Copper Electroplating in IC Fabrication
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Questions and Answers

What is a key advantage of copper over aluminum in integrated circuits?

  • It is more resistant to corrosion
  • It has a higher melting point
  • It allows for smaller circuit features and faster chip performance (correct)
  • It is less expensive to produce

    • What is a benefit of the SABRE Electrodeposition process compared to vacuum deposition methods?

  • It is an inexpensive process (correct)
  • It is faster
  • It is more expensive
  • It is more complex

    • What is a key feature of the SABRE Electrodeposition process?

  • It allows for full filling of integrated circuit features with copper deposits (correct)
  • It uses inorganic additives
  • It allows for partial filling of integrated circuit features
  • It is limited to simple circuit designs

    • What is a concern related to the use of copper in integrated circuits?

    <p>Copper contamination</p> Signup and view all the answers

    What market share does SABRE have in the electroplating market?

    <p>~75%</p> Signup and view all the answers

    How many SABRE systems have been installed worldwide?

    <p>Around 500</p> Signup and view all the answers

    What happens to the resistance across the wafer as plating continues?

    <p>It drops</p> Signup and view all the answers

    Why is it important to compensate for the initial terminal effect during plating?

    <p>To prevent feature fill and uniformity from being affected</p> Signup and view all the answers

    What is the purpose of the high resistance element, HRVA, in the plating process?

    <p>To achieve uniform plating for thin Cu seeds</p> Signup and view all the answers

    What is the outcome of using galvanostatic (current controlled) wafer immersion in the SABRE design?

    <p>A large spike in current density</p> Signup and view all the answers

    What is the benefit of using potentiostatic (voltage controlled) wafer immersion in the new design?

    <p>It reduces the current density spike</p> Signup and view all the answers

    What is the result of using potentiostatic entry in the new design?

    <p>No change in fill rates and film properties</p> Signup and view all the answers

    What is the primary function of the SAC Contactors 2 Filter Flow Meter Contactors?

    <p>To introduce O2 into the SAC to corrode copper particles</p> Signup and view all the answers

    What is the purpose of the 20nm filter in the SAC Effluent Filtration system?

    <p>To purify the SAC effluent of contamination before returning to the bath</p> Signup and view all the answers

    What is the benefit of the SAC HD TF20 upgrade in terms of SAC chamber pressure?

    <p>It eliminates the possibility of over pressurizing or under pressurizing the SAC chamber</p> Signup and view all the answers

    What is the purpose of the built-in sensors in the SAC Effluent Filtration system?

    <p>To provide feedback for system lifetime and performance</p> Signup and view all the answers

    What is the relationship between the SAC HD TF20 upgrade and the Full SAC HD upgrade?

    <p>The SAC HD TF20 upgrade can be either a stand-alone upgrade or part of the Full SAC HD upgrade</p> Signup and view all the answers

    What is the primary benefit of the Open SAC upgrade?

    <p>It eliminates the possibility of over pressurizing or under pressurizing the SAC chamber</p> Signup and view all the answers

    What is the main purpose of the Contact Shim and Vortex Robot with AWC?

    <p>To reduce contact resistance and variation</p> Signup and view all the answers

    What happens when the E-field is concentrated at the edges of the electrodes?

    <p>Thick edge film deposition occurs</p> Signup and view all the answers

    What is the role of additives in the copper fill process?

    <p>To slow down the deposition process at corners</p> Signup and view all the answers

    What is the purpose of SmartDose+ Chemistry Control Tool?

    <p>To control the additive concentration</p> Signup and view all the answers

    What happens without predictive dosing in the SmartDose+ system?

    <p>Large fluctuations in additive concentration occur</p> Signup and view all the answers

    What is the result of using additives in the copper fill process?

    <p>Superconformal fill results</p> Signup and view all the answers

    What is the primary purpose of the Edge Bevel Removal (EBR) process?

    <p>To remove copper from the wafer bevel and undercutting</p> Signup and view all the answers

    What is the edge exclusion distance in the Electrofill process with clamshell edge exclusion?

    <p>2 mm</p> Signup and view all the answers

    What is the concentration of H2O2 in the standard EBR process?

    <p>7%</p> Signup and view all the answers

    What is the benefit of the nozzle in the EBR process?

    <p>It has built-in bevel etch and on-board mixing and dilution</p> Signup and view all the answers

    What is the goal of the Extreme EBR process?

    <p>To reduce PEM wafer processing time to less than 100 seconds</p> Signup and view all the answers

    What is the result of the EBR process on the wafer bevel?

    <p>The wafer bevel is copper-free</p> Signup and view all the answers

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