Podcast
Questions and Answers
The relationship between a material's response to applied load or force reflects its ______ properties.
The relationship between a material's response to applied load or force reflects its ______ properties.
mechanical
______ provides consistency in the manner in which tests are conducted and the results are interpreted.
______ provides consistency in the manner in which tests are conducted and the results are interpreted.
ASTM
______ produces an elongation of the material.
______ produces an elongation of the material.
Tension
______ produces contraction of the material being tested.
______ produces contraction of the material being tested.
______ is similar to a frictional force.
______ is similar to a frictional force.
______ produces a rotational motion.
______ produces a rotational motion.
The tensile test is typically ______, as the specimen is permanently deformed and fractured.
The tensile test is typically ______, as the specimen is permanently deformed and fractured.
In tensile testing, the load is applied ______ along the long axis of a specimen.
In tensile testing, the load is applied ______ along the long axis of a specimen.
In engineering stress calculations, $σ = \frac{F}{A_0}$, $A_0$ represents the ______.
In engineering stress calculations, $σ = \frac{F}{A_0}$, $A_0$ represents the ______.
In engineering strain calculations, $ϵ = \frac{l_i - l_0}{l_0}$, $l_i$ represents the ______.
In engineering strain calculations, $ϵ = \frac{l_i - l_0}{l_0}$, $l_i$ represents the ______.
Unlike tensile tests, compression tests are used when a material is ______ in tension.
Unlike tensile tests, compression tests are used when a material is ______ in tension.
In shear stress calculations, τ = F/A0, F represents the load applied ______ to the upper and lower faces.
In shear stress calculations, τ = F/A0, F represents the load applied ______ to the upper and lower faces.
______ deformation is non-permanent; the material returns to its original shape when the load is removed.
______ deformation is non-permanent; the material returns to its original shape when the load is removed.
Elastic deformation obeys ______ which mathematically relates stress and strain.
Elastic deformation obeys ______ which mathematically relates stress and strain.
In the equation σ = Eε, E represents ______ and indicates the stiffness of a material.
In the equation σ = Eε, E represents ______ and indicates the stiffness of a material.
Stress is no longer proportional to strain in ______ deformation.
Stress is no longer proportional to strain in ______ deformation.
The ______ is the point on a stress-strain curve where yielding or initial departure from linearity occurs.
The ______ is the point on a stress-strain curve where yielding or initial departure from linearity occurs.
______ is determined by constructing a parallel line to the elastic portion of the stress-strain curve at 0.002 strain offset.
______ is determined by constructing a parallel line to the elastic portion of the stress-strain curve at 0.002 strain offset.
The ______ corresponds to the maximum stress that can be sustained by a structure in tension.
The ______ corresponds to the maximum stress that can be sustained by a structure in tension.
The ______ is the eventual breaking of the material.
The ______ is the eventual breaking of the material.
______ measures the degree of plastic deformation that has been sustained at fracture.
______ measures the degree of plastic deformation that has been sustained at fracture.
A ______ material experiences very little plastic deformation.
A ______ material experiences very little plastic deformation.
______ is the capacity of a material to absorb energy when it is deformed elastically and then, upon unloading, to have this energy recovered.
______ is the capacity of a material to absorb energy when it is deformed elastically and then, upon unloading, to have this energy recovered.
______ is the measure of a material’s resistance to localized plastic deformation, such as a small dent or a scratch.
______ is the measure of a material’s resistance to localized plastic deformation, such as a small dent or a scratch.
The ______ is used to measure a material's resistance to localized plastic deformation, such as small dents or scratches.
The ______ is used to measure a material's resistance to localized plastic deformation, such as small dents or scratches.
______ describes the response of a material to an applied electric field.
______ describes the response of a material to an applied electric field.
According to Ohm's Law, voltage is described by the equation $V = ______$
According to Ohm's Law, voltage is described by the equation $V = ______$
______ specifies the electrical character of a material.
______ specifies the electrical character of a material.
Materials with conductivity values ~10-6 to 104 (Ω-m)-1 are classified as ______.
Materials with conductivity values ~10-6 to 104 (Ω-m)-1 are classified as ______.
Materials with conductivity values ~10-10 to 10-20 (Ω-m)-1 are classified as ______.
