Mechanics of Solids: Stress

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Questions and Answers

Which of the following is the correct formula for calculating normal stress?

  • σ = F/A (correct)
  • σ = E * ε
  • σ = F * A
  • σ = A/F

Strain is a dimensionless quantity often expressed as a percentage or in microstrain.

True (A)

What is the name of the point on a stress-strain curve at which a material begins to deform permanently?

Yield Point

__________ is the ratio of transverse strain to axial strain under uniaxial stress.

<p>Poisson's Ratio</p> Signup and view all the answers

Match the following strain measurement techniques with their descriptions:

<p>Strain Gauge = Resistive sensor that changes resistance when strained. Extensometer = Mechanical device used to measure the extension of a material under tensile load. Digital Image Correlation (DIC) = Non-contact optical technique that tracks the displacement of points on a surface. Moiré Interferometry = Optical technique using interference patterns to measure displacement and strain.</p> Signup and view all the answers

Which of the following best describes the function of a Wheatstone bridge circuit in the context of strain gauges?

<p>It converts the change in resistance of the strain gauge to a voltage signal, enabling precise strain measurement. (C)</p> Signup and view all the answers

Stress concentration factors are generally lower around sharp corners and holes in a material.

<p>False (B)</p> Signup and view all the answers

What is the name given to the area under the stress-strain curve?

<p>Toughness</p> Signup and view all the answers

In finite element analysis, the process of dividing a structure into smaller parts is called __________.

<p>Meshing</p> Signup and view all the answers

Which failure theory predicts failure when the distortion energy reaches the material's yield strength?

<p>Distortion Energy Theory (von Mises Criterion) (D)</p> Signup and view all the answers

Flashcards

Stress

Force acting per unit area within a solid material, measuring internal molecular forces.

Normal Strain (ε)

The change in length divided by the original length.

Stress-Strain Curve

Illustrates material behavior under load, showing stress variation with strain.

Strain Gauges

Resistive sensors that change resistance when strained, bonded to a material's surface.

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Digital Image Correlation (DIC)

Non-contact optical technique that tracks displacement of points on a surface using two cameras.

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Finite Element Method (FEM)

Numerical method dividing a structure into small elements to approximate stress solutions.

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Failure Theories

Predicts conditions for material failure based on stress limits.

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Mohr's Circle

Graphical representation of stress at a point, finding principal and max shear stresses.

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Stress Intensity Factor (K)

Measure of stress concentration at a crack tip, indicating fracture potential.

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Fatigue

Material failure under repeated loading, even below yield strength.

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Study Notes

  • Mechanics of solids focuses on the behavior of solid materials under external forces, covering stress, strain, and deformation.
  • Stress analysis involves determining the internal stresses within a solid material subjected to external loads.
  • Strain measurement is the process of quantifying the deformation of a solid material.

Stress

  • Stress is the force acting per unit area within a solid material.
  • It measures the internal forces that molecules within a continuous material exert on each other.
  • Stress is denoted by the Greek letter sigma (σ).
  • The formula for stress is σ = F/A, where F is the force and A is the area over which the force acts.
  • Stress can be normal (perpendicular to the surface) or shear (parallel to the surface).
  • Normal stress is referred to as tensile stress (when pulling) or compressive stress (when pushing).
  • Shear stress is also referred to as tangential stress.
  • Stress is measured in units of Pascals (Pa) or pounds per square inch (psi).
  • 1 Pa = 1 N/m^2.
  • Stress can be classified as static (constant over time) or dynamic (varying with time).
  • Stress concentration occurs when stress is significantly higher around holes, corners, or other geometric discontinuities.
  • The stress concentration factor (Kt) is the ratio of the maximum stress to the nominal stress.
  • Understanding stress distribution is vital for predicting material failure and designing safe structures.

Strain

  • Strain measures deformation, representing the displacement between particles in the material relative to a reference length.
  • It is a dimensionless quantity, often expressed as a percentage or in microstrain (με).
  • Normal strain (ε) is the change in length divided by the original length: ε = ΔL/L0.
  • Shear strain (γ) is the change in angle between two lines that were originally perpendicular.
  • Strain can be tensile (positive, indicating elongation) or compressive (negative, indicating shortening).
  • Hooke's Law relates stress and strain in a linear elastic material: σ = Eε, where E is the Young's modulus.
  • Poisson's ratio (ν) is the ratio of transverse strain to axial strain under uniaxial stress: ν = -ε_transverse / ε_axial.
  • Volumetric strain (ε_v) is the change in volume divided by the original volume.
  • Strain gauges are common devices used to measure strain on the surface of a material.
  • The state of strain at a point is fully described by a strain tensor, including normal and shear strain components.

