Electronics: Diodes and Transistors

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Questions and Answers

What is the primary function of a Zener diode?

  • To convert AC to DC
  • To convert light into electrical current
  • To regulate voltage (correct)
  • To emit light when current flows

What type of transistor uses both positive and negative charge carriers?

  • Bipolar Junction Transistors (BJTs) (correct)
  • Field-Effect Transistors (FETs)
  • Unipolar Junction Transistors (UJTs)
  • Diode Transistors

What is the purpose of the doping step in the fabrication process?

  • To produce a silicon wafer
  • To create patterns on the semiconductor material
  • To introduce impurities to alter the semiconductor's electrical properties (correct)
  • To add metal interconnects

What type of Integrated Circuit (IC) processes both analog and digital signals?

<p>Mixed-Signal ICs (D)</p> Signup and view all the answers

What is the main difference between a rectifier diode and an LED?

<p>Functionality (D)</p> Signup and view all the answers

In the fabrication process, what step follows layer formation?

<p>Doping (D)</p> Signup and view all the answers

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Study Notes

Diodes

  • A type of semiconductor device with two terminals (anode and cathode)
  • Allows current to flow in one direction but blocks it in the other
  • Types:
    • Rectifier diodes: convert AC to DC
    • Zener diodes: regulate voltage
    • LED (Light Emitting Diode): emits light when current flows
    • Photodiodes: converts light into electrical current

Transistors

  • A type of semiconductor device with three terminals (base, collector, and emitter)
  • Amplifies or switches electronic signals
  • Types:
    • Bipolar Junction Transistors (BJTs): uses both positive and negative charge carriers
    • Field-Effect Transistors (FETs): uses voltage to control current flow
    • Unipolar Junction Transistors (UJTs): similar to BJTs but with a single type of charge carrier

Integrated Circuits (ICs)

  • A set of electronic components (e.g. transistors, diodes, resistors) on a single piece of semiconductor material
  • Designed to perform a specific electronic function
  • Types:
    • Analog ICs: process continuous signals
    • Digital ICs: process discrete signals
    • Mixed-Signal ICs: process both analog and digital signals

Fabrication Process

  • A series of steps to create semiconductor devices:
    1. Wafer preparation: produce a silicon wafer
    2. Layer formation: deposit and pattern layers of material (e.g. insulators, conductors, semiconductors)
    3. Doping: introduce impurities to alter the semiconductor's electrical properties
    4. Etching: remove material to create patterns
    5. Metallization: add metal interconnects
    6. Packaging: assemble and protect the device

Device Physics

  • P-N Junction: a region where p-type (positive) and n-type (negative) semiconductor materials meet
  • Depletion region: a region near the p-n junction where charge carriers are depleted
  • Bandgap energy: the energy difference between the valence and conduction bands of a semiconductor material
  • Carrier mobility: the ease with which charge carriers move through a semiconductor material

Diodes

  • A diode has two terminals: an anode and a cathode.
  • Diodes allow current to flow in one direction but block it in the other.
  • Rectifier diodes convert AC to DC.
  • Zener diodes regulate voltage.
  • LED (Light Emitting Diode) emits light when current flows.
  • Photodiodes convert light into electrical current.

Transistors

  • A transistor has three terminals: base, collector, and emitter.
  • Transistors amplify or switch electronic signals.
  • Bipolar Junction Transistors (BJTs) use both positive and negative charge carriers.
  • Field-Effect Transistors (FETs) use voltage to control current flow.
  • Unipolar Junction Transistors (UJTs) are similar to BJTs but with a single type of charge carrier.

Integrated Circuits (ICs)

  • ICs are a set of electronic components on a single piece of semiconductor material.
  • ICs are designed to perform a specific electronic function.
  • Analog ICs process continuous signals.
  • Digital ICs process discrete signals.
  • Mixed-Signal ICs process both analog and digital signals.

Fabrication Process

  • Wafer preparation involves producing a silicon wafer.
  • Layer formation involves depositing and patterning layers of material (e.g. insulators, conductors, semiconductors).
  • Doping introduces impurities to alter the semiconductor's electrical properties.
  • Etching removes material to create patterns.
  • Metallization adds metal interconnects.
  • Packaging involves assembling and protecting the device.

Device Physics

  • A P-N Junction is a region where p-type (positive) and n-type (negative) semiconductor materials meet.
  • The depletion region is a region near the p-n junction where charge carriers are depleted.
  • Bandgap energy is the energy difference between the valence and conduction bands of a semiconductor material.
  • Carrier mobility is the ease with which charge carriers move through a semiconductor material.

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