Metal Finishing: Introduction and Processes
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Questions and Answers

What happens to the pH of the solution during the redox reaction?

  • Fluctuates
  • Remains constant
  • Decreases (correct)
  • Increases
  • Why is the addition of a buffer essential during the redox reaction?

  • To maintain a stable pH (correct)
  • To increase the reaction rate
  • To prevent oxidation
  • To improve conductivity
  • What is the usual plating rate in electroless plating?

  • 10-20 µmh-1
  • 0.5-1 µmh-1
  • 1-5 µmh-1 (correct)
  • 50-100 µmh-1
  • In which application is electroless copper plating widely used?

    <p>Metalizing printed circuit boards (PCBs)</p> Signup and view all the answers

    What are through hole connections typically produced using electroless plating?

    <p>Electrical connections</p> Signup and view all the answers

    Which type of articles are typically plated using electroplating?

    <p>Pure metal or alloy</p> Signup and view all the answers

    What is the driving force behind electroplating?

    <p>Electric current</p> Signup and view all the answers

    What is the nature of deposit formed in electroless plating?

    <p>$M$ or $H_2O$</p> Signup and view all the answers

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