Materials with conductivity values ~10-10 to 10-20 (Ω-m)-1 are classified as ______.
The electrical properties of a solid material are a consequence of its ______.
The electrical properties of a solid material are a consequence of its ______.
In ______, an outermost band is only partially filled with electrons.
In ______, an outermost band is only partially filled with electrons.
For ______, the filled valence band is separated from the empty conduction band by a relatively large band gap (> 2eV).
For ______, the filled valence band is separated from the empty conduction band by a relatively large band gap (> 2eV).
Conduction in terms of energy band, occurs when very little energy is required to promote electrons into the ______ energy states.
Conduction in terms of energy band, occurs when very little energy is required to promote electrons into the ______ energy states.
In conduction of electricity, for insulators and semiconductors, empty states adjacent to the top of the filled valence band are ______.
In conduction of electricity, for insulators and semiconductors, empty states adjacent to the top of the filled valence band are ______.
______ mathematically describes the contributions of thermal vibrations, impurities, and plastic deformation to resistivity.
______ mathematically describes the contributions of thermal vibrations, impurities, and plastic deformation to resistivity.
______ is the phenomenon by which materials assert an attractive or repulsive force on other materials.
______ is the phenomenon by which materials assert an attractive or repulsive force on other materials.
______ is a weak form of magnetism that is nonpermanent and persists only while an external magnetic field is being applied.
______ is a weak form of magnetism that is nonpermanent and persists only while an external magnetic field is being applied.
In the absence of an external field, diamagnetic substances have ______.
In the absence of an external field, diamagnetic substances have ______.
______ occurs when the atomic magnetic moments of materials preferentially align with an applied external field.
______ occurs when the atomic magnetic moments of materials preferentially align with an applied external field.
Both diamagnetic and paramagnetic materials are considered to be ______ because they exhibit magnetization only when in the presence of an external field.
Both diamagnetic and paramagnetic materials are considered to be ______ because they exhibit magnetization only when in the presence of an external field.
______ is Characterized by a permanent magnetic moment in the absence of an external field
______ is Characterized by a permanent magnetic moment in the absence of an external field
______ describes the response of a material to the application of heat.
______ describes the response of a material to the application of heat.
______ indicates the material’s ability to absorb heat from the surroundings.
______ indicates the material’s ability to absorb heat from the surroundings.
The change in length of a solid material with temperature is referred to as ______.
The change in length of a solid material with temperature is referred to as ______.
Flashcards
Mechanical properties of materials?
Mechanical properties of materials?
Reflects how a material responds to applied force or load.
ASTM's Role?
ASTM's Role?
Provides consistency in conducting tests and interpreting results.
Tension?
Tension?
Force applied to stretch or elongate a material.
Compression?
Compression?
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Shear?
Shear?
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Torsion?
Torsion?
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Tension tests?
Tension tests?
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Compression tests?
Compression tests?
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Engineering Stress (σ)?
Engineering Stress (σ)?
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Engineering Strain (ε)?
Engineering Strain (ε)?
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Elastic Deformation?
Elastic Deformation?
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Plastic Deformation?
Plastic Deformation?
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Proportional Limit (P)?
Proportional Limit (P)?
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Yield Strength (σy)?
Yield Strength (σy)?
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Tensile Strength (TS)?
Tensile Strength (TS)?
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Fracture Point (F)?
Fracture Point (F)?
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Ductility?
Ductility?
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Hardness?
Hardness?
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Resilience?
Resilience?
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Toughness?
Toughness?
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Electrical properties?
Electrical properties?
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Ohm's Law?
Ohm's Law?
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Electrical conductivity (σ)?
Electrical conductivity (σ)?
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Resistivity (ρ)?
Resistivity (ρ)?
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Conductors?
Conductors?
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Semiconductors?
Semiconductors?
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Insulators?
Insulators?
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Electrical Conductivity?
Electrical Conductivity?
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Magnetism?
Magnetism?
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Diamagnetism?
Diamagnetism?
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Paramagnetism?
Paramagnetism?
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Ferromagnetism?
Ferromagnetism?
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Soft Magnet?
Soft Magnet?
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Hard Magnet?
Hard Magnet?
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Thermal properties?
Thermal properties?
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Heat Capacity (C)?
Heat Capacity (C)?
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Thermal Expansion
Thermal Expansion
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Linear Coefficient of Thermal Expansion?
