Podcast
Questions and Answers
Which of the following is NOT an advantage of MOSFETs over BJTs?
Which of the following is NOT an advantage of MOSFETs over BJTs?
- Very high input resistance
- High frequency of operations
- High power loss (correct)
- Low on-state resistance
Transistors can only be used for amplification of analog signals.
Transistors can only be used for amplification of analog signals.
False (B)
Name two applications of transistors beyond signal amplification.
Name two applications of transistors beyond signal amplification.
Switching devices, Oscillators
Transistors are available in two primary package types: through-hole (DIP) and ______.
Transistors are available in two primary package types: through-hole (DIP) and ______.
Match the following package types with their corresponding mounting technology:
Match the following package types with their corresponding mounting technology:
When selecting a transistor, which parameter is LEAST likely to be a primary consideration for circuit design?
When selecting a transistor, which parameter is LEAST likely to be a primary consideration for circuit design?
Distributor/Vendor Part Numbers (VPN) and Manufacturing Part Numbers (MPN) uniquely identify electronic components.
Distributor/Vendor Part Numbers (VPN) and Manufacturing Part Numbers (MPN) uniquely identify electronic components.
What type of document explains the performance, features, and specifications of a basic electronic component?
What type of document explains the performance, features, and specifications of a basic electronic component?
During PCB stack-up design, what considerations are crucial for accommodating high-speed signals?
During PCB stack-up design, what considerations are crucial for accommodating high-speed signals?
Ammeters are connected in parallel to a device to measure its current.
Ammeters are connected in parallel to a device to measure its current.
What is the primary purpose of a voltmeter?
What is the primary purpose of a voltmeter?
Which of the following applications is most suited for a microcontroller?
Which of the following applications is most suited for a microcontroller?
To measure the voltage of a component, a voltmeter must be connected in ______ with that component.
To measure the voltage of a component, a voltmeter must be connected in ______ with that component.
A microprocessor includes inbuilt memory, communication interfaces, and general-purpose I/Os.
A microprocessor includes inbuilt memory, communication interfaces, and general-purpose I/Os.
Match the stage in PCB design with its primary objective:
Match the stage in PCB design with its primary objective:
Which of the following is a critical aspect of the 'Routing' stage in ECAD software for PCB design?
Which of the following is a critical aspect of the 'Routing' stage in ECAD software for PCB design?
Name three communication interfaces commonly found in microcontrollers.
Name three communication interfaces commonly found in microcontrollers.
Digital Signal Processors (DSPs) are specifically designed for high-computing applications like image processing, speech processing, and ______.
Digital Signal Processors (DSPs) are specifically designed for high-computing applications like image processing, speech processing, and ______.
Terminal voltage can be measured directly across the EMF without considering the internal resistance.
Terminal voltage can be measured directly across the EMF without considering the internal resistance.
Which type of integrated circuit is best suited for implementing custom digital logic functions that can be reconfigured after manufacturing?
Which type of integrated circuit is best suited for implementing custom digital logic functions that can be reconfigured after manufacturing?
What is the main difference between an analog and a digital voltmeter?
What is the main difference between an analog and a digital voltmeter?
Match the integrated circuit type with its primary function:
Match the integrated circuit type with its primary function:
Which IC package type is commonly used for high pin-count devices requiring a small footprint?
Which IC package type is commonly used for high pin-count devices requiring a small footprint?
SOIC packages are through-hole components, meaning they are inserted into holes drilled in a printed circuit board.
SOIC packages are through-hole components, meaning they are inserted into holes drilled in a printed circuit board.
Which of the following is the MOST significant reason for the increasing preference of automation in industries?
Which of the following is the MOST significant reason for the increasing preference of automation in industries?
Smart grid systems only provide one-way communication from the power source to the consumer.
Smart grid systems only provide one-way communication from the power source to the consumer.
Name three features of smart grid systems.
Name three features of smart grid systems.
