Introduction to Printed Circuit Boards (PCBs)

<p>To connect conductors on both sides of the PCB (C)</p> Signup and view all the answers

<p>Dielectric loss refers to energy lost as heat. (A)</p> Signup and view all the answers

<p>Problems like open circuit or delamination. (A)</p> Signup and view all the answers

<p>Increased surface area and wire routing options (B)</p> Signup and view all the answers

<p>It is a good conductor of electricity. (C)</p> Signup and view all the answers

<p>A mix of conductive and insulating layers in a stack (A)</p> Signup and view all the answers

<p>Creating a virtual circuit using PCB design software (A)</p> Signup and view all the answers

<p>To provide varying insulation thicknesses. (B)</p> Signup and view all the answers

<p>Silicone (D)</p> Signup and view all the answers

<p>The combination of multiple conducting and insulating layers (A)</p> Signup and view all the answers

<p>Design with specialized PCB creation software (D)</p> Signup and view all the answers

<p>Double-sided PCBs have conductors on both sides and allow for vias (A)</p> Signup and view all the answers

<p>They are cost-effective for prototype testing (A)</p> Signup and view all the answers

<p>To enhance signal integrity by providing a low-resistance path (D)</p> Signup and view all the answers

<p>The shortest distance on the surface of insulation material (D)</p> Signup and view all the answers

<p>They require more advanced technology and materials (A)</p> Signup and view all the answers

<p>Increased routing density for power and signal tracks (D)</p> Signup and view all the answers

<p>To improve the electrical performance and reduce noise (D)</p> Signup and view all the answers

<p>Blind vias (B)</p> Signup and view all the answers

<p>Two additional signal routing layers are created (B)</p> Signup and view all the answers

<p>4, 6, or 8 layers (D)</p> Signup and view all the answers

<p>Increased risk of hairline shorts (B)</p> Signup and view all the answers

<p>0.25 mm (C)</p> Signup and view all the answers

<p>The width of the track (A)</p> Signup and view all the answers

<p>0.38 mm (D)</p> Signup and view all the answers

<p>Higher production precision (A)</p> Signup and view all the answers

<p>They improve current flow and manage heat better (A)</p> Signup and view all the answers

<p>0.020 mm (C)</p> Signup and view all the answers

<p>0.25 mm or 0.38 mm (A)</p> Signup and view all the answers

<p>To allow a component pin to pass through for soldering. (C)</p> Signup and view all the answers

<p>A via connects two layers while a through-hole allows components to be soldered. (D)</p> Signup and view all the answers

<p>The bottom side for soldering (D)</p> Signup and view all the answers

<p>SMT components allow for more dense PCB designs (C)</p> Signup and view all the answers

<p>When minimal copper is acceptable surrounding the via. (A)</p> Signup and view all the answers

<p>Short connection points and small legs (C)</p> Signup and view all the answers

<p>It decreases inductance and improves inspectability. (A)</p> Signup and view all the answers

<p>They can be mounted on both sides of the PCB. (B)</p> Signup and view all the answers

<p>Vias serve only for internal circuit connections, not for component attachment. (C)</p> Signup and view all the answers

<p>An area of copper surrounding the hole is required. (D)</p> Signup and view all the answers

<p>To connect circuit boards to special plugs (C)</p> Signup and view all the answers

<p>Only external connectors may feature through-holes. (B)</p> Signup and view all the answers

<p>SMT legs are soldered on the same side as the component is mounted. (A)</p> Signup and view all the answers

<p>Smaller pads and holes require a more significant ratio for alignment tolerances. (B)</p> Signup and view all the answers

<p>Dissipates heat from components (A)</p> Signup and view all the answers

<p>SMT components tend to be cheaper than THT components. (B)</p> Signup and view all the answers

The side of a single-sided PCB where components are placed.

The opposite side of a single-sided PCB where the solder connections are made.

A method of placing electronic components directly onto a circuit board.

Smaller than Traditional Through-Hole (THT) components.

Soldering done directly to the PCB.

The design of the conductive pathways on a PCB that are created from foil.