Linear Coefficient of Thermal Expansion?
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Thermal Conductivity?
Thermal Conductivity?
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Thermal Stress?
Thermal Stress?
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Study Notes
- ENS 167: Fundamentals of Materials Science and Engineering covers the properties of materials
- Prepared by PROF. JOSHUA B. ZOLETA, PHD
Properties of Materials
- Mechanical, electrical, electronic,magnetic and thermal properties of materials are investigated
Mechanical Properties of Materials
- The mechanical properties reflect a material's response to applied loads or forces
- These are determined through controlled laboratory experiments that simulate service conditions
- Processing impacts structure, which in turn dictates properties and ultimate performance
- The American Society for Testing and Materials (ASTM) promotes consistency in testing and results interpretation
- ASTM publishes standardized testing techniques
Four Principal Ways of Load/Force Applications
- Tension produces elongation
- Compression produces contraction
- Shear is similar to frictional force
- Torsion produces rotational motion
Tension Tests
- Tension tests help ascertain mechanical properties important for design
- Load application is uniaxial along the specimen's long axis
- The specimen experiences deformation to fracture under gradually increasing tensile load
- These tests are destructive as the test specimen is permanently deformed and fractured, and typically take several minutes
Mechanical Properties
- Engineering stress (σ) is the instantaneous load (F) applied perpendicularly to the specimen's cross-sectional area (A₀), measured in Pascals (Pa) or pounds per square inch (psi)
- 1 Pa equals 1 N/m²
- 1 psi equals 1 lb/in²
- Engineering strain (€) is defined as (li - l₀) / l₀ = Δl / l₀, using original length (l₀), instantaneous length (li), and change in length (Δl)
Compression Tests
- Similar to tensile tests, but applies compressive force
- Specimens contract along the stress direction
- Materials brittle in tension are usually tested
- Compressive force is taken to be negative in calculations
Shear Tests
- Shear stress (τ) equals F/A₀, where F is the load applied parallel to the upper and lower faces, and A₀ is the area under consideration
- Shear strain (γ) can be calculated: γ = tan θ
Elastic vs. Plastic Deformation
- Elastic deformation sees stress and strain being proportional
- It is non-permanent
- When the load is removed, the piece returns to its original shape
- Elastic deformation obeys Hooke’s Law: σ = E€
- σ = stress
- € = strain
- E = Young's modulus
- Higher the E value means a stiffer material
- Plastic deformation sees stress no longer being proportional to strain
- It is permanent and the piece will not return to its original shape when the stress is removed
- Atoms do not return to their original positions
Definitions of material strengths
- Proportional Limit (P) is the point of yielding, or the initial departure from linearity in the stress-strain curve
- Yield Strength (σy) gives a more precise point of yielding
- Found by drawing a parallel line to the elastic portion of the stress-strain curve at 0.002 strain offset
- A measure of a material's resistance to plastic deformation
- Tensile Strength (TS) is the stress at the maximum on the stress-strain curve
- It corresponds to the maximum stress a structure can withstand in tension
- Fracture Point (F) is when the material finally fractures
Ductility, Resilience, Toughness and Hardness
- Ductility measures the degree of plastic deformation at fracture
- Brittle materials experience very little plastic deformation
- Resilience measures a material's capacity to absorb energy during elastic deformation and release it upon unloading
- Toughness measures a material's ability to absorb energy up to fracture
- Hardness measures a material's resistance to localized plastic deformation, like dents or scratches. It is the ability of a material to scratch another material that is softer
- The Mohs Scale of Hardness ranks materials from 1 (Talc) to 10 (Diamond)
Electrical Properties of Materials
- Describes how a material responds to an applied electric field
- Ohm's Law relates current (I) to applied voltage (V) using the equation V = IR, where R is resistance
- V is measured in Volts (J/C)
- I is measured in Amperes (C/s)
- R is measured in Ohms (V/A)
- Electrical conductivity (σ) is the reciprocal of resistivity (ρ) and specifies a material's electrical character
- Conductivity indicates the ease with which a material conducts electric current
Resistivity
- Resistivity (ρ) is defined as RA/l, where R is resistance, A is cross-sectional area, and l is the distance between voltage measurement points