The process of extracting 3D information from 2D images is a key aspect of ______.
The process of extracting 3D information from 2D images is a key aspect of ______.
Match the following applications with their corresponding fields:
Match the following applications with their corresponding fields:
Which of the following is NOT a typical application of image processing?
Which of the following is NOT a typical application of image processing?
Medical applications only involve basic instruments for simple data recording.
Medical applications only involve basic instruments for simple data recording.
Give three examples of advanced consumer devices.
Give three examples of advanced consumer devices.
What is the primary purpose of a part number?
What is the primary purpose of a part number?
Electronic component distributors primarily stock components from a single manufacturer to ensure quality control.
Electronic component distributors primarily stock components from a single manufacturer to ensure quality control.
Name three passive components that are found on an IC.
Name three passive components that are found on an IC.
Integrated circuits are typically built on a semiconductor wafer, commonly made of ______.
Integrated circuits are typically built on a semiconductor wafer, commonly made of ______.
Which characteristic is commonly associated with integrated circuits (ICs) due to their small size?
Which characteristic is commonly associated with integrated circuits (ICs) due to their small size?
Match the following IC types with their primary functionality:
Match the following IC types with their primary functionality:
Which of the following is an example of a complex digital IC?
Which of the following is an example of a complex digital IC?
A microprocessor's functionality is fixed and cannot be altered after manufacturing.
A microprocessor's functionality is fixed and cannot be altered after manufacturing.
Which statement accurately compares wet and dry oxidation?
Which statement accurately compares wet and dry oxidation?
The diffusion process is temperature-independent, allowing consistent impurity introduction regardless of thermal conditions.
The diffusion process is temperature-independent, allowing consistent impurity introduction regardless of thermal conditions.
What is the typical temperature range (in degrees Celsius) for diffusion processes in semiconductor manufacturing?
What is the typical temperature range (in degrees Celsius) for diffusion processes in semiconductor manufacturing?
In ion implantation, the depth of ion penetration is primarily determined by the applied energy and the accelerating field ______.
In ion implantation, the depth of ion penetration is primarily determined by the applied energy and the accelerating field ______.
What is the primary advantage of performing ion implantation at low temperatures?
What is the primary advantage of performing ion implantation at low temperatures?
Which of the following is a characteristic of Chemical Vapor Deposition (CVD)?
Which of the following is a characteristic of Chemical Vapor Deposition (CVD)?
In semiconductor processing, doping exclusively improves the insulating properties of a material.
In semiconductor processing, doping exclusively improves the insulating properties of a material.
Match the following doping elements with their corresponding conductivity type in silicon:
Match the following doping elements with their corresponding conductivity type in silicon:
Flashcards
Home Appliances
Home Appliances
Appliances such as washing machines, refrigerators, and microwave ovens used in homes.
Advanced Consumer Devices
Advanced Consumer Devices
Advanced devices like set-top boxes, ATMs, and smartphones.
Storage and Infotainment Devices
Storage and Infotainment Devices
Devices for storing and playing optical media like DVDs and portable MP3 players.