Components used to dissipate heat from electronics.

Parts of the PCB used to connect it to a plug.

Vias are holes in a PCB filled with metal, connecting conductor patterns on opposite sides.

Double-sided PCBs offer more space for circuitry and allow wires to cross (on opposite sides), making them suitable for complex circuits.

Multi-layer PCBs consist of alternating layers of insulating material and copper foil, creating a sandwich structure for complex circuits.

The process involves creating a prototype, designing the virtual circuit, laying out components, and designing the circuit tracks.

Breadboards are used to create prototypes for ease and economy of construction, allowing for quick testing and circuit arrangement.

PCB creation software allows for the creation of a virtual circuit, providing a visually interactive design and simulating circuit behavior before actual production.

Designing the circuit track layout with software allows for precise placement, routing, and optimization of conductive pathways for efficient signal flow.

Component layout determines the arrangement of components on a PCB for ease of construction, optimal performance and efficient connectivity.

The process of creating a printed circuit board (PCB) involves designing the circuit layout, transferring the design onto a substrate, etching conductive pathways, and drilling holes for components.

The base material of a PCB, typically made of phenolic paper, epoxy paper, or epoxy glass. It must be non-conductive, heat-resistant, and strong enough to support the electronic components.

An insulating material that prevents electricity from flowing between conductive layers on a PCB. It's used as a barrier to ensure proper electrical isolation.

A common dielectric material used in PCBs, made from an epoxy resin reinforced with glass fibers. It provides good electrical insulation and heat resistance.

Both FR-4 materials but with different thicknesses. Laminates are thicker layers, used for the main PCB base. Prepregs are thinner layers used for building multi-layer boards.

The substrate needs to be non-conductive to prevent unintended electrical connections between components. It ensures that electricity only flows through the designed pathways.

A break in a conductive pathway on a PCB, preventing electricity from flowing through the circuit. This can happen during manufacturing or due to damage.

A separation of layers in a multi-layer PCB, caused by factors like heat or moisture. It can lead to electrical failures and malfunctions.

A via is a small hole connecting layers, while a through-hole is larger and allows a component lead to pass through for soldering.

A via that connects two layers but is not visible on the surface of the PCB.

A via that has very little copper surrounding it, no copper pad around it.

Wider tracks offer lower resistance, lower inductance, ease of etching, inspection, and rework.

It provides space for solder to form a proper meniscus and attach to the PCB.

Vias connect internal layers and do not need to accommodate pins, while through-holes allow for component leads to pass through.

Surface-mounted devices are smaller, more compact, and generally easier to assemble, leaving less space for through-hole components on a PCB.

The minimum width of a track and the minimum spacing between tracks or pads on a printed circuit board (PCB).

The width of a conductive pathway on a PCB, typically measured in millimeters.

The minimum distance between conductive pathways or components on a PCB.

The thickness of the copper foil used for the conductive pathways on a PCB, typically measured in ounces per square foot (oz/ft²).

A protective coating applied to the copper foil on a PCB, affecting properties like corrosion resistance and solderability.

The cost of producing a printed circuit board, affected by factors like track/space resolution, copper thickness, and complexity of the design.

Clearances for surface mount technology (SMT) are typically tighter than for through-hole designs.

Designing a PCB with considerations for manufacturability, such as track widths, clearances, and component placement, ensuring easy and reliable production.

PCB Clearance is the shortest distance through the air between conductors, while Creepage is the shortest distance along the surface of the insulation material.

They provide more space for complex circuits, making the design more compact and allowing more components to be fitted on the board.

Multi-layered Boards typically have even numbers of layers, with 4, 6, and 8 layers being most common.

Usually, one layer is dedicated to a ground plane and one to a power plane, with additional layers for signal routing.

Three types exist: Through vias connecting all layers, Blind vias connecting the outer layers to one inner layer, and Buried vias connecting two inner layers.

Moving from a 4-layer to a 6-layer PCB allows for dedicated power planes while still having signal routing layers.

They allow for complex routing, increased density, and are often more compact; however, they are more expensive and difficult to manufacture.