quiz 01

<p>Dr. Paul Eisler (B)</p> Signup and view all the answers

<p>Breadboards are less stable. (D)</p> Signup and view all the answers

<p>They reduce the size and cost of electronic products. (B)</p> Signup and view all the answers

<p>Multilayer PCB (B)</p> Signup and view all the answers

<p>Electromagnetic shielding. (D)</p> Signup and view all the answers

<p>To create holes for mounting components (A)</p> Signup and view all the answers

<p>It does not require electrical current (A)</p> Signup and view all the answers

<p>To prevent solder shorting between components (A)</p> Signup and view all the answers

<p>Solder (A)</p> Signup and view all the answers

<p>Surface mount assembly and through-hole assembly (D)</p> Signup and view all the answers

<p>Blind holes allow for connections between layers (A)</p> Signup and view all the answers

<p>1 mil (B)</p> Signup and view all the answers

<p>It cleans the surfaces before soldering (B)</p> Signup and view all the answers

<p>Higher durability (D)</p> Signup and view all the answers

<p>Weight of components (D)</p> Signup and view all the answers

<p>To facilitate future modifications (A)</p> Signup and view all the answers

<p>Increased complexity (D)</p> Signup and view all the answers

<p>KICAD (C)</p> Signup and view all the answers

<p>Under components (A), Near non-mounting holes (C)</p> Signup and view all the answers

<p>To ensure manufacturability (A)</p> Signup and view all the answers

<p>Longer design time (A)</p> Signup and view all the answers

<p>To show where specific components will be placed on the board (B)</p> Signup and view all the answers

<p>Fabrication and manufacturing (A)</p> Signup and view all the answers

<p>Electrical design rules (B)</p> Signup and view all the answers

<p>Spacing design rules (B)</p> Signup and view all the answers

<p>0.007 to 0.010 inches (A)</p> Signup and view all the answers

<p>They can cause signal integrity issues. (D)</p> Signup and view all the answers

<p>0.25 mm (A)</p> Signup and view all the answers

<p>To choose the materials and processes for production (D)</p> Signup and view all the answers

<p>0.8 mm to 2.5 mm (D)</p> Signup and view all the answers

<p>Manufacturing process selection (A)</p> Signup and view all the answers

<p>To remove unwanted copper and leave behind traces (D)</p> Signup and view all the answers

<p>Prepreg (B)</p> Signup and view all the answers

<p>To ensure precise registration to inner layer connections (D)</p> Signup and view all the answers

<p>Electroless copper plating (B)</p> Signup and view all the answers

<p>Copper (D)</p> Signup and view all the answers

<p>Laser drilling (D)</p> Signup and view all the answers

<p>To protect the copper foil from oxidation and unintended solder contact (C)</p> Signup and view all the answers

<p>Vias are small holes that connect traces on different layers electrically (B)</p> Signup and view all the answers

<p>Surface mount technology does not require holes in the PCB (C)</p> Signup and view all the answers

<p>Silk-screen layer (D)</p> Signup and view all the answers

<p>To serve as locations where components are soldered to the PCB (A)</p> Signup and view all the answers

<p>They connect electrical components and pads, similar to wires (B)</p> Signup and view all the answers

<p>A combination of both surface mount and through hole methods is commonly used (C)</p> Signup and view all the answers

<p>It allows more components to be placed in a smaller area (D)</p> Signup and view all the answers

A small hole through a PCB that electrically connects a trace on the top layer to a trace on the bottom layer.

The copper tracks on a PCB that connect pads together and conduct signals.

A location on a PCB where a component is soldered.

A layer of insulating material covering a PCB except for pads, typically green in color.

A layer of silk screen print on a PCB, used for adding labels or markings.

A method of mounting components onto a PCB by inserting leads through holes and soldering them on the other side.

A method of mounting components onto a PCB by soldering them directly to the surface.

The process of connecting components and traces on different layers of a PCB.

Made up of one or more layers of electrical conductors separated by insulating material.

PCBs are used as the foundation for many computer components, making devices smaller and cost-effective. They also provide physical support, input/output connections, and electromagnetic shielding.

A type of PCB with only one conductor layer on one side of the substrate. This side is typically made of copper due to its conductivity.

Used in various consumer electronics like calculators, cameras, radio equipment, solid-state drives, printers.

A board with conductive tracks that define the paths for electrical signals.

The first real operational printed circuit boards were made in 1943 by Dr. Paul Eisler.

A type of prototyping board where you can connect components directly without the need for permanent soldering.

PCBs offer stability, reliability, and space efficiency, while Breadboards are flexible, easy to debug, and allow for fast prototyping.

Design rules define physical characteristics of a PCB to ensure manufacturing success and electrical performance.

Electrical design rules focus on electrical properties like impedance and voltage.

Physical design rules relate to physical attributes like trace width, via sizes, and differential pairings.

Spacing design rules define clearances between lines, pads, vias, and copper areas.

Same net spacing design rules define clearances between elements on the same electrical connection.

Keep enough space between traces to prevent short circuits.

90-degree angles should generally be avoided to prevent manufacturing difficulties.

The appropriate trace width depends on current, impedance, and other requirements, with typical widths ranging from 0.2mm to 2mm.

Connecting power and ground pins of components to the power and ground planes.

To effectively reduce unwanted electromagnetic signals from interfering with the device's performance.

The width required for a trace depends on three factors: manufacturability, current, and signal speed.

Provides a clear return path for current.

Electromagnetic Interference.

The design, manufacturing, and testing complexity of multilayer PCBs is higher compared to single or double layer PCBs.

The process of creating holes in a PCB before component mounting, done using a drill bit slightly smaller than the components, directly on single or double-sided boards and after layer pressuring on multi-layer boards.

A chemical process used to deposit a thin copper layer (usually 1 mil thick) onto a substrate, enhancing the conductivity of the PCB.

The process of adding all electronic components onto the prepared PCB, using either surface mount assembly or through-hole assembly.

A material used to join electronic components to the PCB, facilitating electrical connections.

A chemical used in PCB assembly to clean surfaces of the board and components before soldering, ensuring a strong and clean connection.

A method of mounting components onto a PCB by inserting leads through holes and soldering them on the other side.

A method of mounting components onto a PCB by soldering them directly to the surface without holes.

Copper foil, prepreg, and core materials are common components in PCB manufacturing.

The manufacturing process for multilayer PCBs involves steps like drilling, plating, lamination, and etching, each contributing to the final product's quality and reliability.

Inner layers are created through imaging, etching, stripping, cleaning, and electrical testing to ensure proper electrical paths are formed.

The lamination process involves stacking inner layers, prepreg for insulation, and copper foil on top and bottom, then applying heat and pressure to bond them together into a solid multilayer panel.

Drilling precise holes in the laminated panel allows electrical connections to be made between layers, enabling complex circuits.

Hole plating involves applying thin layers of copper to the drilled holes to improve conductivity and ensure reliable connections between layers.

Outer layer production involves manufacturing the top and bottom copper layers of a PCB, which will eventually be bonded to the inner layers to create the final multilayer PCB.

Outer layers are bonded to the inner layers to create the multilayer PCB. The bonding process ensures a strong and reliable connection between the layers.