Industrial Automation
Industrial Automation
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Smart Grid Systems
Smart Grid Systems
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Automation Benefits
Automation Benefits
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Image Processing
Image Processing
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Medical Applications
Medical Applications
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MOSFET advantages
MOSFET advantages
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Transistor Applications
Transistor Applications
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Transistor packages
Transistor packages
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Transistor Parameters (1/2)
Transistor Parameters (1/2)
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Transistor Parameters (2/2)
Transistor Parameters (2/2)
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Component Part Numbers
Component Part Numbers
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Component Datasheet
Component Datasheet
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DIP package examples
DIP package examples
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Wet Oxidation
Wet Oxidation
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Dry Oxidation
Dry Oxidation
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Diffusion
Diffusion
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Dopants
Dopants
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Part Number
Part Number
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Component Distributors
Component Distributors
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High-Temperature Furnaces
High-Temperature Furnaces
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Ion Implantation
Ion Implantation
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Integrated Circuit (IC)
Integrated Circuit (IC)
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Digital ICs
Digital ICs
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Impurity Introduction (Ion Implantation)
Impurity Introduction (Ion Implantation)
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Chemical Vapor Deposition (CVD)
Chemical Vapor Deposition (CVD)
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Simple Digital ICs
Simple Digital ICs
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Complex Digital ICs
Complex Digital ICs
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Microprocessor/Microcontroller
Microprocessor/Microcontroller
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Microprocessor Control Function
Microprocessor Control Function
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Microprocessor
Microprocessor
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Microcontroller
Microcontroller
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DSP Controllers
DSP Controllers
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Analog ICs
Analog ICs
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Interfacing ICs
Interfacing ICs
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Power ICs
Power ICs
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Small Outline Integrated Circuit (SOIC)
Small Outline Integrated Circuit (SOIC)
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Thin-Shrink Small Outline Package (TSSOP)
Thin-Shrink Small Outline Package (TSSOP)
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Material Selection & PCB Stack-up
Material Selection & PCB Stack-up
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Component Placement
Component Placement
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PCB Routing
PCB Routing
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Design Review and Verification
Design Review and Verification
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Preparing for Manufacturing
Preparing for Manufacturing
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Voltmeter
Voltmeter
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Voltmeter Connection
Voltmeter Connection
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Ammeter
Ammeter
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Study Notes
Cambridge Institute of Technology
- Located in K.R. Puram, Bangalore - 560 036
- The vision is to become a premier institute transforming students into global professionals.
Mission
- Attract and retain competent faculty and support staff.
- Create state-of-the-art infrastructure to impart quality education and support research.
- Adopt a tertiary approach in the teaching-learning pedagogy that transforms students for competence.
- Students become competent technocrats and managers.
- Nurture and train students to develop the qualities of global professionals.
Dr. Ravi Kumar.M
- Associate Professor, Department of Electronics & Communication Engineering
Department of Basic Sciences Vision
- Provide quality education in Science, Technology, Engineering, and Mathematics (STEM).
- Nurture students in developing professional competencies and human values.
Department of Basic Sciences Mission
- Adopt student-centric pedagogy to teach the fundamentals of STEM necessary for engineering studies.
- Nurture and train students to develop analytical, logical reasoning, and problem-solving skills.
- Inculcate ethical and social values for holistic development.
Module 1: Introduction
- Module is an introduction to electronics and communication.
Introduction to Electronics
- Electronics relates to electrons, stemming from electron mechanics.
- Electronics is an engineering branch concerning current flow through semiconductors.
- Electronics handles electric circuits with active and passive elements and underlying techniques.
Need for Electronics
- Machine robots can perform human work with ease and high efficiency.
- Wireless sensors in capsules and tablets collect information from the body for diagnostics.
- Transparent smartphones may emerge, potentially replacing PC screens and TV monitors with windows or mirrors.
- Sensors detect water shortage in plants to alert farmers.
- Electronic devices comprise active and passive elements and smaller IC memories.
- ICs, diodes, and transistors are made of semiconductor materials and rely on current flow.
History of electronics
- The history of electronics began with the invention of the vacuum diode.
- John Ambrose Fleming invented the vacuum diode.
- The vacuum diode came to be in 1897.
- A vacuum tube consists of anode and cathode electrode plates.
- Current is allowed to flow only in one direction.
- Current flow cannot be controlled using the diode.
- Lee De Forest modified the device in 1906 and named it Vacuum Triode.
- The Triode has three terminals: anode, cathode, and a grid that controls current flow.
- The invention of the vacuum diode led to the electronics era.
- The real development in electronics began in 1948 with the invention of the transistor.
- John Bardeen, Walter Brattain, and William Shockley invented the transistor in Bell Laboratories.
