Electronic Components & Circuit Design

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Questions and Answers

Which of the following is NOT an advantage of MOSFETs over BJTs?

  • Very high input resistance
  • High frequency of operations
  • High power loss (correct)
  • Low on-state resistance

Transistors can only be used for amplification of analog signals.

False (B)

Name two applications of transistors beyond signal amplification.

Switching devices, Oscillators

Transistors are available in two primary package types: through-hole (DIP) and ______.

<p>SMD</p> Signup and view all the answers

Match the following package types with their corresponding mounting technology:

<p>TO-92 = Through-Hole SOT23 = Surface Mount TO-220 = Through-Hole D2PAK = Surface Mount</p> Signup and view all the answers

When selecting a transistor, which parameter is LEAST likely to be a primary consideration for circuit design?

<p>Transistor color (C)</p> Signup and view all the answers

Distributor/Vendor Part Numbers (VPN) and Manufacturing Part Numbers (MPN) uniquely identify electronic components.

<p>True (A)</p> Signup and view all the answers

What type of document explains the performance, features, and specifications of a basic electronic component?

<p>Datasheet</p> Signup and view all the answers

During PCB stack-up design, what considerations are crucial for accommodating high-speed signals?

<p>Selecting laminate materials and designing plane layers for impedance control. (A)</p> Signup and view all the answers

Ammeters are connected in parallel to a device to measure its current.

<p>False (B)</p> Signup and view all the answers

What is the primary purpose of a voltmeter?

<p>to measure the potential difference between two points in an electric circuit</p> Signup and view all the answers

Which of the following applications is most suited for a microcontroller?

<p>Washing machine control (D)</p> Signup and view all the answers

To measure the voltage of a component, a voltmeter must be connected in ______ with that component.

<p>parallel</p> Signup and view all the answers

A microprocessor includes inbuilt memory, communication interfaces, and general-purpose I/Os.

<p>False (B)</p> Signup and view all the answers

Match the stage in PCB design with its primary objective:

<p>Component Placement = Arranging components to comply with the design’s mechanical requirements Routing = Using ECAD software to set trace geometry and ensure impedance control Design Review and Verification = Inspecting the design to ensure there are no mistakes or unresolved problems Preparing for Manufacturing = Generating standard manufacturing files for automated fabrication and assembly</p> Signup and view all the answers

Which of the following is a critical aspect of the 'Routing' stage in ECAD software for PCB design?

<p>Setting trace geometry to ensure impedance control. (D)</p> Signup and view all the answers

Name three communication interfaces commonly found in microcontrollers.

<p>SPI, I2C, UART</p> Signup and view all the answers

Digital Signal Processors (DSPs) are specifically designed for high-computing applications like image processing, speech processing, and ______.

<p>video compression</p> Signup and view all the answers

Terminal voltage can be measured directly across the EMF without considering the internal resistance.

<p>False (B)</p> Signup and view all the answers

Which type of integrated circuit is best suited for implementing custom digital logic functions that can be reconfigured after manufacturing?

<p>FPGA (D)</p> Signup and view all the answers

What is the main difference between an analog and a digital voltmeter?

<p>Analog voltmeters use a pointer on a scale, while digital voltmeters provide a numerical display. (A)</p> Signup and view all the answers

Match the integrated circuit type with its primary function:

<p>Operational Amplifiers = Signal amplification and conditioning Voltage Regulators = Maintaining a stable voltage supply Interfacing ICs = Enabling communication between different systems ADCs/DACs = Converting analog signals to digital and vice versa</p> Signup and view all the answers

Which IC package type is commonly used for high pin-count devices requiring a small footprint?

<p>BGA (D)</p> Signup and view all the answers

SOIC packages are through-hole components, meaning they are inserted into holes drilled in a printed circuit board.

<p>False (B)</p> Signup and view all the answers

Which of the following is the MOST significant reason for the increasing preference of automation in industries?

<p>To improve productivity, reduce time and cost, and enhance safety. (B)</p> Signup and view all the answers

Smart grid systems only provide one-way communication from the power source to the consumer.

<p>False (B)</p> Signup and view all the answers

Name three features of smart grid systems.

<p>Digital system based on two-way communication, Interactive Sensors, Self-monitoring and Debugging</p> Signup and view all the answers

The process of extracting 3D information from 2D images is a key aspect of ______.

