30 Questions
What is a key advantage of copper over aluminum in integrated circuits?
It allows for smaller circuit features and faster chip performance
What is a benefit of the SABRE Electrodeposition process compared to vacuum deposition methods?
It is an inexpensive process
What is a key feature of the SABRE Electrodeposition process?
It allows for full filling of integrated circuit features with copper deposits
What is a concern related to the use of copper in integrated circuits?
Copper contamination
What market share does SABRE have in the electroplating market?
~75%
How many SABRE systems have been installed worldwide?
Around 500
What happens to the resistance across the wafer as plating continues?
It drops
Why is it important to compensate for the initial terminal effect during plating?
To prevent feature fill and uniformity from being affected
What is the purpose of the high resistance element, HRVA, in the plating process?
To achieve uniform plating for thin Cu seeds
What is the outcome of using galvanostatic (current controlled) wafer immersion in the SABRE design?
A large spike in current density
What is the benefit of using potentiostatic (voltage controlled) wafer immersion in the new design?
It reduces the current density spike
What is the result of using potentiostatic entry in the new design?
No change in fill rates and film properties
What is the primary function of the SAC Contactors 2 Filter Flow Meter Contactors?
To introduce O2 into the SAC to corrode copper particles
What is the purpose of the 20nm filter in the SAC Effluent Filtration system?
To purify the SAC effluent of contamination before returning to the bath
What is the benefit of the SAC HD TF20 upgrade in terms of SAC chamber pressure?
It eliminates the possibility of over pressurizing or under pressurizing the SAC chamber
What is the purpose of the built-in sensors in the SAC Effluent Filtration system?
To provide feedback for system lifetime and performance
What is the relationship between the SAC HD TF20 upgrade and the Full SAC HD upgrade?
The SAC HD TF20 upgrade can be either a stand-alone upgrade or part of the Full SAC HD upgrade
What is the primary benefit of the Open SAC upgrade?
It eliminates the possibility of over pressurizing or under pressurizing the SAC chamber
What is the main purpose of the Contact Shim and Vortex Robot with AWC?
To reduce contact resistance and variation
What happens when the E-field is concentrated at the edges of the electrodes?
Thick edge film deposition occurs
What is the role of additives in the copper fill process?
To slow down the deposition process at corners
What is the purpose of SmartDose+ Chemistry Control Tool?
To control the additive concentration
What happens without predictive dosing in the SmartDose+ system?
Large fluctuations in additive concentration occur
What is the result of using additives in the copper fill process?
Superconformal fill results
What is the primary purpose of the Edge Bevel Removal (EBR) process?
To remove copper from the wafer bevel and undercutting
What is the edge exclusion distance in the Electrofill process with clamshell edge exclusion?
2 mm
What is the concentration of H2O2 in the standard EBR process?
7%
What is the benefit of the nozzle in the EBR process?
It has built-in bevel etch and on-board mixing and dilution
What is the goal of the Extreme EBR process?
To reduce PEM wafer processing time to less than 100 seconds
What is the result of the EBR process on the wafer bevel?
The wafer bevel is copper-free
This quiz covers the benefits and requirements of copper electroplating in integrated circuit fabrication, including its advantage over aluminum and the SABRE electrodeposition process.
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