- This feature could boost the power of electrical signals, which lead to the eventual development of the Tetrode and Pentode.
- Large, bulky vacuum diodes are replaced with junction transistors.
- Transistors were initially made of germanium, later using silicon BJT.
- Devices are now made of silicon due to its low cost
- Jack Kilby introduced the concept of the integrated circuit (IC) to reduce size and cost.
- Jack Kilby's idea changed the world entirely.
- Complete interconnected circuits are placed on single chips called VLSI (Very Large Scale Integrated).
- Modern computer processors contain billions of transistors integrated on a single IC.
Electronics Systems Block Diagram, Sensors, Controllers and Actuators.
- There are three main stages in the system block diagram
- Sensor (Measures the process variable)
- Controller (Decision making)
- Actuator (Takes action to control)
- Sensor measures a specified quality and provides data to the controller
- Controllers perform tasks and are responsible for decisions, commands, and regulating the system's operations
- Actuator converts energy into a mechanical operation
- Sensors detect and respond to input from the physical environment.
- Types of sensors include color, gas, light (LDR), proximity, temperature (LM35), alcohol Smoke, thermistor, ultrasonic, rain, PIR, water flow, heartbeat, IR, touch, photo transistor, gyroscope, and soil moisture.
- Examples of mechanical operations: rotation, linear movement, or bending.
Audio Amplifier System Diagram
- Microphone converts sound to voltage.
- Pre-Amplifier amplifies the small microphone audio signal.
- Tone and Volume Controls adjusts the audio signal's tone and strength.
- Tone Control adjusts the level of high and low frequencies.
- Volume Control adjusts the strength of the signal.
- Power Amplifier enhances the audio's strength.
- Loudspeaker converts the audio signal to sound.
Applications of Electronics
- Consumer electronics includes gadgets, home appliances, audio and video systems, consumer devices, and storage devices.
- Consumer electronics are devices and equipment meant use every day by everyday people everyday.
- Office gadgets: calculators, computers, scanners, printers, fax machines, and front projectors.
- Home appliances: washing machines, refrigerators, air conditioners, microwave ovens, and vacuum cleaners.
- Advanced consumer devices: setup boxes, ATMs, dishwashers, smartphones, PDAs, barcode scanner, and POS terminals.
- Storage devices: DVD players, HDD jukeboxes, and portable MP3 players.
Industrial Electronics
- Industrial electronics include smart grids, automation, and image processing in real-time.
- Machine learning is used with motor drive control, Mechatronics, robotics and Photo-voltaic systems for Renewable energy as well as Biomechanics.
- Smart Grid systems electric systems collect data and react based on power use within communication technologies.
- Features of smart grids include: digital system based on two-way communication, interactive sensors, self-monitoring and debugging, and electricity distribution
Industrial Automation and Motion Control
- Machines are replacing humans these days to increase productivity, save time, and save money.
- Delegation of the work is safer for humans, making automation is preferable for industries.
- 3D imaging has evolved from single or multiple 2D picture sources.
- Algorithms extract 3D information from 2D patterns.
- Image processing is involved in computer graphics, AI, robotics for navigation, inspection, assembly, computer vision, face/gesture recognition, virtual reality, and medical analysis.
Medical Applications
- Medical applications use advanced instruments for data recording and physiological analysis.
- Some medical devices include:
- Stethoscope for listening to inner sounds.
- Respiration Monitors for monitoring changes in temperature, pulse, respiration and blood flow.
- Defibrillator to cause electrical shock to heart muscles and help resume normal working.
- Glucose meter for monitoring sugar levels in the blood.
- Pace Maker for reducing and increasing the heart beat.
Meteorological and Oceanographic Uses
- Environmental monitoring is done through sensors and automatic weather stations.
- Anemometer measures wind speed and direction. -Barometer is for predicting the weather and measures level of atmospheric pressure. -Tipping Bucket Rain gauge measures periodically stored rainfall in automatic weather stations.
