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Metal Finishing: Introduction and Processes

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Metal Finishing: Introduction and Processes

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Questions and Answers

What happens to the pH of the solution during the redox reaction?

Fluctuates

Remains constant

Decreases (correct)

Increases

Why is the addition of a buffer essential during the redox reaction?

To maintain a stable pH (correct)

To increase the reaction rate

To prevent oxidation

To improve conductivity

What is the usual plating rate in electroless plating?

10-20 µmh-1

0.5-1 µmh-1

1-5 µmh-1 (correct)

50-100 µmh-1

In which application is electroless copper plating widely used?

Metalizing printed circuit boards (PCBs) Signup and view all the answers

What are through hole connections typically produced using electroless plating?

Electrical connections Signup and view all the answers

Which type of articles are typically plated using electroplating?

Pure metal or alloy Signup and view all the answers

What is the driving force behind electroplating?

Electric current Signup and view all the answers

What is the nature of deposit formed in electroless plating?

$M$ or $H_2O$ Signup and view all the answers

Metal Finishing: Introduction and Processes

Choose a study mode

Podcast

Questions and Answers

What happens to the pH of the solution during the redox reaction?

Why is the addition of a buffer essential during the redox reaction?

What is the usual plating rate in electroless plating?

In which application is electroless copper plating widely used?

What are through hole connections typically produced using electroless plating?

Which type of articles are typically plated using electroplating?

What is the driving force behind electroplating?

What is the nature of deposit formed in electroless plating?

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