<p>image processing</p> Signup and view all the answers

Match the following applications with their corresponding fields:

<p>Face and gesture recognition = Computer Vision Navigation = Robotics Smart Meters = Smart Grid Systems Physiological analysis = Medical Applications</p> Signup and view all the answers

Which of the following is NOT a typical application of image processing?

<p>Power Converting Technologies (D)</p> Signup and view all the answers

Medical applications only involve basic instruments for simple data recording.

<p>False (B)</p> Signup and view all the answers

Give three examples of advanced consumer devices.

<p>Setup Box, ATM, Dishwasher</p> Signup and view all the answers

What is the primary purpose of a part number?

<p>To provide specific information about the part, such as type, characteristics, and supplier. (C)</p> Signup and view all the answers

Electronic component distributors primarily stock components from a single manufacturer to ensure quality control.

<p>False (B)</p> Signup and view all the answers

Name three passive components that are found on an IC.

<p>Resistors, capacitors, inductors.</p> Signup and view all the answers

Integrated circuits are typically built on a semiconductor wafer, commonly made of ______.

<p>silicon</p> Signup and view all the answers

Which characteristic is commonly associated with integrated circuits (ICs) due to their small size?

<p>Low power consumption (C)</p> Signup and view all the answers

Match the following IC types with their primary functionality:

<p>Digital IC = Performs logic operations and processes digital data. Analog IC = Processes continuous signals, such as audio or sensor data. Mixed-Signal IC = Combines both digital and analog functions in a single chip.</p> Signup and view all the answers

Which of the following is an example of a complex digital IC?

<p>Microprocessor (C)</p> Signup and view all the answers

A microprocessor's functionality is fixed and cannot be altered after manufacturing.

<p>False (B)</p> Signup and view all the answers

Which statement accurately compares wet and dry oxidation?

<p>Wet oxidation is faster, but dry oxidation results in better electrical properties. (D)</p> Signup and view all the answers

The diffusion process is temperature-independent, allowing consistent impurity introduction regardless of thermal conditions.

<p>False (B)</p> Signup and view all the answers

What is the typical temperature range (in degrees Celsius) for diffusion processes in semiconductor manufacturing?

<p>1000 to 1200</p> Signup and view all the answers

In ion implantation, the depth of ion penetration is primarily determined by the applied energy and the accelerating field ______.

<p>voltage</p> Signup and view all the answers

What is the primary advantage of performing ion implantation at low temperatures?

<p>It allows the implantation process to occur at room temperature. (C)</p> Signup and view all the answers

Which of the following is a characteristic of Chemical Vapor Deposition (CVD)?

<p>the process is carried out at a pressure below atmospheric pressure. (B)</p> Signup and view all the answers

In semiconductor processing, doping exclusively improves the insulating properties of a material.

<p>False (B)</p> Signup and view all the answers

Match the following doping elements with their corresponding conductivity type in silicon:

<p>Antimony = n-type Boron = p-type Phosphorus = n-type Gallium = p-type</p> Signup and view all the answers

Flashcards

Home Appliances

Appliances such as washing machines, refrigerators, and microwave ovens used in homes.

Advanced Consumer Devices

Advanced devices like set-top boxes, ATMs, and smartphones.

Storage and Infotainment Devices

Devices for storing and playing optical media like DVDs and portable MP3 players.

Industrial Automation

Using technology to automate manufacturing and other industrial processes.

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Smart Grid Systems

Electric systems that use communication technology to gather and respond to power consumption data.

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Automation Benefits

Replacing human labor with machines for increased productivity and safety.

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Image Processing

Extracting meaningful information from digital images using algorithms.

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Medical Applications

Using sophisticated instruments for physiological analysis and data recording in healthcare.

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MOSFET advantages

Very high input resistance, low on-state resistance, low power loss, high frequency operation.

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Transistor Applications

Amplification, switching, oscillators, over/under voltage protection, modulation/demodulation, power control.

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Transistor packages

Through-hole (DIP) and Surface Mount Device (SMD).

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Transistor Parameters (1/2)

Maximum collector current (Ic), collector voltage (Vce), Saturation Vce (sat) voltage, Current gain (hfe/ß).

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Transistor Parameters (2/2)

Input/Output resistance, Reverse breakdown voltage, Max reverse current, Power dissipation, Operating junction temperature, Size & Switching time/frequency.