- Data logger for storing wind speed/direction, solar radiation, rain scale, humidity, and temperature. -Hygrometer measures humidity -Drifter Buoy measures current, temperature, and pressure levels.
Defence and Aerospace Applications
- Defense applications include missile launching systems, rocket launchers for space, aircraft systems, and cockpit controllers.
- Military applications: military radars, and boom barriers.
Automotive Systems
Automotive applications include:
- Anti-collision unit
- Infotainment console
- Anti-lock braking system
- Cruise control
- Traction control
- Window regulators
- Electronic Control Unit (ECU)
- Airbag control
Electronics vs. Electrical
- Electronics focuses on the flow/emission of charge carriers in devices to amplify/switch electrical energy.
- The study of electrical energy at high voltages.
- Electrical energy distributes and stores electrical power.
- Electronics utilizes active components such as oscillators and transistors.
- Electrical systems use passive components: capacitors and inductors.
- Electronics controls the flow of current/voltage.
- Electrical generates current and voltage.
- Electronics is low power applications while electrical is high power.
- Electronic devices are small and easy to transport and insert.
- Electrical devices are large and take up space.
- Examples in electronics: transistors and diodes.
- Examples in electrical: transformers and motors.
Devices and Components
- The electronic industry's growth can meet increasing demand for electronic equipment.
- Electronic devices are broken into active components.
- Active components supply energy or produce power.
- Active components include oscillators, integrated circuits, and transistors.
- Components depend on external power for functioning.
- Passive components store, absorb, or dissipate electric or magnetic field energy.
- Passive components include resistors, capacitors, and inductors.
- Active components deliver energy and require an external power source to function.
- Passive components store energy and do not rely on an external power source.
- Active components produce current and voltage and control current flow.
- Passive components store energy and cannot control current flow
- Examples of active elements: diodes and integrated circuits.
- Examples of passive elements: resistors, capacitors, and inductors.
Passive Devices
- Passive devices include generally: resistors, capacitors, inductors, diodes, crystals, and relays
- A resistor is a passive electrical component that introduces resistance to the current flow to limit the current.
- Magnitude of the opposition to current flow is the resistance of the resistor.
- The unit of resistance is measured in ohms (Ω).
- The higher the resistance (R), the lower the current (I).
- Resistors dissipate electrical energy as P = I2R.
- Resistors come in different sizes and forms.
- Through-hole resistors with pliable leads.
- Surface-mount resistors (SMD/SMT).
- Common resistors used in current limiters, setting biases, voltage dividers, pull-up, filtering, and termination.
- Precision resistor for voltage feedback circuits and voltage references.
- Current Sense resistors
- Power resistors
- Resistor manufacturers include: AVX, Rohm, Kemet, Vishay, Samsung, and Panasonic TDK.
Resistor Selection Parameters
- Parameters to note when choosing include resistance, power, tolerance, and PCB space.
- Resistors are used in analog circuits where precise voltage is needed, and also in circuit interfaces.
- A through-hole resistor is a fixed has pliable leads to be used on a breadboard and wave solidered into a PCB.
- Surface mount resistors a tiny rectangular ceramic with silver conductive edges.
Color Coding for Resistors
- Black is 0, Brown is 1, Red is 2, Orange is 3, Yellow is 4, Green is 5, Blue is 6, Violet is 7, Gray is 8, and White is 9. Gold = 5%, Silver = 10%.
Capacitor
- A capacitor is a passive electrical component that stores electrical energy and deliver it to the electrical circuit if it is required.
- The capacity of a capacitor is known as its capacitance and it is store electrical charge.
- Capacitance is denoted by C, and uses Farad (F) as the measuring unit and range from microFarad to picoFarad.
- The capacitor equation: C = Q/V, with charge denoted by Q, voltage denoted by V, and capcitance is C.
