Podcast
Questions and Answers
The Jedec Standard includes guidelines for the handling, packing, shipping, and use of Moisture/Reflow Sensitive Surface.
The Jedec Standard includes guidelines for the handling, packing, shipping, and use of Moisture/Reflow Sensitive Surface.
True (A)
The Jedec Standard specifies the Functional Test Requirement for Wire Bond Machine.
The Jedec Standard specifies the Functional Test Requirement for Wire Bond Machine.
False (B)
Static Volt Checker is not listed as one of the equipment/tools mentioned for use in the production line.
Static Volt Checker is not listed as one of the equipment/tools mentioned for use in the production line.
False (B)
Latching and Unlatching Procedure is covered in Jedec Standard 411-052-8928.
Latching and Unlatching Procedure is covered in Jedec Standard 411-052-8928.
Quality Assurance System Procedure is included in Jedec Standard 411-001.
Quality Assurance System Procedure is included in Jedec Standard 411-001.
Vernier Caliper and Micrometer are both examples of Measuring Equipment listed for use in the production line.
Vernier Caliper and Micrometer are both examples of Measuring Equipment listed for use in the production line.
The revision history includes changes for FE OSA and IFM modules.
The revision history includes changes for FE OSA and IFM modules.
The lead frame sampling plan requires 5 strips and 30 points to cover LED, IC, and leads area.
The lead frame sampling plan requires 5 strips and 30 points to cover LED, IC, and leads area.
According to the procedure, all applicable materials need to go through an outgoing inspection process before being shipped.
According to the procedure, all applicable materials need to go through an outgoing inspection process before being shipped.
The reference documents include supplier qualification, material review board, statistical process control, and general corrective action procedures.
The reference documents include supplier qualification, material review board, statistical process control, and general corrective action procedures.
The ANSI-ASQC-Z1.4-1993 Sampling Procedures are included in the reference documents under Exhibit B1, B2, and B3.
The ANSI-ASQC-Z1.4-1993 Sampling Procedures are included in the reference documents under Exhibit B1, B2, and B3.
The incoming inspection procedure covers the inspection of Amertron Inc. Purchased and Customer consigned Wafer Die.
The incoming inspection procedure covers the inspection of Amertron Inc. Purchased and Customer consigned Wafer Die.
The supplier tests data and results checked during verification include COA and COB.
The supplier tests data and results checked during verification include COA and COB.
The form 411-052(003) is used for Silicon (IPD) functional test.
The form 411-052(003) is used for Silicon (IPD) functional test.
The IQC Leadframes Defects are listed under the category of Wafer Die handling.
The IQC Leadframes Defects are listed under the category of Wafer Die handling.
Tape/Bake and Cross Marking Test Methodology are part of ESD control monitoring.
Tape/Bake and Cross Marking Test Methodology are part of ESD control monitoring.
Gold Wire Functionality Test falls under Quality assurance procedures.
Gold Wire Functionality Test falls under Quality assurance procedures.
Flashcards are hidden until you start studying