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Component Part Numbers

Manufacturers assign part numbers (MPN); distributors assign vendor part numbers (VPN).

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Component Datasheet

Explains performance, features, and specifications.

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DIP package examples

TO-92, TO- 220

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Wet Oxidation

A silicon dioxide formation method known for speed, but potentially lower electrical properties.

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Dry Oxidation

A silicon dioxide formation method known for good electrical insulation properties, although it can be slower.

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Diffusion

The process of introducing impurity atoms into a semiconductor material to alter its electrical conductivity.

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Dopants

Impurities added to silicon to modify its electrical properties.

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Part Number

Alphanumeric code providing information about a part's type, characteristics, and supplier.

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Component Distributors

Companies that stock components from multiple manufacturers, offering a convenient way to purchase components.

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High-Temperature Furnaces

Furnaces that maintain high temperatures, typically between 1000-1200 degrees Celsius, for diffusion processes.

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Ion Implantation

A process of accelerating ions towards a solid target to change its properties.

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Integrated Circuit (IC)

An electronic circuit on a semiconductor wafer, containing miniaturized components connected by metal traces.

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Digital ICs

ICs designed to process discrete values, representing logic states (0 or 1).

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Impurity Introduction (Ion Implantation)

A process that introduces impurity atoms into a crystal lattice by bombardment with accelerated ions.

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Chemical Vapor Deposition (CVD)

A process used to produce high-quality solid materials, as thin films, where chemical reactions occur on a substrate surface from gaseous precursors.

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Simple Digital ICs

Basic digital ICs like timers, counters, logic gates, etc.

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Complex Digital ICs

Complex digital ICs like microprocessors, memories, and switching ICs.

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Microprocessor/Microcontroller

An IC that can process digital data and perform control functions.

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Microprocessor Control Function

Using a microprocessor to control a system based on sensor inputs, like temperature.

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Microprocessor

Complex IC with CPU (ALU, registers, buffer, clock). Needs external RAM/ROM.

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Microcontroller

IC with CPU, memory, I/O, and communication interfaces (SPI, I2C, UART, ADC, DAC, PWM).

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DSP Controllers

Processors optimized for high-computing tasks like image, speech, and video processing.

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Analog ICs

ICs such as op-amps, differential amps, ADCs and DACs.

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Interfacing ICs

ICs like RS232 drivers, Ethernet controllers, CAN bus drivers, buffers, and level converters.

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Power ICs

ICs such as linear regulators, LDOs, and switching regulators, for managing voltage levels.

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Small Outline Integrated Circuit (SOIC)

Integrated circuit package characterized by its small outline and surface-mount design, with pins along two sides.

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Thin-Shrink Small Outline Package (TSSOP)

Integrated circuit package with a small outline and thin profile, utilizing surface-mount technology and pins along two sides.

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Material Selection & PCB Stack-up

Selecting laminate materials and designing the PCB stack-up to meet requirements for plane layers, signal layers, routing, and material properties.

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Component Placement

Arranging components on the PCB layout, considering mechanical requirements and design constraints.

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PCB Routing

Using ECAD software to create trace routes, ensuring impedance control for high-speed signals.

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Design Review and Verification

Inspecting the design to find & fix errors, ensuring that it meets all specifications and requirements.

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Preparing for Manufacturing

Generating standard manufacturing files for automated fabrication and assembly.

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Voltmeter

A voltmeter measures the electrical potential difference (voltage) between two points in a circuit.

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Voltmeter Connection

To measure voltage, a voltmeter must be connected in parallel with the component being measured.

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Ammeter

An ammeter measures the electric current flowing through a circuit.

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Study Notes

Cambridge Institute of Technology

  • Located in K.R. Puram, Bangalore - 560 036
  • The vision is to become a premier institute transforming students into global professionals.

Mission

  • Attract and retain competent faculty and support staff.
  • Create state-of-the-art infrastructure to impart quality education and support research.
  • Adopt a tertiary approach in the teaching-learning pedagogy that transforms students for competence.
  • Students become competent technocrats and managers.
  • Nurture and train students to develop the qualities of global professionals.

Dr. Ravi Kumar.M

  • Associate Professor, Department of Electronics & Communication Engineering

Department of Basic Sciences Vision

  • Provide quality education in Science, Technology, Engineering, and Mathematics (STEM).
  • Nurture students in developing professional competencies and human values.