- Where current i = dq/dt, then the rate of change of charge I = C.dv/dt
More facts about capacitors
- If the voltage is constant across a capacitor, there will be no electrical current flowing.
- Capacitors only allow electrical current when the voltage changes with time.
- The formula of the stored energy in a capacitor: E= 1/2CV2.
- Capacitance of parallel plate capacitor: C = A/d.
- There are two categories for capacitors: polarized or non polarized.
- Polarized capacitors can only receive a voltage in one direction when placed on a board or in circuits.
- Electrolytic and tantalum capacitors are polarized.
- Ceramic, polyester and paper capacitors are non polarized.
- Manufacturers includes:Murata, AVX, Kemet, Vishay, Samsung, Panasonic TDK
- Parameters include capacitance value, maximum operating voltage, tolerance, breakdown voltage, frequency range, equivalent series resistance and size.
- Capacitors are use to block low voltage.
- Capacitors allow the flow of alternating current, which is used in electronic coupling.
Uses of capacitors
- There are used to block the flow of DC voltage and permits the flow of AC using coupling of the circuits.
- Bypass unwanted signal frequencies by directing them to ground.
- Using the for phase shifting, and time delays
- Using for filtration, especially in removing ripples from the rectified waveform.
- Used to get the tuned frequency.
- Capacitors are used as a motor starter.
Inductor
- An inductor is a passive two terminal electrical component that stores magnetic energy when an electric energy is passed.
- An inductor has an insulated wire wound into a coil around a core of some material in a spiral form.
- Inductance is denoted by L while the unit is Henry (H).
- Inductance values range from 1µΗ - 2000mH.
- When time varying current flows through an inductor, the magnetic field is created which induces electromotive force (e.m.f)
- Voltage V = Ldi/dt over an L (inductor ).
- E = ½ Li² is the stored energy in an inductor with value L Henries.
- Manufacturers includes: Murata, TDK, Bourns Inc., Abracon Electronics, AVX corporation, Schaffner.
- Classification of inductors depend on the core material and operating
- Types includes -
-Type of Core included:
- Iron cored
- Air cored
- Iron powdered core
- Ferrite cored Inductors
- Variable Inductors
- Frequency
- Audio frequency
- Radio frequency Inductors
- Types includes -
-Type of Core included:
- Inductance selection parameters - Inductance value - Tolerance - Maximum current rating - Shielded and non-shielded - Size - Q ratings - Frequency range - The resistance of the inductor - Type of core used
Diodes
- A diode is a two terminal semiconductor device that allows electric current to flow only in one direction, while also blocking it in the other direction.
- Diodes are made of P-type and N-type semiconductor materials.
- Semiconductor materials such as silicon and the germanium.
- The device conducts when a minimum forward voltage is applied to it (0.7V)
- Diodes are off during reverse bias condition.
- Diodes can be used in Power conversion (AC to DC)
- Diode applications includes Clamping the voltage, Zener diode, Overvoltage and ESD Protection.
Types of Applications
- Rectifier
- Switching
- Zener
- Schottky
- Varicap
- Photodiode
- Diode selection parameters: includes Forward bias voltage, Maximum forward current,Operating junction temperature, Reverse recover time
- Manufacturers : Rohm Semiconductor, Diodes Incorporated.
- The laser diode is found within optical communication systems.
Crystal
- A crystal is made out of silicon, in wafer sheet. Wafer is tightly fitted and controlled between two parallel metallized surfaces which make an electrical connection.
- When an external voltage is given the phenomenon known as Piezoelectric effect occur, a crystal vibrates with fundamental frequency which creates alternating waveform swings between high and low level.
- Crystals create stable clock to the processor because of property of quartz.
- Used to provide oscillators to the processor device
- Crystal are the source reference signals
- Crystal Selection Parameter includes Load Capacitance, Fundamental Frequency, ESR etc
Electromagnetic Relays
- Electromagnetic switch opens and closes contacts.
