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Questions and Answers
What is the function of an IC package?
What is the function of an IC package?
- To regulate the power supply for the integrated circuit
- To control the temperature of the integrated circuit
- To amplify the signals from the integrated circuit
- To provide protection and support for the integrated circuit (correct)
Which material is commonly used for IC packaging?
Which material is commonly used for IC packaging?
- Wood and rubber
- Plastic and ceramic (correct)
- Glass and metal
- Paper and fabric
What does RoHS stand for in relation to IC packaging?
What does RoHS stand for in relation to IC packaging?
- Reduction of operational heat stress
- Restriction on the use of hazardous substances (correct)
- Reinforcement of overall hardware security
- Regulation of high-speed circuits
Which type of semiconductor includes Silicon and Germanium?
Which type of semiconductor includes Silicon and Germanium?
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What does Moore's Law primarily predict in terms of IC integration?
What does Moore's Law primarily predict in terms of IC integration?
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Study Notes
IC Package Function
- Protects integrated circuits from physical damage and environmental factors.
- Provides a means for electrical connections to the circuit board.
- Assists in heat dissipation, maintaining optimal operating temperatures for the IC.
Materials Used for IC Packaging
- Commonly utilized materials include epoxy resins and ceramic compounds.
- Silicone is often used for encapsulation due to its moisture resistance and durability.
RoHS in IC Packaging
- RoHS stands for Restriction of Hazardous Substances.
- A directive aimed at limiting the use of certain hazardous materials in electronic products, including lead and mercury.
Types of Semiconductors
- Silicon and Germanium are classified as elemental semiconductors.
- These materials are fundamental for the manufacture of various electronic components.
Moore's Law Predictions
- Primarily forecasts the doubling of transistor density on integrated circuits approximately every two years.
- Impacts the performance, power efficiency, and cost-effectiveness of electronic devices.
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