technological advancement was considered state-of-the-art in 2020 for semiconductor manufacturing?

The 7-nanometer (nm) process was considered state-of-the-art in 2020. Signup and view all the answers

What is the maximum number of dies that can fit on a 300 mm wafer at 100% yield according to the data provided?

The maximum number of dies that can fit on a 300 mm wafer at 100% yield is 506. Signup and view all the answers

Explain the role of bonding in integrated circuit manufacturing.

Bonding connects the good dies to the input/output pins of a package, ensuring they function correctly. Signup and view all the answers

What main factors contribute to the cost of chips beyond production?

Factors include research and development, marketing, sales, and manufacturing equipment maintenance. Signup and view all the answers

How does the transition to smaller technology nodes, like 10 nm, impact yield and die count?

Transitioning to smaller nodes typically improves yield and increases die count per wafer. Signup and view all the answers

What distinction exists between the cost of chips and their selling price?

Cost refers to the expenses incurred during production, while selling price is determined by market demand and can exceed production costs. Signup and view all the answers

How does the manufacturing process impact the yield of integrated circuits in high-volume production?

In high-volume production, the manufacturing process can be optimized for a specific design, leading to increased yield. Signup and view all the answers

What key factor distinguishes the cost structure of high-volume chip production compared to low-volume production?

The development costs are largely independent of volume, making the cost per die lower for high-volume parts. Signup and view all the answers

Explain why chips produced in high volumes tend to have lower per-unit costs.

High-volume chips benefit from optimized processes, shared development costs, and lower mask costs, reducing per-unit expenses. Signup and view all the answers

What is the significance of the defect rate in the cost analysis of integrated circuits?

The defect rate directly affects yield, which in turn influences the overall cost of the integrated circuits produced. Signup and view all the answers

How does the area of dies and wafers impact the cost of manufacturing integrated circuits?

The cost is affected by die area and wafer area as larger dies reduce the number of dies per wafer, impacting yield and cost. Signup and view all the answers

Identify two reasons why designing a high-volume chip may be less labor-intensive than designing a low-volume chip.

High-volume designs can utilize refined processes and existing designs, requiring less iterative work compared to low-volume designs. Signup and view all the answers

What role do masks play in the cost structure of chip manufacturing, particularly in high volumes?

Masks are costly to produce and their cost is amortized over larger volumes, decreasing the cost per chip in high-volume manufacturing. Signup and view all the answers

Describe how empirical observations of yield relate to the equations used in cost analysis of integrated circuits.

Empirical observations help formulate yield equations which consider defects and processing steps, directly impacting cost calculations. Signup and view all the answers

Study Notes

Silicon Crystal Ingot and Wafer Processing

Integrated circuits production is essential for chip cost, influencing computer design.
Silicon crystal ingots typically range from 8 to 12 inches in diameter and 12 to 24 inches in length.
Ingots are sliced into wafers no thicker than 0.1 inches, which undergoes various processing steps to create necessary patterns.
Current integrated circuits often have a single layer of transistors and multiple metal conductor layers (2 to 8) separated by insulators.

Chip Manufacturing Process

The manufacturing sequence includes slicing, testing, bonding, and packaging dies before shipping them to consumers.
Specific equations determine integrated circuit costs:
- Cost per wafer can be defined by area and yield considerations.
- Cost per die is computed with a focus on the effective usage of wafer space.
- Yield reflects the quality of dies achieved during manufacturing.

Cost Influencers in Integrated Circuit Production

Volume of production significantly affects costs; higher volumes generally reduce individual chip expenses.
Factors influencing lower costs at higher volumes include:
- The tuning of manufacturing processes boosts yield.
- High-volume designs require less engineering work than low-volume counterparts.
- Expensive masks reduce the cost per chip when utilized for large quantities.
- Development costs remain constant, lowering per-die costs in high production.

Impact of Die Size on Cost

As die size increases, costs rise due to diminished yield and lessened wafer space efficiency.
Transitioning to smaller transistor and wire sizes (next-generation processes) is vital to mitigate costs and enhance yield.
A 7-nanometer (nm) process was state-of-the-art by 2020, indicating that the smallest features on a die are approximately 7 nm.

Efficiency of Wafer Usage

A 300 mm (12 inch) wafer can yield up to 506 dies at perfect yield levels.
Each Ice Lake die measures 11.4 by 10.7 mm, with losses incurred on yields from unusable chips along wafer edges.
The design process allows for easier creation of masks for silicon patterning, optimizing production efficiency.

Final Production and Costs

Good dies are bonded to package pins before a final quality test.
Market prices for chips differ from production costs; companies price based on market potential to maximize returns.
Essential cost elements include R&D, marketing, sales, equipment maintenance, building expenses, financing costs, and taxes.

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