- Electromagnetic Relay consists of armature, coil, string and contact.
- Relays generate a magnetic field when the armature is attracted and cause a change in the open/close state of something.
- Relays are used to control high power circuit using low power signal. High current applications used
- Types includes - -Electromechanical(EMR)
- Solid-state Relays
Other relay facts
- Solid state relays come with photodiode & transistor to cause switching
- Low voltage with fast switching is one of the benefits for the application usage Different type of relay - SPDT, DPCT, SPST, DPDT -SPDT - allowing single input
- DPDT is two circuits with two position.
Active Devices
-
Active devices depend on external power to operate and can amplify signals/process signals.
-
Two active devices include Transistors, IC The transistor is a non-linear 3 terminal semiconductor device
- It is one of the most important devices in the field of electronics.
-
There are two main functions of transistors
- Amplify input signals - acts as solid switch- state Transistor categories include - -Bipolar Junction transistor
- Field Effect Transistor - MOSFET
-
ICs are often used as a switch when operated in full saturation, where it will act as amplification.
-
The MOSFET is a semiconductor device that is different than bipolar junction transistor.
-
4 terminals of a MOSFET include drain, gate, source and the body with very high resistance.
-
The gate offers more heat loss and the on stage resistance offer better amplification.
-
It is used for high efficiency operations
-
To control that gate channel are is by controlling that voltage to its source
-
Both channels are N or P
-
Applications includes Analog, Switching, Over/Under voltage protection.
MOSFET
- The MOSFET (metal oxide semiconductor field-effect transistor) transistor is a semiconductor device that is different than bipolar junction transistor in terms of construction though the applications remain the same as switching and amplifying.
- It has four terminals source, drain, gate, and body.
- The body is shorted w/source with very high resistance.
- By controlling the gate voltage is how source and drain is controlled
Advantages of MOSFET over BJT:
- MOS costs low
- On state has very Low resistance -High frequency with high input resistance
- Application Includes Protection switching , demodulation & modulation signals
Types of Transistor Packing
Through Hole versions BJT and MOSFET transistors are available in SMD and DIP. 2223 and 2PAK are examples.
Parameters while packing a transistor
- Need to consider collector voltage, base voltage, saturation voltage, current and the amount used by each -Device manufacturers: Devices:Analog, Infineon
Electronic Components
- Basic Electronic components are MPN - respectively identified with manufacturing part numbers
- The part number will include part character and it characteristics
- The image also DigiKey par Number as well
Components & Distributions
-
Key sources for support
-
Single Window source where to buy from
-
Component distributions stock components provide web selection and efficient selection options
-
Integrated Circuit Integrated Circuit is is basically built w. semiconductor
-
Miniaturized transistors
-
Powered by external power supply with functions -Size has small low power consumption power
Types of Integrated Circuits
- ICs are categorised such as digital, analog, mixed,based on circuit.
- Digital ICs can further divide in 2 categories: timer & counter
- Complex ICs process and perform digital dada Micros are used for temperatures -It ability perform range of application
Types of Microprocessors and Microcontrollers
- Microcontrollers has complex built in memory and buffer but lack of outside memory
- Microcontroller has communication and interface, they target specific applications
- Applications Embedded Device such as washing machine, weighing devices.