Department of Basic Sciences Mission

  • Adopt student-centric pedagogy to teach the fundamentals of STEM necessary for engineering studies.
  • Nurture and train students to develop analytical, logical reasoning, and problem-solving skills.
  • Inculcate ethical and social values for holistic development.

Module 1: Introduction

  • Module is an introduction to electronics and communication.

Introduction to Electronics

  • Electronics relates to electrons, stemming from electron mechanics.
  • Electronics is an engineering branch concerning current flow through semiconductors.
  • Electronics handles electric circuits with active and passive elements and underlying techniques.

Need for Electronics

  • Machine robots can perform human work with ease and high efficiency.
  • Wireless sensors in capsules and tablets collect information from the body for diagnostics.
  • Transparent smartphones may emerge, potentially replacing PC screens and TV monitors with windows or mirrors.
  • Sensors detect water shortage in plants to alert farmers.
  • Electronic devices comprise active and passive elements and smaller IC memories.
  • ICs, diodes, and transistors are made of semiconductor materials and rely on current flow.

History of electronics

  • The history of electronics began with the invention of the vacuum diode.
  • John Ambrose Fleming invented the vacuum diode.
  • The vacuum diode came to be in 1897.
  • A vacuum tube consists of anode and cathode electrode plates.
  • Current is allowed to flow only in one direction.
  • Current flow cannot be controlled using the diode.
  • Lee De Forest modified the device in 1906 and named it Vacuum Triode.
  • The Triode has three terminals: anode, cathode, and a grid that controls current flow.
  • The invention of the vacuum diode led to the electronics era.
  • The real development in electronics began in 1948 with the invention of the transistor.
  • John Bardeen, Walter Brattain, and William Shockley invented the transistor in Bell Laboratories.
  • This feature could boost the power of electrical signals, which lead to the eventual development of the Tetrode and Pentode.
  • Large, bulky vacuum diodes are replaced with junction transistors.
  • Transistors were initially made of germanium, later using silicon BJT.
  • Devices are now made of silicon due to its low cost
  • Jack Kilby introduced the concept of the integrated circuit (IC) to reduce size and cost.
  • Jack Kilby's idea changed the world entirely.
  • Complete interconnected circuits are placed on single chips called VLSI (Very Large Scale Integrated).
  • Modern computer processors contain billions of transistors integrated on a single IC.

Electronics Systems Block Diagram, Sensors, Controllers and Actuators.

  • There are three main stages in the system block diagram
  • Sensor (Measures the process variable)
  • Controller (Decision making)
  • Actuator (Takes action to control)
  • Sensor measures a specified quality and provides data to the controller
  • Controllers perform tasks and are responsible for decisions, commands, and regulating the system's operations
  • Actuator converts energy into a mechanical operation
  • Sensors detect and respond to input from the physical environment.
  • Types of sensors include color, gas, light (LDR), proximity, temperature (LM35), alcohol Smoke, thermistor, ultrasonic, rain, PIR, water flow, heartbeat, IR, touch, photo transistor, gyroscope, and soil moisture.
  • Examples of mechanical operations: rotation, linear movement, or bending.

Audio Amplifier System Diagram

  • Microphone converts sound to voltage.
  • Pre-Amplifier amplifies the small microphone audio signal.
  • Tone and Volume Controls adjusts the audio signal's tone and strength.
  • Tone Control adjusts the level of high and low frequencies.
  • Volume Control adjusts the strength of the signal.
  • Power Amplifier enhances the audio's strength.
  • Loudspeaker converts the audio signal to sound.

Applications of Electronics

  • Consumer electronics includes gadgets, home appliances, audio and video systems, consumer devices, and storage devices.
  • Consumer electronics are devices and equipment meant use every day by everyday people everyday.
  • Office gadgets: calculators, computers, scanners, printers, fax machines, and front projectors.
  • Home appliances: washing machines, refrigerators, air conditioners, microwave ovens, and vacuum cleaners.
  • Advanced consumer devices: setup boxes, ATMs, dishwashers, smartphones, PDAs, barcode scanner, and POS terminals.
  • Storage devices: DVD players, HDD jukeboxes, and portable MP3 players.