Conductivity Classification
- Conductors have conductivity values around ~10⁷ (Ω-m)⁻¹
- Semiconductors have intermediate conductivity around ~10⁻⁶ to 10⁴ (Ω-m)⁻¹
- Insulators have low conductivity values around ~10⁻¹⁰ to 10⁻²⁰ (Ω-m)⁻¹
- Electrical properties depend on electron band structure and electron arrangement
- Electron energy band is a series of closely spaced electron states in the material
Band Types
- In metals such as copper, a partially filled outermost band allows electron states above and adjacent to filled states
- Insulators have a filled valence band separated by a large band gap (> 2eV)
- Semiconductors have a similar structure to insulators but has a narrow band gap (< 2eV)
Conduction
- In conductors, minimal energy is needed to move electrons to vacant states
- An electric field is sufficient to excite many electrons into conducting states
- Insulators and semiconductors require electrons to jump the energy band gap to reach conducting states
- Matthiessen's Rule says total resistivity equals thermal resistivity plus impurity resistivity and plus plastic deformation resistivity
Magnetic Properties of Materials
- Magnetism is the phenomenon where materials exert attractive or repulsive forces on other materials
- All substances, including iron, are influenced to some degree by magnetic fields
- Magnetism is generated by moving electrically charged particles
Diamagnetism
- A weak, nonpermanent form of magnetism present only with an external magnetic field
- Caused by changes in electron orbital motion
- Materials are attracted to regions where the magnetic field is weak between strong electromagnet poles
- Present in all materials but only observed when other types of magnetism are absent
- Dipoles are induced opposite to the field direction when in the presence of a field,
- No dipoles exist in the absence of an external field
Paramagnetism
- Results when atomic magnetic moments align with an external field
- Magnetic moments are random in the absence of an external field
- Dipoles preferentially align with the field when in the presence of a field
- Both diamagnetic and paramagnetic materials are considered non-magnetic and exhibit magnetization only in the presence of external field
Ferromagnetism
- Characterized by a permanent magnetic moment, even without an external field
- Exhibits very large magnetic susceptibilities and permanent magnetizations
- Examples: BCC iron, cobalt, and nickel
Influence of Temperature
- Raising temperature increases thermal vibrations, which randomizes aligned magnetic moments
Ferromagnetic Materials
- Soft magnets are used in devices needing low energy losses in alternating magnetic fields, such as transformer cores
- Hard magnets are used in permanent magnets and are resistant to demagnetization
Thermal Properties of Materials
- Describes the way a material responds to heat application
- Solid materials see rising temperatures and increased dimensions as they absorb heat
- Thermal properties of solids include heat capacity, thermal expansion, and thermal conductivity
Thermal capacity
- Heat capacity (C), measured in J/mol·K is dQ/dT
- It describes a material's ability to absorb heat from its surroundings
- It represents the energy required to raise the temperature by 1°
- dQ is the energy used to produce a dT temperature change
- Cv is heat capacity measured at constant volume
- Cp is heat capacity at constant external pressure
Thermal Expansion and Stress
- Thermal expansion is the change in length of a solid material with temperature, expanding when heating and contracting when cooling
- Linear coefficient of thermal expansion (αt) indicates how much a material expands upon heating
- units: (°C)⁻¹ or (°F)⁻¹
- Equation of thermal expansion:
- Metals: intermediate values from 5x10-6 to 25x10-6 (°C)-1
- Ceramics: low (0.5x10-6 to 15x10-6 (°C)-1) due to relatively strong interatomic bonding forces
- Polymers: very large (50x10-6 to 400x10-6 (°C)-1) due to weak intermolecular bonds
Thermal Conductivity
- Describes the transport heat from high to low temperature regions in a material
- Characterizes a material's ability to transfer heat, q = -k(dT/dx)
- (-) sign indicates the heat flows down the temperature gradient
- q = heat flow per unit time per unit area (W/m²)
- k = thermal conductivity (W/m-K)
- dT/dx = temperature gradient
- Thermal stress is induced in a body due to temperature change or as a result of restrained thermal expansion and contraction
- Equation: σ = Eαt(T₀ - Tf ) = EαtΔT
- Upon heating, if Tf > T₀, stress is compressive (σ < 0)
- Upon cooling, if Tf < T₀, tensile stress is imposed (σ > 0)
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