- Computing applications in image, speech, video, use digital processor
Analog ICs
Include , amplifiers differential, ADCs, DAC IC Packages come available in dip and such as SMD Includes Operational, Amplifiers Differential
- Interfaces CAN buses
- Level Converses and Regulators
ICS Package & type
Ics come available in dip and such as SMD- (SMT) These can come wide and popular such as dip and SM
Small Outlined Package is SOIC
ICS - Typical Selections
The VCC should be be considered For all types
- Analog or digital
- The type communication speed
Integrated Circuit Fabrication Process
- The fabrication industry has a large selection of devices to chose from such as
-
- Computer processors
-
- Micro controllers
-
- Tranistors made from Silicon, Copper or Aluminium
- Fabrication means to manufacture an electronic device
- For metals this includes and will convert the small components into larger ones
- Other steps include diffusion
- Oxidation
Wafer Functions Preparation
-
Is used for thin electric circuits
-
Act as bass for device
-
Extraction metal for processing
-
Adding Impurities
-
Involves cutting and polishing the wafer - Modifying
-
Oxidation is add oxygen
-
It high heat process
-
It can cause classifited issues with electrical properties
Diffusion Function
-
Add impurities
-
Temp process
-
Dependent and timings
-
Implatation - Ion -Accelerating , solid target, changes properties
-
The temp has to allows it, however this creates instability
-
Implanation happens has process
-
Atom become inbedded, field voltage must be controlled
Chemical Vapor DepositionCVD
- CVD process high quality solid material ,thin
- The process allows vaporous to form into solid to substrate. CVD can preformed very low with pressures
Process Includes (In summary)
- Wafer Preperation
- Oxidation
- Diffusion 4.Ion Implantation
- Chemical-Vapor Deposition
- Photolithography
- Metallization 8.Packeging
PhotoLithography -
PhotoLithography utilizes light to reproduce thin films. It is a patterning use mask patters (x rays are emitted X rays) Photo resist is first coated Then the mask is used to the help patterns Depending to light the feature sizes in photo Exposed with areas become remove when with patterns on process
Metallization defined the process of coating metal of a metal service Used with aluminium (dust air water) Transistor can be replaced.
Stages of Electronic Package - (Important Note)
Test components electrically check
- Cost is expensive but necessary. It makes a product suitable and will seal will either epoxy or plastic. And will not allow material trap air. .
Wafer stages
- Silicon Ingot Growth,Wafer Slicing, Clean ,Inspect with Polishing .
PCB
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All provides mechanical support for electronic to mounted, circuits connect the components and devices
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Components of the the Pcb -Pads Traces
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Alternating , electrically support layer
Types of PCB Design - Side
Top, and bottom sides of the board Drill files to place and mount
PCB Boards
- Top, bottom and sides
Types of PCBs Materials:
- Single side mounted
- Double Side circuit - has mounted. components. -Surface signal
- Multilayer Boards are on layers, single or double side
- Rigidflex are flexible with components rigid
- Flex are made flexible polyimide
- Metal Core has higher heat
- Cermaics help use high conductivity
HDI PCBs
- These use high pinout special material component to high density capacity connection
UHDI And and Subtract- The Boards- the additive material is use with high high connections so that you can build IC packaging
Circuit Board - Process
- From Front engineering select best fit function
- The design will be review
- Schematic design to follow
- From there select with material
- Components placement
PCB Design Process from Process
- Select all
- ECAD Design Routing Tools can implement Geometry so it can used for impedance signal and High signals
- Review design with the tools software for design and implementation
Units of Measure
- Meters
- Meters Unit Measuring
- Voltage, the electrical instruments between two points
Unit Series
- When the voltage is in parallel it will
- Voltmeters measure the potential difference in ohms.
Ammeters
The Ammeter is a device in the circuit In order measure device connects has to be device If the ammeter locate between the points
Galvanometers
- Analog meter digital meters
- Is devices such is galvanometers , produces movement proportional.
Crucial to galvanometer meter resistance and sensitivy
In order for meters, need voltage need the resistance is the what you find The voltage produce a full- scaling
Multimeters measure multiple instrument types Ammeter, resistance -With indicator device
- Measure both Batteries
- Essential Power supply
- Similar to digital
Ammeter is a handheld device positive to use with test Multimeter Operation - function includes three ports
Function of Multimeters
- It is used to determine resistance Capacity The ac or DC output. Conductance it to test is in ohms
Function of Ohm Meters
Analog- VOM measures with scales pointer movement We mostly DMM are DC with black with black with user requirement
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