Podcast
Questions and Answers
Which etching method involves using neutrally-charged, high-energy ions for etching?
Which etching method involves using neutrally-charged, high-energy ions for etching?
What is a disadvantage of wet etching?
What is a disadvantage of wet etching?
What is an advantage of dry etching over wet etching?
What is an advantage of dry etching over wet etching?
Which factor affects the etch rate in dry etching processes?
Which factor affects the etch rate in dry etching processes?
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What is the state of matter that plasma consists of?
What is the state of matter that plasma consists of?
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What is plasma radiation damage associated with?
What is plasma radiation damage associated with?
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What is a key advantage of dry etching over wet etching?
What is a key advantage of dry etching over wet etching?
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Why is dry etching considered more precise than wet etching?
Why is dry etching considered more precise than wet etching?
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What is a notable disadvantage of wet etching compared to dry etching?
What is a notable disadvantage of wet etching compared to dry etching?
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Which type of etching is known for directional etching without using the crystal orientation of Si?
Which type of etching is known for directional etching without using the crystal orientation of Si?
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Why does dry etching have better process control compared to wet etching?
Why does dry etching have better process control compared to wet etching?
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What is a significant advantage of dry etching in terms of safety?
What is a significant advantage of dry etching in terms of safety?
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What is the purpose of spraying DI water onto the surface of the etched film after using etchants?
What is the purpose of spraying DI water onto the surface of the etched film after using etchants?
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Which of the following is NOT an advantage of spray etching over immersion technique?
Which of the following is NOT an advantage of spray etching over immersion technique?
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Why is it important to use etch-resistant materials in a silicon wet etching system?
Why is it important to use etch-resistant materials in a silicon wet etching system?
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What is the main disadvantage associated with silicon wet etching system cost?
What is the main disadvantage associated with silicon wet etching system cost?
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Which isotropic etchant is commonly used for Silicon in wet etching?
Which isotropic etchant is commonly used for Silicon in wet etching?
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What advantage does spray etching offer in terms of chemical usage compared to immersion techniques?
What advantage does spray etching offer in terms of chemical usage compared to immersion techniques?
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Study Notes
Dry Etching
- Ion beam etching utilizes neutrally-charged, high-energy ions for etching.
- Dry etching has better process control than wet etching due to its ability to control the energy, direction, and species of the etching species.
- Dry etching is more precise than wet etching because it allows for more control over the shape and size of the etched features.
- Plasma is the state of matter that plasma consists of.
- Plasma radiation damage is associated with damage to the substrate during etching, which can affect the performance of the device.
- Directional etching is achieved with dry etching without relying on the crystal orientation of Silicon.
Wet Etching
- Wet etching uses liquid chemicals to remove material from a substrate.
- Undercutting is a notable disadvantage of wet etching because it can lead to unwanted etching of features that are not intended to be etched.
- Etch rate is a factor that affects the etch rate in dry etching processes.
- Isotropic etching is a common characteristic of wet etching, meaning that the etch rate is the same in all directions.
- Spray etching uses less chemicals than immersion techniques.
- Safety is a significant advantage of dry etching, as it does not involve the use of hazardous chemicals.
- Etch-resistant materials are crucial in silicon wet etching systems to protect specific areas of the substrate from being etched.
- Silicon wet etching systems are known for their cost, which can be a significant disadvantage.
- HF (Hydrofluoric acid) is a commonly used isotropic etchant for Silicon in wet etching.
- DI water is sprayed onto the surface of the etched film after using etchants to remove any residual etchants and improve surface cleanliness.
- Reduced processing time is not an advantage of spray etching over immersion technique.
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Description
Test your knowledge on the advantages and disadvantages of dry etching, a process that eliminates handling of dangerous acids and solvents, uses small amounts of chemicals, and provides high resolution and cleanliness. Explore concepts like isotropic and anisotropic etch profiles, directional etching, and more.