Industrial Electronics

  • Industrial electronics include smart grids, automation, and image processing in real-time.
  • Machine learning is used with motor drive control, Mechatronics, robotics and Photo-voltaic systems for Renewable energy as well as Biomechanics.
  • Smart Grid systems electric systems collect data and react based on power use within communication technologies.
  • Features of smart grids include: digital system based on two-way communication, interactive sensors, self-monitoring and debugging, and electricity distribution

Industrial Automation and Motion Control

  • Machines are replacing humans these days to increase productivity, save time, and save money.
  • Delegation of the work is safer for humans, making automation is preferable for industries.
  • 3D imaging has evolved from single or multiple 2D picture sources.
  • Algorithms extract 3D information from 2D patterns.
  • Image processing is involved in computer graphics, AI, robotics for navigation, inspection, assembly, computer vision, face/gesture recognition, virtual reality, and medical analysis.

Medical Applications

  • Medical applications use advanced instruments for data recording and physiological analysis.
  • Some medical devices include:
    • Stethoscope for listening to inner sounds.
    • Respiration Monitors for monitoring changes in temperature, pulse, respiration and blood flow.
    • Defibrillator to cause electrical shock to heart muscles and help resume normal working.
    • Glucose meter for monitoring sugar levels in the blood.
    • Pace Maker for reducing and increasing the heart beat.

Meteorological and Oceanographic Uses

  • Environmental monitoring is done through sensors and automatic weather stations.
    • Anemometer measures wind speed and direction. -Barometer is for predicting the weather and measures level of atmospheric pressure. -Tipping Bucket Rain gauge measures periodically stored rainfall in automatic weather stations.
    • Data logger for storing wind speed/direction, solar radiation, rain scale, humidity, and temperature. -Hygrometer measures humidity -Drifter Buoy measures current, temperature, and pressure levels.

Defence and Aerospace Applications

  • Defense applications include missile launching systems, rocket launchers for space, aircraft systems, and cockpit controllers.
  • Military applications: military radars, and boom barriers.

Automotive Systems

Automotive applications include:

  • Anti-collision unit
  • Infotainment console
  • Anti-lock braking system
  • Cruise control
  • Traction control
  • Window regulators
  • Electronic Control Unit (ECU)
  • Airbag control

Electronics vs. Electrical

  • Electronics focuses on the flow/emission of charge carriers in devices to amplify/switch electrical energy.
  • The study of electrical energy at high voltages.
  • Electrical energy distributes and stores electrical power.
  • Electronics utilizes active components such as oscillators and transistors.
  • Electrical systems use passive components: capacitors and inductors.
  • Electronics controls the flow of current/voltage.
  • Electrical generates current and voltage.
  • Electronics is low power applications while electrical is high power.
  • Electronic devices are small and easy to transport and insert.
  • Electrical devices are large and take up space.
  • Examples in electronics: transistors and diodes.
  • Examples in electrical: transformers and motors.

Devices and Components

  • The electronic industry's growth can meet increasing demand for electronic equipment.
  • Electronic devices are broken into active components.
  • Active components supply energy or produce power.
  • Active components include oscillators, integrated circuits, and transistors.
  • Components depend on external power for functioning.
  • Passive components store, absorb, or dissipate electric or magnetic field energy.
  • Passive components include resistors, capacitors, and inductors.
  • Active components deliver energy and require an external power source to function.
  • Passive components store energy and do not rely on an external power source.
  • Active components produce current and voltage and control current flow.
  • Passive components store energy and cannot control current flow
  • Examples of active elements: diodes and integrated circuits.
  • Examples of passive elements: resistors, capacitors, and inductors.

Passive Devices

  • Passive devices include generally: resistors, capacitors, inductors, diodes, crystals, and relays
  • A resistor is a passive electrical component that introduces resistance to the current flow to limit the current.
  • Magnitude of the opposition to current flow is the resistance of the resistor.
  • The unit of resistance is measured in ohms (Ω).
  • The higher the resistance (R), the lower the current (I).
  • Resistors dissipate electrical energy as P = I2R.
  • Resistors come in different sizes and forms.
  • Through-hole resistors with pliable leads.
  • Surface-mount resistors (SMD/SMT).
  • Common resistors used in current limiters, setting biases, voltage dividers, pull-up, filtering, and termination.
  • Precision resistor for voltage feedback circuits and voltage references.
  • Current Sense resistors
  • Power resistors
  • Resistor manufacturers include: AVX, Rohm, Kemet, Vishay, Samsung, and Panasonic TDK.

