17 Questions
The Jedec Standard includes guidelines for the handling, packing, shipping, and use of Moisture/Reflow Sensitive Surface.
True
The Jedec Standard specifies the Functional Test Requirement for Wire Bond Machine.
False
Static Volt Checker is not listed as one of the equipment/tools mentioned for use in the production line.
False
Latching and Unlatching Procedure is covered in Jedec Standard 411-052-8928.
False
Quality Assurance System Procedure is included in Jedec Standard 411-001.
True
Vernier Caliper and Micrometer are both examples of Measuring Equipment listed for use in the production line.
True
The revision history includes changes for FE OSA and IFM modules.
True
The lead frame sampling plan requires 5 strips and 30 points to cover LED, IC, and leads area.
False
According to the procedure, all applicable materials need to go through an outgoing inspection process before being shipped.
False
The reference documents include supplier qualification, material review board, statistical process control, and general corrective action procedures.
True
The ANSI-ASQC-Z1.4-1993 Sampling Procedures are included in the reference documents under Exhibit B1, B2, and B3.
True
The incoming inspection procedure covers the inspection of Amertron Inc. Purchased and Customer consigned Wafer Die.
True
The supplier tests data and results checked during verification include COA and COB.
False
The form 411-052(003) is used for Silicon (IPD) functional test.
True
The IQC Leadframes Defects are listed under the category of Wafer Die handling.
False
Tape/Bake and Cross Marking Test Methodology are part of ESD control monitoring.
False
Gold Wire Functionality Test falls under Quality assurance procedures.
True
Test your knowledge on Jedec Standard for handling, packing, shipping, and use of moisture/reflow sensitive surfaces, along with ESD control monitoring. Explore AI Specs 460-001, functional test requirements, and test methodology related to wire pull, die attach qualification, and more.
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