Stress-Strain Relationship

  • The stress-strain curve illustrates the behavior of a material under load, showing how stress varies with strain.
  • The initial linear portion of the curve represents the elastic region, where the material returns to its original shape upon unloading.
  • The slope of the stress-strain curve in the elastic region is the Young's modulus (E), a measure of stiffness.
  • The yield strength is the stress at which the material begins to deform plastically (permanently).
  • Beyond the yield point, the material enters the plastic region, where permanent deformation occurs.
  • The ultimate tensile strength (UTS) is the maximum stress the material can withstand before necking or fracture.
  • Ductile materials exhibit significant plastic deformation before failure, while brittle materials fracture with little or no plastic deformation.
  • The area under the stress-strain curve represents the toughness of the material.
  • The resilience of a material is the energy it can absorb elastically, represented by the area under the elastic portion of the curve.
  • Material properties such as Young's modulus, yield strength,and ultimate tensile strength are essential for structural design.
  • Temperature, strain rate, and environmental conditions can significantly affect the stress-strain behavior of materials.

Strain Measurement Techniques

  • Strain gauges are resistive sensors that change resistance when strained.
  • They are typically bonded to the surface of a material and connected to a Wheatstone bridge circuit.
  • The gauge factor (GF) relates the change in resistance to the strain: GF = (ΔR/R) / ε.
  • Different types of strain gauges include foil gauges, semiconductor gauges, and weldable gauges.
  • Extensometers are mechanical devices used to measure the extension of a material under tensile load.
  • They are commonly used for determining the stress-strain curve of a material.
  • Digital Image Correlation (DIC) is a non-contact optical technique that tracks the displacement of points on a surface.
  • It uses two cameras to capture images of a specimen before, during, and after deformation.
  • DIC can measure full-field strain distributions, providing detailed information about the deformation behavior.
  • Moiré interferometry is an optical technique that uses interference patterns to measure displacement and strain.
  • It involves superimposing a reference grating onto a deformed grating on the specimen surface.
  • Fiber optic sensors can be embedded in materials to measure strain internally.
  • They use changes in the refractive index or the length of the fiber to detect strain.
  • Acoustic emission (AE) sensors detect the release of energy from materials under stress, which can indicate damage.
  • Neutron diffraction can measure strain within the bulk of a material, providing information about residual stresses.
  • X-ray diffraction (XRD) is used to measure the lattice spacing of a crystalline material, which can be related to strain.

Stress Analysis Methods

  • Analytical methods involve solving the equations of elasticity to determine the stress distribution in a structure.
  • These methods are typically applicable to simple geometries and loading conditions.
  • Numerical methods, such as the finite element method (FEM), are used to solve complex stress analysis problems.
  • FEM divides the structure into small elements and approximates the solution using numerical techniques.
  • Boundary element method (BEM) is another numerical technique that focuses on the boundaries of the structure.
  • Experimental stress analysis techniques, such as photoelasticity, use optical methods to visualize stress distributions.
  • Photoelasticity involves using birefringent materials and polarized light to observe stress patterns.
  • The patterns, called fringes, represent lines of constant stress difference.
  • Finite element analysis (FEA) software, such as ANSYS, Abaqus, and COMSOL, are widely used for stress analysis.
  • FEA software allows engineers to simulate the behavior of structures under various loading conditions.
  • The accuracy of stress analysis results depends on the material properties, boundary conditions, and mesh refinement.
  • Validation of stress analysis results with experimental measurements is essential for ensuring accuracy.
  • Understanding the limitations of each stress analysis method is critical for reliable results.

Failure Theories

  • Failure theories predict the conditions under which a material will fail.
  • Maximum principal stress theory states that failure occurs when the maximum principal stress exceeds the material's tensile strength.
  • Maximum shear stress theory (Tresca criterion) states that failure occurs when the maximum shear stress exceeds half of the material's yield strength.
  • Distortion energy theory (von Mises criterion) states that failure occurs when the distortion energy reaches the material's yield strength.
  • Mohr's circle is a graphical representation of stress at a point, used to determine principal stresses and maximum shear stress.
  • Fracture mechanics deals with the behavior of materials containing cracks or flaws.
  • Stress intensity factor (K) is a measure of the stress concentration at the tip of a crack.
  • Critical stress intensity factor (KIC) is the fracture toughness of a material, representing its resistance to crack propagation.
  • Fatigue is the failure of a material under repeated loading, even if the stress levels are below the yield strength.
  • S-N curves (Wöhler curves) plot stress amplitude versus the number of cycles to failure, used for fatigue analysis.
  • Creep is the time-dependent deformation of a material under sustained stress at elevated temperatures.
  • Understanding failure theories is crucial for designing safe and reliable structures.

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