Resistor Selection Parameters

  • Parameters to note when choosing include resistance, power, tolerance, and PCB space.
  • Resistors are used in analog circuits where precise voltage is needed, and also in circuit interfaces.
  • A through-hole resistor is a fixed has pliable leads to be used on a breadboard and wave solidered into a PCB.
  • Surface mount resistors a tiny rectangular ceramic with silver conductive edges.

Color Coding for Resistors

  • Black is 0, Brown is 1, Red is 2, Orange is 3, Yellow is 4, Green is 5, Blue is 6, Violet is 7, Gray is 8, and White is 9. Gold = 5%, Silver = 10%.

Capacitor

  • A capacitor is a passive electrical component that stores electrical energy and deliver it to the electrical circuit if it is required.
  • The capacity of a capacitor is known as its capacitance and it is store electrical charge.
  • Capacitance is denoted by C, and uses Farad (F) as the measuring unit and range from microFarad to picoFarad.
  • The capacitor equation: C = Q/V, with charge denoted by Q, voltage denoted by V, and capcitance is C.
  • Where current i = dq/dt, then the rate of change of charge I = C.dv/dt

More facts about capacitors

  • If the voltage is constant across a capacitor, there will be no electrical current flowing.
  • Capacitors only allow electrical current when the voltage changes with time.
  • The formula of the stored energy in a capacitor: E= 1/2CV2.
  • Capacitance of parallel plate capacitor: C = A/d.
  • There are two categories for capacitors: polarized or non polarized.
  • Polarized capacitors can only receive a voltage in one direction when placed on a board or in circuits.
  • Electrolytic and tantalum capacitors are polarized.
  • Ceramic, polyester and paper capacitors are non polarized.
  • Manufacturers includes:Murata, AVX, Kemet, Vishay, Samsung, Panasonic TDK
  • Parameters include capacitance value, maximum operating voltage, tolerance, breakdown voltage, frequency range, equivalent series resistance and size.
  • Capacitors are use to block low voltage.
  • Capacitors allow the flow of alternating current, which is used in electronic coupling.

Uses of capacitors

  • There are used to block the flow of DC voltage and permits the flow of AC using coupling of the circuits.
  • Bypass unwanted signal frequencies by directing them to ground.
  • Using the for phase shifting, and time delays
  • Using for filtration, especially in removing ripples from the rectified waveform.
  • Used to get the tuned frequency.
  • Capacitors are used as a motor starter.

Inductor

  • An inductor is a passive two terminal electrical component that stores magnetic energy when an electric energy is passed.
  • An inductor has an insulated wire wound into a coil around a core of some material in a spiral form.
  • Inductance is denoted by L while the unit is Henry (H).
  • Inductance values range from 1µΗ - 2000mH.
  • When time varying current flows through an inductor, the magnetic field is created which induces electromotive force (e.m.f)
  • Voltage V = Ldi/dt over an L (inductor ).
  • E = ½ Li² is the stored energy in an inductor with value L Henries.
  • Manufacturers includes: Murata, TDK, Bourns Inc., Abracon Electronics, AVX corporation, Schaffner.
  • Classification of inductors depend on the core material and operating
    • Types includes - -Type of Core included:
      • Iron cored
      • Air cored
      • Iron powdered core
      • Ferrite cored Inductors
      • Variable Inductors
    • Frequency
      • Audio frequency
      • Radio frequency Inductors
  • Inductance selection parameters - Inductance value - Tolerance - Maximum current rating - Shielded and non-shielded - Size - Q ratings - Frequency range - The resistance of the inductor - Type of core used

Diodes

  • A diode is a two terminal semiconductor device that allows electric current to flow only in one direction, while also blocking it in the other direction.
  • Diodes are made of P-type and N-type semiconductor materials.
  • Semiconductor materials such as silicon and the germanium.
  • The device conducts when a minimum forward voltage is applied to it (0.7V)
  • Diodes are off during reverse bias condition.
  • Diodes can be used in Power conversion (AC to DC)
  • Diode applications includes Clamping the voltage, Zener diode, Overvoltage and ESD Protection.

Types of Applications

  • Rectifier
  • Switching
  • Zener
  • Schottky
  • Varicap
  • Photodiode
  • Diode selection parameters: includes Forward bias voltage, Maximum forward current,Operating junction temperature, Reverse recover time
  • Manufacturers : Rohm Semiconductor, Diodes Incorporated.
  • The laser diode is found within optical communication systems.

Crystal

  • A crystal is made out of silicon, in wafer sheet. Wafer is tightly fitted and controlled between two parallel metallized surfaces which make an electrical connection.
  • When an external voltage is given the phenomenon known as Piezoelectric effect occur, a crystal vibrates with fundamental frequency which creates alternating waveform swings between high and low level.
  • Crystals create stable clock to the processor because of property of quartz.
  • Used to provide oscillators to the processor device
  • Crystal are the source reference signals
  • Crystal Selection Parameter includes Load Capacitance, Fundamental Frequency, ESR etc

Electromagnetic Relays

  • Electromagnetic switch opens and closes contacts.
  • Electromagnetic Relay consists of armature, coil, string and contact.
  • Relays generate a magnetic field when the armature is attracted and cause a change in the open/close state of something.
  • Relays are used to control high power circuit using low power signal. High current applications used
  • Types includes - -Electromechanical(EMR)
  • Solid-state Relays

Other relay facts

  • Solid state relays come with photodiode & transistor to cause switching
  • Low voltage with fast switching is one of the benefits for the application usage Different type of relay - SPDT, DPCT, SPST, DPDT -SPDT - allowing single input
  • DPDT is two circuits with two position.

Active Devices

  • Active devices depend on external power to operate and can amplify signals/process signals.

  • Two active devices include Transistors, IC The transistor is a non-linear 3 terminal semiconductor device

    • It is one of the most important devices in the field of electronics.
  • There are two main functions of transistors

    • Amplify input signals - acts as solid switch- state Transistor categories include - -Bipolar Junction transistor
    • Field Effect Transistor - MOSFET
  • ICs are often used as a switch when operated in full saturation, where it will act as amplification.

  • The MOSFET is a semiconductor device that is different than bipolar junction transistor.

  • 4 terminals of a MOSFET include drain, gate, source and the body with very high resistance.

  • The gate offers more heat loss and the on stage resistance offer better amplification.

  • It is used for high efficiency operations

  • To control that gate channel are is by controlling that voltage to its source

  • Both channels are N or P

  • Applications includes Analog, Switching, Over/Under voltage protection.

MOSFET

  • The MOSFET (metal oxide semiconductor field-effect transistor) transistor is a semiconductor device that is different than bipolar junction transistor in terms of construction though the applications remain the same as switching and amplifying.
  • It has four terminals source, drain, gate, and body.
  • The body is shorted w/source with very high resistance.
  • By controlling the gate voltage is how source and drain is controlled

Advantages of MOSFET over BJT:

  • MOS costs low
  • On state has very Low resistance -High frequency with high input resistance
  • Application Includes Protection switching , demodulation & modulation signals

Types of Transistor Packing

Through Hole versions BJT and MOSFET transistors are available in SMD and DIP. 2223 and 2PAK are examples.

Parameters while packing a transistor

  • Need to consider collector voltage, base voltage, saturation voltage, current and the amount used by each -Device manufacturers: Devices:Analog, Infineon

Electronic Components

  • Basic Electronic components are MPN - respectively identified with manufacturing part numbers
  • The part number will include part character and it characteristics
  • The image also DigiKey par Number as well

Components & Distributions

  • Key sources for support

  • Single Window source where to buy from

  • Component distributions stock components provide web selection and efficient selection options

  • Integrated Circuit Integrated Circuit is is basically built w. semiconductor

  • Miniaturized transistors

  • Powered by external power supply with functions -Size has small low power consumption power

Types of Integrated Circuits

  • ICs are categorised such as digital, analog, mixed,based on circuit.
  • Digital ICs can further divide in 2 categories: timer & counter
  • Complex ICs process and perform digital dada Micros are used for temperatures -It ability perform range of application

Types of Microprocessors and Microcontrollers

  • Microcontrollers has complex built in memory and buffer but lack of outside memory
  • Microcontroller has communication and interface, they target specific applications
  • Applications Embedded Device such as washing machine, weighing devices.
  • Computing applications in image, speech, video, use digital processor

Analog ICs

Include , amplifiers differential, ADCs, DAC IC Packages come available in dip and such as SMD Includes Operational, Amplifiers Differential

  • Interfaces CAN buses
  • Level Converses and Regulators

ICS Package & type

Ics come available in dip and such as SMD- (SMT) These can come wide and popular such as dip and SM

Small Outlined Package is SOIC

ICS - Typical Selections

The VCC should be be considered For all types

  • Analog or digital
  • The type communication speed

Integrated Circuit Fabrication Process

  • The fabrication industry has a large selection of devices to chose from such as
    • Computer processors
    • Micro controllers
    • Tranistors made from Silicon, Copper or Aluminium
  • Fabrication means to manufacture an electronic device
  • For metals this includes and will convert the small components into larger ones
  • Other steps include diffusion
  • Oxidation

Wafer Functions Preparation

  • Is used for thin electric circuits

  • Act as bass for device

  • Extraction metal for processing

  • Adding Impurities

  • Involves cutting and polishing the wafer - Modifying

  • Oxidation is add oxygen

  • It high heat process

  • It can cause classifited issues with electrical properties

Diffusion Function

  • Add impurities

  • Temp process

  • Dependent and timings

  • Implatation - Ion -Accelerating , solid target, changes properties

  • The temp has to allows it, however this creates instability

  • Implanation happens has process

  • Atom become inbedded, field voltage must be controlled

Chemical Vapor DepositionCVD

  • CVD process high quality solid material ,thin
  • The process allows vaporous to form into solid to substrate. CVD can preformed very low with pressures

Process Includes (In summary)

  1. Wafer Preperation
  2. Oxidation
  3. Diffusion 4.Ion Implantation
  4. Chemical-Vapor Deposition
  5. Photolithography
  6. Metallization 8.Packeging

PhotoLithography -

PhotoLithography utilizes light to reproduce thin films. It is a patterning use mask patters (x rays are emitted X rays) Photo resist is first coated Then the mask is used to the help patterns Depending to light the feature sizes in photo Exposed with areas become remove when with patterns on process

Metallization defined the process of coating metal of a metal service Used with aluminium (dust air water) Transistor can be replaced.

Stages of Electronic Package - (Important Note)

Test components electrically check

  • Cost is expensive but necessary. It makes a product suitable and will seal will either epoxy or plastic. And will not allow material trap air. .

Wafer stages

  • Silicon Ingot Growth,Wafer Slicing, Clean ,Inspect with Polishing .

PCB

  • All provides mechanical support for electronic to mounted, circuits connect the components and devices

  • Components of the the Pcb -Pads Traces

  • Alternating , electrically support layer

Types of PCB Design - Side

Top, and bottom sides of the board Drill files to place and mount

PCB Boards

  • Top, bottom and sides

Types of PCBs Materials:

  • Single side mounted
  • Double Side circuit - has mounted. components. -Surface signal
  • Multilayer Boards are on layers, single or double side
  • Rigidflex are flexible with components rigid
  • Flex are made flexible polyimide
  • Metal Core has higher heat
  • Cermaics help use high conductivity

HDI PCBs

  • These use high pinout special material component to high density capacity connection

UHDI And and Subtract- The Boards- the additive material is use with high high connections so that you can build IC packaging

Circuit Board - Process

  • From Front engineering select best fit function
  • The design will be review
  • Schematic design to follow
  • From there select with material
  • Components placement

PCB Design Process from Process

  • Select all
  • ECAD Design Routing Tools can implement Geometry so it can used for impedance signal and High signals
  • Review design with the tools software for design and implementation

Units of Measure

  • Meters
  • Meters Unit Measuring
  • Voltage, the electrical instruments between two points

Unit Series

  • When the voltage is in parallel it will
  • Voltmeters measure the potential difference in ohms.

Ammeters

The Ammeter is a device in the circuit In order measure device connects has to be device If the ammeter locate between the points

Galvanometers

  • Analog meter digital meters
  • Is devices such is galvanometers , produces movement proportional.

Crucial to galvanometer meter resistance and sensitivy

In order for meters, need voltage need the resistance is the what you find The voltage produce a full- scaling

Multimeters measure multiple instrument types Ammeter, resistance -With indicator device

  • Measure both Batteries
  • Essential Power supply
  • Similar to digital

Ammeter is a handheld device positive to use with test Multimeter Operation - function includes three ports

Function of Multimeters

  • It is used to determine resistance Capacity The ac or DC output. Conductance it to test is in ohms

Function of Ohm Meters

Analog- VOM measures with scales pointer movement We mostly DMM are DC with black with black with user requirement

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